초록 ▼

A heat dissipation system and method for extracting heat from an integrated circuit device includes a thermally conductive post having substantially planar upper and lower surfaces, wherein the upper surface is disposed across from the lower surface, and wherein the lower surface is adapted to conta

A heat dissipation system and method for extracting heat from an integrated circuit device includes a thermally conductive post having substantially planar upper and lower surfaces, wherein the upper surface is disposed across from the lower surface, and wherein the lower surface is adapted to contact an integrated circuit device. A conductive heat exchange portion including an array of fins extends upwardly from the upper surface of the post where possible to allow components mounted on a printed circuit board to be positioned around the integrated circuit device. The heat exchange portion including the array has a chamber within to receive and house an air movement device so that the air introduced around the fins by the air movement device enhances the heat dissipation from the heat dissipation device.

대표청구항 ▼

1. A heat dissipation device for dissipating heat from an integrated circuit device mounted on a printed circuit board surrounded by other components, comprising:a thermally conductive post having substantially planar upper and lower surfaces, wherein the lower surface is adapted to contact the inte

1. A heat dissipation device for dissipating heat from an integrated circuit device mounted on a printed circuit board surrounded by other components, comprising:a thermally conductive post having substantially planar upper and lower surfaces, wherein the lower surface is adapted to contact the integrated circuit device; and a thermally conductive heat exchange portion extending upwardly from the upper surface of the post, the post and the heat exchange portion are constructed and arranged for coupling the post to the integrated circuit device such that the heat exchange portion, the post, and the integrated circuit device are in close proximity without interference with the components mounted on the printed circuit board, the heat exchange portion has a chamber within to house an air movement device constructed and arranged for circulating air over the fins to enhance the heat dissipation from the heat dissipation device.