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Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F26B-003/00
  • F26B-005/00
  • H01L-033/00
출원번호 US-0960677 (2001-09-21)
발명자 / 주소
  • Michael L. Boroson
  • John Schmittendorf
  • Peter G. Bessey
  • Jeffrey P. Serbicki
출원인 / 주소
  • Eastman Kodak Company
대리인 / 주소
    Raymond L. Owens
인용정보 피인용 횟수 : 45  인용 특허 : 14

초록 ▼

A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete se

대표청구항 ▼

1. A highly moisture-sensitive electronic device element having highly moisture-sensitive electronic devices comprising:a) a substrate containing two or more highly moisture-sensitive electronic devices; b) an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devi

이 특허에 인용된 특허 (14)

  1. Booe ; James M., Desiccant for electrical and electronic devices.
    상세보기
  2. Boroson Michael L. ; Serbicki Jeffrey P. ; Bessey Peter G., Desiccation of moisture-sensitive electronic devices.
    상세보기
  3. Inohara Akio (Osaka JPX) Sawae Kiyoshi (Nara JPX) Kawaguchi Masashi (Nara JPX) Isaka Kinichi (Tenri JPX), Glass sealed thin-film electroluminescent display panel free of moisture and the fabrication method thereof.
    상세보기
  4. Glenn Thomas P. ; Hollaway Roy D.,PHX ; Panczak Anthony E., Integrated circuit package having adhesive bead supporting planar lid above planar substrate.
    상세보기
  5. Shores A. Andrew (212 Carroll Canal Venice CA 90291), Method of providing moisture-free enclosure for electronic device.
    상세보기
  6. Shores A. Andrew (212 Carroll Canal Venice CA 90291), Moisture and particle getter for enclosures.
    상세보기
  7. Shores A. Andrew (Venice CA), Moisture getting composition for hermetic microelectronic devices.
    상세보기
  8. Ebisawa Akira,JPX ; Onitsuka Osamu,JPX ; Endo Hiroyuki,JPX ; Kawashima Masayuki,JPX ; Hayakawa Toshio,JPX, Organic EL display assembly.
    상세보기
  9. Kawami Shin,JPX ; Nakada Hitoshi,JPX ; Naito Takemi,JPX, Organic EL element.
    상세보기
  10. Yasukawa Kouji,JPX ; Endo Hiroyuki,JPX ; Kato Hideo,JPX ; Shimamura Junichi,JPX ; Onitsuka Osamu,JPX ; Ebisawa Akira,JPX, Organic electroluminescent device.
    상세보기
  11. Harvey ; III Thomas B. ; So Franky, Passivation of organic devices.
    상세보기
  12. Kawai Hisao (Yamanashi JPX), Thin film EL element.
    상세보기
  13. Yamashita Takuo (Tenri JPX) Yoshida Masaru (Nara JPX) Nakajima Shigeo (Nara JPX) Uno Keiichi (Otsu JPX) Murakami Yoshiki (Otsu JPX), Thin film electroluminescent (EL) panel.
    상세보기
  14. Taniguchi Kouji (Nara JPX) Nakajima Shigeo (Nara JPX) Yoshida Masaru (Nara JPX), Thin-film electroluminescence device for displaying multiple colors with groove for capturing adhesive.
    상세보기

이 특허를 인용한 특허 (45)

  1. Lamberson, Lisa A.; Morena, Robert M., Antimony-free glass, antimony-free frit and a glass package that is hermetically sealed with the frit.
    상세보기
  2. Lamberson, Lisa A.; Morena, Robert M., Antimony-free glass, antimony-free frit and a glass package that is hermetically sealed with the frit.
    상세보기
  3. Boroson,Michael L., Desiccant for top-emitting OLED.
    상세보기
  4. Boroson, Michael L.; Serbicki, Jeffrey P.; Bessey, Peter G.; Irvin, Glen C.; Rowley, Lawrence A.; Kaminsky, Cheryl J., Desiccants and desiccant packages for highly moisture-sensitive electronic devices.
    상세보기
  5. Allemand, Pierre-Marc, Devices including, methods using, and compositions of reflowable getters.
    상세보기
  6. Allemand, Pierre-Marc, Devices including, methods using, and compositions of reflowable getters.
    상세보기
  7. Allemand, Pierre-Marc, Devices including, methods using, and compositions of reflowable getters.
    상세보기
  8. Allemand, Pierre-Marc, Devices including, methods using, and compositions of reflowable getters.
    상세보기
  9. Allemand, Pierre-Marc, Devices including, methods using, and compositions of reflowable getters.
    상세보기
  10. Fery,Christophe; Haas,Gunther, Encapsulation of "top-emitting" OLED panels.
    상세보기
  11. Pichler,Karl, Encapsulation of thin-film electronic devices.
    상세보기
  12. Bettinelli,Armand, Glass lid, and package provided with such a lid, for the encapsulation of electronic components.
    상세보기
  13. Aitken, Bruce G.; Carberry, Joel P.; DeMartino, Steven E.; Hagy, Henry E.; Lamberson, Lisa A.; Miller, II, Richard J.; Morena, Robert; Schroeder, III, Joseph F.; Streltsov, Alexander; Widjaja, Sujanto, Glass package that is hermetically sealed with a frit and method of fabrication.
    상세보기
  14. Aitken, Bruce G.; Carberry, Joel P.; DeMartino, Steven E.; Hagy, Henry E.; Lamberson, Lisa A.; Miller, II, Richard J.; Morena, Robert; Schroeder, III, Joseph F.; Streltsov, Alexander; Widjaja, Sujanto, Glass package that is hermetically sealed with a frit and method of fabrication.
    상세보기
  15. Aitken,Bruce G.; Carberry,Joel P.; DeMartino,Steven E.; Hagy,Henry E.; Lamberson,Lisa A.; Miller, II,Richard J.; Morena,Robert; Schroeder, III,Joseph F.; Streltsov,Alexander; Widjaja,Sujanto, Glass package that is hermetically sealed with a frit and method of fabrication.
    상세보기
  16. Aitken,Bruce G.; Carberry,Joel P.; DeMartino,Steven E.; Hagy,Henry E.; Lamberson,Lisa A.; Miller, II,Richard J.; Morena,Robert; Schroeder, III,Joseph F.; Streltsov,Alexander; Widjaja,Sujanto, Glass package that is hermetically sealed with a frit and method of fabrication.
    상세보기
  17. Hawtof,Daniel W.; Reddy,Kamjula Pattabhirami; Stone, III,John, Hermetically sealed package and method of fabricating of a hermetically sealed package.
    상세보기
  18. Boroson, Michael L.; Schmittendorf, John; Serbicki, Jeffrey P., Highly moisture-sensitive electronic device element and method for fabrication.
    상세보기
  19. Nishido, Yusuke; Yamazaki, Shunpei, Light-emitting device, electronic device, lighting device, and method for manufacturing the light-emitting device.
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  20. Rohatgi, Rajeev, Local seal for encapsulation of electro-optical element on a flexible substrate.
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  21. Rohatgi, Rajeev, Local seal for encapsulation of electro-optical element on a flexible substrate.
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  22. Rohatgi, Rajeev, Local seal for encapsulation of electro-optical element on a flexible substrate.
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  23. Rohatgi, Rajeev, Local seal for encapsulation of electro-optical element on a flexible substrate.
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  24. Rohatgi, Rajeev, Local seals for encapsulation above and below electro-optical element on a substrate.
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  25. Haase Pastel, Michelle Nicole; Strines, Brian Paul, Mask and method for sealing a glass envelope.
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  26. Pastel, Michelle Nicole Haase; Strines, Brian Paul, Mask and method for sealing a glass envelope.
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  27. Lee, David, Method and apparatus for a lead-frame air-cavity package.
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  28. Becken, Keith James; Logunov, Stephan Lvovich, Method of encapsulating a display element with frit wall and laser beam.
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  29. Park,Jin Woo; Choi,Dong Soo; Song,Seung Yong, Method of manufacturing flat panel display device, flat panel display device, and panel of flat panel display device.
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  30. Schaper,Leonard W.; Malshe,Ajay P.; O'Neal,Chad, Method of packaging RF MEMS.
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  31. Chen, Chien Hua; Haluzak, Charles C.; Michael, Donald, Methods for hermetic sealing of post media-filled MEMS package.
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  32. Dan, Budhadipta; Coe-Sullivan, Seth, Methods for making optical components, optical components, and products including same.
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  33. Chen,Chien Hua; Craig,David M.; Haluzak,Charles C., Micro-optoelectromechanical system packages for a light modulator and methods of making the same.
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  34. Gogoi,Bishnu P., Multiple microelectromechanical (MEM) devices formed on a single substrate and sealed at different pressures and method therefor.
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  35. Lin, Chih-Pin, OLED package and packaging method thereof.
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  36. Qian, Jiajia; Liu, Yawei, OLED package structure and OLED packaging method.
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  37. Low, Hong Yee; Chua, Soo Jin; Guenther, Ewald Karl Michael, Oled packaging.
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  38. Yuasa, Hiroshi, Organic light-emitting device and method of manufacturing the same.
    상세보기
  39. Cheung, Kin P., Processes for hermetically packaging wafer level microscopic structures.
    상세보기
  40. Booth, Jr.,Lawrence A.; Sundahl,Robert C., Sealing organic light emitting device displays.
    상세보기
  41. Chen, Lung-Tai; Hsu, Yu-Wen; Ho, Tzong-Che; Pan, Li-Chi, Sensing device and manufacturing method thereof.
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  42. Haluzak,Charles C; Piehl,Arthur; Chen,Chien Hua; Shih,Jennifer, System and method for direct-bonding of substrates.
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  43. Kim,Gi Heon; Oh,Ji Young; Yang,Yong Suk; Lee,Jeong Ik; Do,Lee Mi; Zyung,Tae Hyoung, Thin film material using pentaerythritol acrylate for encapsulation of organic or polymeric light emitting device, and encapsulation method for LED using the same.
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  44. Chen, Chien-Hua; Geissler, Steven R., Wafer packaging and singulation method.
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  45. Geefay, Frank S; Gan, Qing; Mattos, Ann; Figueredo, Domingo A, Wafer-level package with silicon gasket.
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