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|국가/구분||United States(US) Patent 등록|
|국제특허분류(IPC7판)||H01L-021/44 H01L-021/48 H01L-021/50|
|미국특허분류(USC)||438/116; 438/110; 438/123|
|발명자 / 주소||
|출원인 / 주소||
|대리인 / 주소||
|인용정보||피인용 횟수 : 3 인용 특허 : 21|
A semiconductor die carrier includes a housing that defines a cavity for holding one or more semiconductor dies, electrically conductive leads, and a cover plate having an aperture formed therethrough. The housing includes insulative side walls and a end plate joined to the side walls. The side walls and the end plate may be molded together as a one-piece unit. One or more of the side walls includes openings for receiving the leads so that an internal lead section extends within the cavity and an external lead section extends from the side walls external...
1. A method of manufacturing a semiconductor die package comprising the steps of:forming a package assembly including a plurality of electrically conductive leads and a housing defining a cavity for holding at least one semiconductor die, said housing including a plurality of insulative side walls, an internal side wall within said side walls, and an end plate joined to the side walls, each of said plurality of electrically conductive leads extending through at least first and second of said side walls such that an internal lead section extends within th...