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Heat dissipation structure for solid-state light emitting device package

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0102131 (2002-03-19)
발명자 / 주소
  • Jin-shown Shie TW
  • Chih-yuan Yen TW
  • Chien-chen Hung TW
  • Mei-hsueh Peng TW
출원인 / 주소
  • Opto Tech Corporation TW
대리인 / 주소
    Martine & Penilla, LLP
인용정보 피인용 횟수 : 184  인용 특허 : 4

초록

A light emitting diode (LED) includes a heat dissipation structure characterized by having a heat dissipating fluidic coolant filled in a hermetically sealed housing where at least one LED chip mounted on a metallic substrate is dwelled inside. The heat dissipation structure is configured with a met

대표청구항

1. A heat dissipation structure for a light emitting device comprising:a metallic substrate having a top surface and a bottom surface, the top surface configured with a cup-shaped portion for the light emitting device being mounted therein and the bottom surface opposite to the top surface including

이 특허에 인용된 특허 (4)

  1. Chen Der-Jong (8 ; Alley 16 ; Lane 37 ; Tatung Rd. Sec. 1. Hsi-Chih Town ; Taipei Hsien TWX), Light emitting diode display with PCB base.
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