|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||204/164; 422/18604; 361/234; 279/128; 427/00214; 118/624; 118/DIG002|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 5 인용 특허 : 56|
AC waveforms biasing of bead transporter chucks and their accumulated charge sensing circuits tailored for low resistivity substrates and beads where if traditional DC quasi-static biasing potentials were used, the bead attraction potentials of the chuck would undergo rapid RC decay and cause the bead transporter chuck to stop working. Methods for selecting AC waveforms are given, including those that maximize the time average of the bead attraction potential at the bead collection zone of the bead contact surface.
1. A method for adhering charged grains to a bead collection zone on a bead contact surface comprising:(1) adhering a substrate to an electrostatic chuck, with the substrate arrayed over a grain-attracting electrode of the electrostatic chuck so that a surface of the substrate defines the bead contact surface; (2) applying an AC waveform potential to the grain-attracting electrode to create a grain attracting field, wherein the AC waveform potential comprises a grain-attracting potential pulse followed by a recovery period adapted to allow an effective g...