$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Method of wafer smoothing for bonding using chemo-mechanical polishing (CMP) 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-001/00
출원번호 US-0675841 (2000-09-29)
발명자 / 주소
  • Donald F. Canaperi
  • Jack Oon Chu
  • Guy M. Cohen
  • Lijuan Huang
  • John Albrecht Ott
  • Michael F. Lofaro
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Scully, Scott, Murphy & Presser
인용정보 피인용 횟수 : 39  인용 특허 : 9

초록 ▼

A method and apparatus is described incorporating a semiconductor substrate, a CMP tool, a brush cleaning tool, and a chemical wafer cleaning tool. The CMP is performed with a down force of 1 psi, a backside air pressure of 0.5 psi, a platen speed of 50 rpm, a crarrier speed of 30 rpm and a slurry f

대표청구항

1. An apparatus for polishing and smoothing a wafer surface suitable for performing wafer to wafer bonding comprising:a semiconductor substrate, a first layer of material formed on said substrate, a CMP tool, a brush cleaning tool, a chemical wafer cleaning tool, and a wafer bonding tool.

이 특허에 인용된 특허 (9)

  1. Nakashiba Masamichi,JPX ; Kimura Norio,JPX ; Watanabe Isamu,JPX ; Yoshida Kaori,JPX, Apparatus for and method for polishing workpiece.
    상세보기
  2. Shamouilian Sam ; Shendon Norm, Carrier head with a layer of conformable material for a chemical mechanical polishing system.
    상세보기
  3. Chen Lai-Juh,TWX, Chemical-mechanical polish (CMP) pad conditioner.
    상세보기
  4. Fitzgerald Eugene A., Controlling threading dislocation densities in Ge on Si using graded GeSi layers and planarization.
    상세보기
  5. Mack Kenneth D., Method and apparatus for chemical-mechanical polishing.
    상세보기
  6. Koos Daniel A. ; Kim Sung C. ; Sandhu Gurtej S., Method of chemical mechanical polishing.
    상세보기
  7. Sadana Devendra Kumar ; Holland Orin Wayne, Method of forming buried oxide layers in silicon.
    상세보기
  8. Bruel Michel (Veurey FRX), Process for the production of thin semiconductor material films.
    상세보기
  9. Chamberlin Timothy S. ; Miller Matthew K. ; Walton Erick G., Slurry injection technique for chemical-mechanical polishing.
    상세보기

이 특허를 인용한 특허 (39)

  1. Gaudin, Gweltaz, 3D integrated heterostructures having low-temperature bonded interfaces with high bonding energy.
    상세보기
  2. Dinh-Ngoc, Charles; Ramanath, Srinivasan; Schulz, Eric M.; Wu, Jianhui; Puthanangady, Thomas; Vedantham, Ramanujam; Hwang, Taewook, Abrasive tool for use as a chemical mechanical planarization pad conditioner.
    상세보기
  3. Wu, Jianhui; Hall, Richard W. J.; Schulz, Eric M.; Ramanath, Srinivasan, Chemical mechanical polishing conditioner.
    상세보기
  4. Currie,Matthew T., Control of strain in device layers by prevention of relaxation.
    상세보기
  5. Currie,Matthew T., Control of strain in device layers by selective relaxation.
    상세보기
  6. Fitzgerald, Eugene A.; Pitera, Arthuer J., Coplanar integration of lattice-mismatched semiconductor with silicon via wafer bonding virtual substrates.
    상세보기
  7. Wu, Jianhui; Hwang, Taewook; Vedantham, Ramanujam; Dinh-Ngoc, Charles; Puthanangady, Thomas K.; Schulz, Eric M.; Ramanath, Srinivasan, Corrosion-resistant CMP conditioning tools and methods for making and using same.
    상세보기
  8. Wu,Kenneth C.; Fitzgerald,Eugene A.; Taraschi,Gianni; Borenstein,Jeffrey T., Etch stop layer system.
    상세보기
  9. Currie, Matthew T., Hybrid fin field-effect transistor structures and related methods.
    상세보기
  10. Gaudin, Gweltaz, Low-temperature bonding process.
    상세보기
  11. Maekawa, Kazuyoshi, Manufacturing method of back illumination CMOS image sensor device using wafer bonding.
    상세보기
  12. Maekawa, Kazuyoshi, Manufacturing method of back illumination CMOS image sensor device using wafer bonding.
    상세보기
  13. Ohnuma, Hideto; Shingu, Takashi; Kakehata, Tetsuya; Kuriki, Kazutaka; Yamazaki, Shunpei, Method for manufacturing SOI substrate.
    상세보기
  14. Akimoto, Kengo; Endo, Yuta, Method for manufacturing SOI substrate and method for manufacturing semiconductor device.
    상세보기
  15. Schwandner, Juergen; Koppert, Roland, Method for polishing a semiconductor wafer with a strained-relaxed Si1−xGex layer.
    상세보기
  16. Cheng,Zhiyuan; Fitzgerald,Eugene A.; Antoniadis,Dimitri A., Method of fabricating a semiconductor structure that includes transferring one or more material layers to a substrate and smoothing an exposed surface of at least one of the material layers.
    상세보기
  17. Jiang, Li; Li, Mingqi, Method of manufacturing a semiconductor device.
    상세보기
  18. Fitzgerald,Eugene; Currie,Matthew, Methods for fabricating strained layers on semiconductor substrates.
    상세보기
  19. Langdo, Thomas A.; Currie, Matthew T.; Hammond, Richard; Lochtefeld, Anthony J.; Fitzgerald, Eugene A., Methods for forming III-V semiconductor device structures.
    상세보기
  20. Langdo, Thomas A.; Currie, Matthew T.; Hammond, Richard; Lochtefeld, Anthony J.; Fitzgerald, Eugene A., Methods for forming strained-semiconductor-on-insulator device structures by mechanically inducing strain.
    상세보기
  21. Langdo,Thomas A.; Currie,Matthew T.; Hammond,Richard; Lochtefeld,Anthony J.; Fitzgerald,Eugene A., Methods for forming strained-semiconductor-on-insulator device structures by use of cleave planes.
    상세보기
  22. Currie,Matthew T., Methods of forming hybrid fin field-effect transistor structures.
    상세보기
  23. Langdo, Thomas A.; Currie, Matthew T.; Hammond, Richard; Lochtefeld, Anthony J.; Fitzgerald, Eugene A., Methods of forming strained-semiconductor-on-insulator device structures.
    상세보기
  24. Lochtefeld,Anthony J.; Langdo,Thomas A.; Hammond,Richard; Currie,Matthew T.; Braithwaite,Glyn; Fitzgerald,Eugene A., Methods of forming strained-semiconductor-on-insulator finFET device structures.
    상세보기
  25. Martinez, Muriel; Metral, Frédéric; Reynaud, Patrick; Chahra, Zohra, Planarization of a heteroepitaxial layer.
    상세보기
  26. Schwandner, Juergen; Koppert, Roland, Polishing pad and method for polishing a semiconductor wafer.
    상세보기
  27. Guiot, Eric; Lallement, Fabrice, Process for fabricating a substrate comprising a deposited buried oxide layer.
    상세보기
  28. Cheng, Zhi-Yuan; Fitzgerald, Eugene A.; Antoniadis, Dimitri A.; Hoyt, Judy L., Process for producing semiconductor article using graded epitaxial growth.
    상세보기
  29. Cheng, Zhiyuan; Fitzgerald, Eugene A.; Antoniadis, Dimitri A., Semiconductor device structure.
    상세보기
  30. Westhoff, Richard; Yang, Vicky K.; Currie, Matthew T.; Vineis, Christopher; Leitz, Christopher, Semiconductor heterostructures having reduced dislocation pile-ups and related methods.
    상세보기
  31. Langdo,Thomas A.; Currie,Matthew T.; Hammond,Richard; Lochtefeld,Anthony J.; Fitzgerald,Eugene A., Strained germanium-on-insulator device structures.
    상세보기
  32. Langdo,Thomas A.; Currie,Matthew T.; Hammond,Richard; Lochtefeld,Anthony J.; Fitzgerald,Eugene A., Strained-semiconductor-on-insulator device structures.
    상세보기
  33. Langdo,Thomas A.; Currie,Matthew T.; Hammond,Richard; Lochtefeld,Anthony J.; Fitzgerald,Eugene A., Strained-semiconductor-on-insulator device structures.
    상세보기
  34. Langdo,Thomas A.; Currie,Matthew T.; Hammond,Richard; Lochtefeld,Anthony J.; Fitzgerald,Eugene A., Strained-semiconductor-on-insulator device structures with elevated source/drain regions.
    상세보기
  35. Langdo,Thomas A.; Currie,Matthew T.; Braithwaite,Glyn; Hammond,Richard; Lochtefeld,Anthony J.; Fitzgerald,Eugene A., Strained-semiconductor-on-insulator finFET device structures.
    상세보기
  36. Cheng, Kangguo; Doris, Bruce B.; Hashemi, Pouya; Khakifirooz, Ali; Reznicek, Alexander, Type III-V and type IV semiconductor device formation.
    상세보기
  37. Cheng, Kangguo; Doris, Bruce B.; Hashemi, Pouya; Khakifirooz, Ali; Reznicek, Alexander, Type III-V and type IV semiconductor device formation.
    상세보기
  38. Yu,Lianzhong, Vibrating beam accelerometer.
    상세보기
  39. Yu, Lianzhong, Vibrating beam accelerometer two-wafer fabrication process.
    상세보기

관련 콘텐츠

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로