초록 ▼

A heat sink used in an electronic assembly includes mounting surfaces on a first side of a base portion and extended heat dissipating surfaces (e.g., fins) extending from a second side of the base portion. One or more electronic component boards, such as printed wiring boards (PWBs), are mounted to

A heat sink used in an electronic assembly includes mounting surfaces on a first side of a base portion and extended heat dissipating surfaces (e.g., fins) extending from a second side of the base portion. One or more electronic component boards, such as printed wiring boards (PWBs), are mounted to the mounting surfaces on the heat sink at one or more levels. Some of the mounting surfaces can be formed on mounting ridges, which define channels. Ventilation apertures located between the fins extend through the base portion such that air is drawn through the channels and up through the apertures creating a "chimney" effect. The heat sink is also grounded to at least one of the PWBS and electrically isolated from the chassis. Isolator bushings can be mounted in one or more of the fins for receiving pins extending from the chassis to insure mechanical support and isolation/dampening and to insure electrical isolation from the chassis.

대표청구항 ▼

1. An electronic assembly comprising:a heat sink having a base portion with a plurality of mounting surfaces on a first side of said base portion, and extended heat dissipating surfaces extending from a second side of said base portion; at least one electronic component board mounted to said mountin

1. An electronic assembly comprising:a heat sink having a base portion with a plurality of mounting surfaces on a first side of said base portion, and extended heat dissipating surfaces extending from a second side of said base portion; at least one electronic component board mounted to said mounting surfaces, wherein said heat sink is grounded to said electronic component board; a chassis containing said heat sink and said electronic component board; at least one isolator bushing mounted to one of said extended heat dissipating surfaces; and at least one pin extending from said chassis into said isolator bushing for mechanically securing and isolating said heat sink, wherein said heat sink is electrically isolated from said chassis.