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Fabrication and bonding of copper sputter targets 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C22F-001/08
출원번호 US-0730349 (2000-12-05)
발명자 / 주소
  • Holger Koenigsmann
  • Alfred Snowman
  • Shailesh Kulkarni
출원인 / 주소
  • Praxair S.T. Technology, Inc.
대리인 / 주소
    Blake T. Biederman
인용정보 피인용 횟수 : 27  인용 특허 : 1

초록

The method is used to fabricate pure copper sputter targets. It includes first heating a copper billet to a temperature of at least 500.degree. C. The copper billet has a purity of at least 99.99 percent. Then warm working the copper billet applies at least 40 percent strain. Cold rolling the warm w

대표청구항

1. A method of fabricating copper sputter targets comprising the steps of:heating a copper billet to at least about 500.degree. C., the copper billet having a purity of at least 99.99 percent; warm working the heated copper billet to apply at least about 40 percent strain; cold rolling the warm work

이 특허에 인용된 특허 (1)

  1. Plewes John T. (Chatham NJ), Method for treating copper-based alloys and articles produced therefrom.

이 특허를 인용한 특허 (27)

  1. Lane, Michael; McFeely, Fenton Read; Murray, Conal; Rosenberg, Robert, Barrier material for copper structures.
  2. Nagano, Shozo; Hargarter, Hinrich; Li, Jianxing; Buehler, Jane, Conductive integrated circuit metal alloy interconnections, electroplating anodes; metal alloys for use as a conductive interconnection in an integrated circuit; and physical vapor deposition targets.
  3. Kardokus, Janine K.; Wu, Chi tse; Parfeniuk, Christopher L.; Buehler, Jane E., Copper sputtering target assembly and method of making same.
  4. Segal, Vladimir M.; Yi, Wuwen; Ferrasse, Stephane; Wu, Chi tse; Strothers, Susan D.; Alford, Frank A.; Willett, William B., Copper sputtering targets and methods of forming copper sputtering targets.
  5. Kardokus, Janine K.; Wu, Chi tse; Parfeniuk, Christopher L.; Buehler, Jane E., Copper-containing sputtering targets, and methods of forming copper-containing sputtering targets.
  6. Sarkar, Jaydeep; Gilman, Paul, Diffusion bonded high purity copper sputtering target assemblies.
  7. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
  8. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
  9. Miller, Steven A.; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom.
  10. Dary, Francois-Charles; Gaydos, Mark; Loewenthal, William; Miller, Steven A.; Rozak, Gary; Volchko, Scott Jeffrey; Zimmermann, Stefan; Stawovy, Michael Thomas, Large-area sputtering targets.
  11. Ohtani, Hisashi; Miyanaga, Akiharu; Teramoto, Satoshi; Yamazaki, Shunpei, Method for manufacturing semiconductor device.
  12. Nakamura, Osamu; Yamazaki, Shunpei; Dairiki, Koji; Kajiwara, Masayuki; Koezuka, Junichi; Murakami, Satoshi, Method of manufacturing semiconductor device.
  13. Nakamura,Osamu; Yamazaki,Shunpei; Dairiki,Koji; Kajiwara,Masayuki; Koezuka,Junichi; Murakami,Satoshi, Method of manufacturing semiconductor device.
  14. Yamazaki, Shunpei; Nakamura, Osamu; Kajiwara, Masayuki; Koezuka, Junichi, Method of manufacturing semiconductor device and semiconductor device.
  15. Yamazaki,Shunpei; Nakamura,Osamu; Kajiwara,Masayuki; Koezuka,Junichi, Method of manufacturing semiconductor device that includes selectively adding a noble gas element.
  16. Kardokus, Janine K.; Wu, Chi tse; Parfeniuk, Christopher L.; Buehler, Jane E., Methods of forming copper-containing sputtering targets.
  17. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
  18. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
  19. Volchko, Scott Jeffrey; Zimmermann, Stefan; Miller, Steven A.; Stawovy, Michael Thomas, Methods of manufacturing high-strength large-area sputtering targets.
  20. Loewenthal, William; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets.
  21. Miller, Steven A.; Dary, Francois-Charles; Gaydos, Mark; Rozak, Gary, Methods of manufacturing large-area sputtering targets by cold spray.
  22. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
  23. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
  24. Miller, Steven A.; Kumar, Prabhat; Wu, Rong-chein Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Methods of rejuvenating sputtering targets.
  25. Shekhter, Leonid N.; Miller, Steven A.; Haywiser, Leah F.; Wu, Rong-Chein R., Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof.
  26. Saito, Shin, Rotation anode X-ray tube.
  27. Ferrasse, Stephane; Hort, Werner H.; Kim, Jaeyeon; Alford, Frank C., Target designs and related methods for coupled target assemblies, methods of production and uses thereof.
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