초록 ▼

A method for coating a surface of a substrate material, such as a semiconductor wafer. The method includes providing a host controller, providing a self-controlled treatment module, connecting the self-controlled treatment module to the host controller, issuing treatment instructions from the host c

A method for coating a surface of a substrate material, such as a semiconductor wafer. The method includes providing a host controller, providing a self-controlled treatment module, connecting the self-controlled treatment module to the host controller, issuing treatment instructions from the host controller to the self-controlled treatment module, receiving the treatment instruction from the host controller at the self-controlled treatment module, and controlling the treatment of the material with the self-controlled treatment module to maintain compliance with the treatment instruction.

대표청구항 ▼

1. A method of employing a host controller to control the treatment of a semiconductor wafer, comprising:connecting at least two self-controlled treatment modules to the host controller; placing a semiconductor wafer into one of said self-controlled treatment modules; issuing a treatment instruction

1. A method of employing a host controller to control the treatment of a semiconductor wafer, comprising:connecting at least two self-controlled treatment modules to the host controller; placing a semiconductor wafer into one of said self-controlled treatment modules; issuing a treatment instruction from the host controller to the self-controlled treatment module containing the semiconductor wafer; receiving the treatment instruction from the host controller at the self-controlled treatment module; and controlling the self-controlled treatment module containing the semiconductor wafer in conformance with the treatment instruction received from the host controller.