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특허 상세정보

Solid-state imaging device and method of production of the same

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01L-021/00   
미국특허분류(USC) 438/064
출원번호 US-0886990 (2001-06-25)
우선권정보 JP-0190576 (2000-06-26); JP-0190577 (2000-06-26)
발명자 / 주소
  • Jun Andoh JP
  • Yoshihiro Morii JP
  • Toshio Kobayashi JP
  • Akio Yashiba JP
  • Hiroshi Takemoto JP
  • Takeshi Sano JP
  • Tsutomu Sakatsu JP
출원인 / 주소
  • Ricoh Company, Ltd. JP
대리인 / 주소
    Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
인용정보 피인용 횟수 : 80  인용 특허 : 9
초록

In a solid-state imaging device and its production method according to the present invention, a solid-state image sensor has an effective light-receiving region on a circuit formation surface provided in a face-down condition. A transparent substrate has a conductor pattern provided thereon to confront the circuit formation surface of the image sensor. A transparent adhesive agent is provided between the image sensor and the substrate and formed into a thin layer, the adhesive agent covering the light-receiving region of the image sensor. A plurality of ...

대표
청구항

1. A method of production of a solid-state imaging device, comprising the steps ofproviding a solid-state image sensor having an effective light-receiving region on a circuit formation surface provided in a face-down condition; providing a transparent substrate having a conductor pattern provided thereon to confront the circuit formation surface of the image sensor; providing a plurality of bumps on one of the image sensor and the substrate; supplying a predetermined amount of a transparent adhesive agent between the image sensor and the substrate, the a...

이 특허를 인용한 특허 (80)

  1. Yoshida,Yoshihiro; Sano,Takeshi; Ohkura,Hideaki; Kobayashi,Hirofumi, Apparatus and method for formation of a wiring pattern on a substrate, and electronic devices and producing methods thereof.
  2. Sano,Takeshi; Yoshida,Yoshihiro; Ohkura,Hideaki; Kobayashi,Hirofumi, Bonded structure using conductive adhesives, and a manufacturing method thereof.
  3. Grebet, Jean-Michel; Lim, Wee Chin Judy, Chip scale package camera module with glass interposer having lateral conductive traces between a first and second glass layer and method for making the same.
  4. Haba, Belgacem; Honer, Kenneth Allen; Tuckerman, David B.; Oganesian, Vage, Chips having rear contacts connected by through vias to front contacts.
  5. Haba, Belgacem; Honer, Kenneth Allen; Tuckerman, David B.; Oganesian, Vage, Chips having rear contacts connected by through vias to front contacts.
  6. Haba, Belgacem; Honer, Kenneth Allen; Tuckerman, David B.; Oganesian, Vage, Chips having rear contacts connected by through vias to front contacts.
  7. Oganesian, Vage; Haba, Belgacem; Mohammed, Ilyas; Savalia, Piyush; Mitchell, Craig, Compliant interconnects in wafers.
  8. Oganesian, Vage; Haba, Belgacem; Mohammed, Ilyas; Savalia, Piyush; Mitchell, Craig, Compliant interconnects in wafers.
  9. Oganesian, Vage; Haba, Belgacem; Mohammed, Ilyas; Savalia, Piyush; Mitchell, Craig, Compliant interconnects in wafers.
  10. Haba, Belgacem, Conductive pads defined by embedded traces.
  11. Haba, Belgacem, Conductive pads defined by embedded traces.
  12. Haba, Belgacem; Oganesian, Vage, Edge connect wafer level stacking.
  13. Haba, Belgacem; Oganesian, Vage, Edge connect wafer level stacking.
  14. Haba, Belgacem; Oganesian, Vage, Edge connect wafer level stacking.
  15. Haba, Belgacem; Oganesian, Vage, Edge connect wafer level stacking.
  16. Haba, Belgacem; Oganesian, Vage, Edge connect wafer level stacking.
  17. Haba, Belgacem; Oganesian, Vage, Edge connect wafer level stacking with leads extending along edges.
  18. Sano, Takeshi; Kobayashi, Hirofumi; Ohkura, Hideaki, Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin.
  19. Tsuyuki,Tatsuya, Fixing structure for solid state image forming device, image data input unit and image data input apparatus including the same.
  20. Lu, Yin-Dong, Image capturing device and assembling method thereof.
  21. Nakajima, Mitsuru; Takemoto, Hiroshi; Sasaki, Norihiko; Andou, Yasuhiko; Kanatani, Shinobu; Yoshida, Hayato; Shimizu, Kohei, Image pickup apparatus, on-vehicle image pickup apparatus, method and apparatus for manufacturing image pickup apparatus.
  22. Fujimori, Noriyuki; Igarashi, Takatoshi; Yoshida, Kazuhiro, Image pickup apparatus, semiconductor apparatus, and image pickup unit.
  23. Schiefer, Eugene C., Imager cover-glass mounting.
  24. Bendall, Clark A., Inspection apparatus method and apparatus comprising motion responsive control.
  25. Bendall, Clark A., Inspection apparatus method and apparatus comprising selective frame output.
  26. Bendall, Clark Alexander, Inspection apparatus method and apparatus comprising selective frame output.
  27. Murayama,Jin; Hagiwara,Tatsuya; Yamada,Tetsuo, Linear image sensor chip and linear image sensor.
  28. Tiao,Kuo Tung, Method for packaging chip and package assembly produced thereby.
  29. Haba, Belgacem; Mohammed, Ilyas, Method of fabricating stacked assembly including plurality of stacked microelectronic elements.
  30. Haba, Belgacem, Method of fabricating stacked packages with bridging traces.
  31. Haba, Belgacem; Oganesian, Vage, Method of making a stacked microelectronic package.
  32. Haba, Belgacem; Oganesian, Vage, Method of making a stacked microelectronic package.
  33. Oganesian, Vage; Haba, Belgacem; Mitchell, Craig; Mohammed, Ilyas; Savalia, Piyush, Methods of forming semiconductor elements using micro-abrasive particle stream.
  34. Oganesian, Vage; Mohammed, Ilyas; Mitchell, Craig; Haba, Belgacem; Savalia, Piyush, Microelectronic elements having metallic pads overlying vias.
  35. Oganesian, Vage; Haba, Belgacem; Mohammed, Ilyas; Mitchell, Craig; Savalia, Piyush, Microelectronic elements with rear contacts connected with via first or via middle structures.
  36. Andoh, Fumikata; Takemoto, Hiroshi; Yoshida, Jun; Arima, Masatoshi; Sato, Norio; Usui, Seiji, Mirror and optical scanning device.
  37. Oganesian, Vage; Haba, Belgacem; Mohammed, Ilyas; Mitchell, Craig; Savalia, Piyush, Multi-function and shielded 3D interconnects.
  38. Oganesian, Vage; Haba, Belgacem; Mohammed, Ilyas; Mitchell, Craig; Savalia, Piyush, Multi-function and shielded 3D interconnects.
  39. Oganesian, Vage; Haba, Belgacem; Mohammed, Ilyas; Mitchell, Craig; Savalia, Piyush, Multi-function and shielded 3D interconnects.
  40. Haba, Belgacem; Mohammed, Ilyas; Oganesian, Vage; Ovrutsky, David; Mirkarimi, Laura Wills, Off-chip VIAS in stacked chips.
  41. Haba, Belgacem; Mohammed, Ilyas; Oganesian, Vage; Ovrutsky, David; Mirkarimi, Laura, Off-chip vias in stacked chips.
  42. Haba, Belgacem; Mohammed, Ilyas; Oganesian, Vage; Ovrutsky, David; Mirkarimi, Laura Wills, Off-chip vias in stacked chips.
  43. Haba, Belgacem; Mohammed, Ilyas; Oganesian, Vage; Ovrutsky, David; Mirkarimi, Laura Wills, Off-chip vias in stacked chips.
  44. Kinoshita, Kazuo, Optical module and method for manufacturing optical module.
  45. Okuwaki, Hiroyuki; Naoe, Yasuhiro; Hirai, Ryouji; Ozaki, Shinichi; Ando, Jun, Optical scanner and image forming apparatus.
  46. Prior, Christophe, Optical semiconductor device and method of manufacture.
  47. Liu,Shuan Ta, Optoelectronics processing module and method for manufacturing thereof.
  48. Grinman, Andrey; Ovrutsky, David; Rosenstein, Charles; Haba, Belgacem; Oganesian, Vage, Packaged semiconductor chips.
  49. Grinman, Andrey; Ovrutsky, David; Rosenstein, Charles; Oganesian, Vage, Packaged semiconductor chips with array.
  50. Grinman, Andrey; Ovrutsky, David; Rosenstein, Charles; Oganesian, Vage, Packaged semiconductor chips with array.
  51. Grinman, Andrey; Ovrutsky, David; Rosenstein, Charles; Oganesian, Vage, Packaged semiconductor chips with array.
  52. Haba, Belgacem; Humpston, Giles; Ovrutsky, David; Mirkarimi, Laura, Reconstituted wafer stack packaging with after-applied pad extensions.
  53. Haba, Belgacem; Humpston, Giles; Ovrutsky, David; Mirkarimi, Laura Wills, Reconstituted wafer stack packaging with after-applied pad extensions.
  54. Morii, Yoshihiro; Souma, Satosu, Recycling apparatus, recycling method, and recycled product.
  55. Morii,Yoshihiro, Recycling method.
  56. Nakajima, Mitsuru, Semiconductor device, image scanning unit including the semiconductor device, and image forming apparatus including the image scanning unit.
  57. Haba, Belgacem; Humpston, Giles; Margalit, Moti, Semiconductor packaging process using through silicon vias.
  58. Haba, Belgacem; Humpston, Giles; Margalit, Moti, Semiconductor packaging process using through silicon vias.
  59. Nakamura,Tsutomu; Hosokai,Shigeru; Miyata,Kenji, Solid-state image pickup apparatus having a hermetic seal portion and fabricating method thereof.
  60. Nakamura, Masao; Doi, Kazumasa; Shidahara, Kouji, Solid-state imaging device, method for producing same, and mask.
  61. Kierse, Oliver; O'Dowd, John; Wynne, John; Hunt, William; Hynes, Eamon; Meehan, Peter, Spaced, bumped component structure.
  62. Farnworth, Warren M.; Wood, Alan G.; Wark, James M.; Hembree, David R.; Lake, Rickie C., Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers.
  63. Farnworth,Warren M.; Wood,Alan G.; Wark,James M.; Hembree,David R.; Lake,Rickie C., Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers.
  64. Avsian, Osher; Grinman, Andrey; Humpston, Giles; Margalit, Moti, Stack packages using reconstituted wafers.
  65. Haba, Belgacem; Mohammed, Ilyas, Stacked assembly including plurality of stacked microelectronic elements.
  66. Kriman, Moshe; Avsian, Osher; Haba, Belgacem; Humpston, Giles; Burshtyn, Dmitri, Stacked microelectronic assemblies having vias extending through bond pads.
  67. Haba, Belgacem; Oganesian, Vage; Mohammed, Ilyas; Savalia, Piyush; Mitchell, Craig, Stacked microelectronic assembly having interposer connecting active chips.
  68. Oganesian, Vage; Haba, Belgacem; Mohammed, Ilyas; Mitchell, Craig; Savalia, Piyush, Stacked microelectronic assembly with TSVS formed in stages and carrier above chip.
  69. Oganesian, Vage; Haba, Belgacem; Mohammed, Ilyas; Mitchell, Craig; Savalia, Piyush, Stacked microelectronic assembly with TSVS formed in stages and carrier above chip.
  70. Oganesian, Vage; Haba, Belgacem; Mohammed, Ilyas; Mitchell, Craig; Savalia, Piyush, Stacked microelectronic assembly with TSVS formed in stages with plural active chips.
  71. Oganesian, Vage; Haba, Belgacem; Mohammed, Ilyas; Mitchell, Craig; Savalia, Piyush, Stacked microelectronic assembly with TSVs formed in stages with plural active chips.
  72. Oganesian, Vage; Haba, Belgacem; Mohammed, Ilyas; Mitchell, Craig; Savalia, Piyush, Stacked microelectronic assembly with TSVs formed in stages with plural active chips.
  73. Oganesian, Vage; Haba, Belgacem; Mohammed, Ilyas; Mitchell, Craig; Savalia, Piyush, Stacked microelectronic assemby with TSVS formed in stages and carrier above chip.
  74. Oganesian, Vage; Haba, Belgacem; Mohammed, Ilyas; Mitchell, Craig; Savalia, Piyush, Staged via formation from both sides of chip.
  75. Oganesian, Vage; Haba, Belgacem; Mohammed, Ilyas; Mitchell, Craig; Savalia, Piyush, Staged via formation from both sides of chip.
  76. Oganesian, Vage; Haba, Belgacem; Mohammed, Ilyas; Mitchell, Craig; Savalia, Piyush, Staged via formation from both sides of chip.
  77. Andoh, Jun; Tsuyuki, Tatsuya, Supporting structure for a solid state image sensing device.
  78. Chua, Swee Kwang, Thin semiconductor die packages and associated systems and methods.
  79. Morii,Yoshihiro; Souma,Satosu; Kishi,Hiroyuki; Torii,Kazuma; Matsuura,Hiroyuki, Toner recycling method and toner recycling system.
  80. Haba, Belgacem; Mohammed, Ilyas; Mirkarimi, Laura; Kriman, Moshe, Wafer level edge stacking.