초록 ▼

A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation i

A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.

대표청구항 ▼

1. An anode assembly which can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a workpiece comprising:a rotatable shaft disposed within a chamber in which the operation is performed and through which

1. An anode assembly which can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a workpiece comprising:a rotatable shaft disposed within a chamber in which the operation is performed and through which the solution can pass, an anode housing on said shaft, a porous plate which, together with said anode housing, defines an anode cavity within which there is an anode and from which the solution can be delivered through said porous plate to a surface of the workpiece, and solution delivery structure by which said solution can be delivered to said anode cavity, wherein said plate has a top surface adapted to support a pad which is to face the workpiece.