초록 ▼

The subject invention pertains to an aqueous primer for use on metal surfaces to which a composite or a metal adherend is bonded. The primer composition includes an aqueous dispersion of: (a) at least one thermosetting resin curable at an elevated temperature; (b) at least one organosilane, each sai

The subject invention pertains to an aqueous primer for use on metal surfaces to which a composite or a metal adherend is bonded. The primer composition includes an aqueous dispersion of: (a) at least one thermosetting resin curable at an elevated temperature; (b) at least one organosilane, each said organosilane containing at least ore hydrolyzable group; and (c) a curing agent. The aqueous primer composition contains substantially no volatile organic solvent, is environmentally superior to solvent-based primers, is storage stable, exhibits excellent solvent resistance and performs without loss of physical properties.

대표청구항 ▼

1. A primer composition for a metal surface comprising: an aqueous dispersion of(i) at least one thermosetting resin; (ii) at least one organosilane, each said organosilane containing at least one hydrolyzable group; and (iii) a curing agent solid at room temperature and active at a cure temperature

1. A primer composition for a metal surface comprising: an aqueous dispersion of(i) at least one thermosetting resin; (ii) at least one organosilane, each said organosilane containing at least one hydrolyzable group; and (iii) a curing agent solid at room temperature and active at a cure temperature between 60.degree. C. and 200.degree. C., said primer composition curing at the cure temperature to enhance the adhesion between said metal surface and a polymeric adhesive.