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A semiconductor device in which a plurality of semiconductor chips are consolidated into one and which is provided with at least a set of rerouting wiring lines formed so as to interconnect electrodes of the respective semiconductor chips, the electrodes having a function which is common to the resp

A semiconductor device in which a plurality of semiconductor chips are consolidated into one and which is provided with at least a set of rerouting wiring lines formed so as to interconnect electrodes of the respective semiconductor chips, the electrodes having a function which is common to the respective semiconductor chips, the set of rerouting wiring line having a common external connection terminal.

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1. A semiconductor device comprising a plurality of semiconductor chips consolidated into one, each semiconductor chip having formed on its surface electrodes, a first insulation film formed so as to expose the electrodes, patterned rerouting wiring lines formed on the first insulation film to be co

1. A semiconductor device comprising a plurality of semiconductor chips consolidated into one, each semiconductor chip having formed on its surface electrodes, a first insulation film formed so as to expose the electrodes, patterned rerouting wiring lines formed on the first insulation film to be connected to the electrodes, and a second insulation film formed to cover the first insulation film and the rerouting wiring lines in such a manner that a portion of the rerouting wiring line is exposed for connection with an external connection terminal, wherein the semiconductor device comprises at least a set of rerouting wiring lines formed so as to interconnect electrodes of the respective semiconductor chips, the electrodes having a function which is common to the respective semiconductor chips, the set of rerouting wiring line having a common external connection terminal.