초록 ▼

A molding machine for encapsulating electronic devices mounted on one side of a substrate, and having a ball-grid array, pin-grid array, or land-grid array on the opposite side, has a two member biased floating plate apparatus to compensate for variations in substrate thickness, and a gas collection

A molding machine for encapsulating electronic devices mounted on one side of a substrate, and having a ball-grid array, pin-grid array, or land-grid array on the opposite side, has a two member biased floating plate apparatus to compensate for variations in substrate thickness, and a gas collection/venting apparatus for relieving gases emitted from the non-encapsulated underside of the substrate.

대표청구항 ▼

1. An encapsulation method in a molding machine for an electronic device mounted on a first side of a planar substrate comprising:providing an upper mold plate having a cavity therein and at least one clamping ridge located thereon and a lower mold plate having a cavity therein and at least one clam

1. An encapsulation method in a molding machine for an electronic device mounted on a first side of a planar substrate comprising:providing an upper mold plate having a cavity therein and at least one clamping ridge located thereon and a lower mold plate having a cavity therein and at least one clamping ridge located thereon; providing apparatus for exerting a force; providing a biased floating plate apparatus for providing adjustable compensation for substrates of varying thicknesses, said biased floating plate apparatus having a plurality of spring members; mating said upper mold plate and said lower mold plate for enclosing said electronic device and at least a portion of said planar substrate; clamping said at least a portion of said planar substrate between said upper mold plate and said lower mold plate using said at least one clamping ridge of said upper mold plate for contacting a portion of said planar substrate and using said at least one clamping ridge of said lower mold plate for contacting a portion of said planar substrate; compressing said upper mold plate and said lower mold plate for sealably contacting portions of said planar substrate therebetween using said apparatus for exerting said force; compensating for differing thicknesses of said planar substrate using said biased floating plate apparatus for providing adjustable compensation for substrates of varying thicknesses; and injecting plastic material into said cavities of said upper mold plate and said lower mold plate.