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Method of transferring substrates with two different substrate holding end effectors

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B66C-023/00
출원번호 US-0044820 (1998-03-20)
발명자 / 주소
  • Christopher A. Hofmeister
출원인 / 주소
  • Brooks Automation Inc.
대리인 / 주소
    Perman & Green, LLP
인용정보 피인용 횟수 : 44  인용 특허 : 22

초록

A method of transferring semi-conductor substrates from a first location to a second location. The first and second locations are adapted to hold a plurality of the substrates in individual support area. The method comprises use of a transfer mechanism with two substrate holding end effectors which

대표청구항

1. A method of transferring semi-conductor substrates from a first location to a second location, the first and second locations being adapted to hold a plurality of the substrates in individual support areas, the method comprising steps of:providing a transfer mechanism with a first end effector an

이 특허에 인용된 특허 (22)

  1. Cruz Didier (Grenoble FRX), Apparatus for placing or storing flat articles in a cassette with intermediate racks.
  2. Uehara Akira (Yokohama JPX) Nakane Hisashi (Kawasaki JPX), Apparatus for the treatment of a wafer by plasma reaction.
  3. Davis James C. (Carlisle MA), Articulated arm transfer device.
  4. Hardegen E. Brian (Westford MA) Bottomley Todd E. (Swamzey NH) Davis ; Jr. James C. (Carlisle MA), Articulated arm transfer device.
  5. Hendrickson Ruth A. (Lincoln MA), Articulated arm transfer device.
  6. Hillman Gary (Livingston NJ) Devico Michael J. (Chatham NJ), Automated single cassette load mechanism for scrubber.
  7. Tateishi Hideki (Yokohama JPX) Shimizu Tamotsu (Yokohama JPX) Aiuchi Susumu (Yokohama JPX) Iwashita Katsuhiro (Yokohama JPX) Nakamura Hiroshi (Fuchu JPX), Continuous sputtering apparatus.
  8. Shiraiwa Hirotsugu (Hino JPX), Conveyor apparatus.
  9. Fujita ; Masahiko ; Gotoh ; Toshihiko ; Hagino ; Hiroshi, Electric motor having frequency generator.
  10. Yamamoto ; Shinichi ; Sumitomo ; Yasusuke ; Horiike ; Yasuhiro ; Shibag aki ; Masahiro, Etching apparatus using a plasma.
  11. Munakata Tadashi (Tokyo JPX), Industrial robot.
  12. Hashimoto Taisaku (Kashiwara JPX), Magnetic drive device.
  13. Murdoch Steven (Palo Alto CA), Method and apparatus for handling semiconductor wafers.
  14. Maydan Dan (Los Altos Hills CA) Somekh Sasson (Redwood City CA) Wang David N. (Cupertino CA) Cheng David (San Jose CA) Toshima Masato (San Jose CA) Harari Isaac (Mountain View CA) Hoppe Peter D. (Sun, Multi-chamber integrated process system.
  15. Maher, Jr., Joseph A.; Zafiropoulo, Arthur W., Multi-planar electrode plasma etching.
  16. Scott Joel E. (445 S. Palm Ave. ; Apt. 1 Sarasota FL 33577), Photograph logging apparatus and method.
  17. Grunes Howard (Santa Cruz CA) Tepman Avi (Cupertino CA) Lowrance Robert (Los Gatos CA), Robot assembly.
  18. Toyoda Kenichi (Hino JPX) Toril Nobutoshi (Hachioji JPX) Nihei Ryo (Musashino JPX) Terada Akihiro (Hino JPX), Structure of first arm of industrial robot having articulated horizontal arms.
  19. Ishida Toshimichi (Hirakata JPX) Suzuki Masaki (Hirakata JPX), Substrate transfer apparatus.
  20. Davis ; Jr. James C. (Carlisle MA) Hofmeister Christopher A. (Hampstead NH), Substrate transport apparatus with dual substrate holders.
  21. Mizukami Masami (Yamanashi JPX) Osada Hatsuo (Yamanashi JPX), Transfer apparatus.
  22. Turner Norman L. (Mountain View CA) White John M. (Hayward CA), Vacuum processing apparatus having improved throughput.

이 특허를 인용한 특허 (44)

  1. Woodruff, Daniel J.; Hanson, Kyle M.; Eudy, Steve L.; Weber, Curtis A.; Harris, Randy, Adaptable electrochemical processing chamber.
  2. Chen,Linlin; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Apparatus and method for electrochemically depositing metal on a semiconductor workpiece.
  3. Chen,Linlin; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Apparatus and method for electrochemically depositing metal on a semiconductor workpiece.
  4. Hanson,Kyle M., Apparatus and methods for electrochemical processing of microelectronic workpieces.
  5. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.
  6. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.
  7. Pfeiffer,Michael W.; Johnson,Eric D., Assembly station with rotatable turret which forms and unloads a completed stack of articles.
  8. Meulen, Peter van der, Batch substrate handling.
  9. van der Meulen, Peter, Batch wafer alignment.
  10. Hanson, Kyle M.; Klocke, John L., Chambers, systems, and methods for electrochemically processing microfeature workpieces.
  11. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.
  12. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.
  13. Iljima, Kiyohito; Kaise, Seiichi; Takahashi, Keiko; Obi, Akira, Cluster tool and method for controlling transport.
  14. Iijima,Kiyohito; Kaise,Seiichi; Takahashi,Keiko; Obi,Akira, Cluster tool and transfer control method.
  15. Krupyshev, Alexander G.; Drew, Mitchell, Compact processing apparatus.
  16. Namba, Hirotoshi; Kobiki, Takahiro, Double arm substrate transport unit.
  17. Caveney, Robert T.; Solomon, Todd, Dual arm substrate transport apparatus.
  18. Rodnick, Matthew J., Dual sensing end effector with single sensor.
  19. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.
  20. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.
  21. Woodruff, Daniel J.; Harris, Randy, Integrated tools with transfer devices for handling microelectronic workpieces.
  22. Mitchell, Robert J. C.; Relleen, Keith D.; Ruffell, John, Method and apparatus for processing wafers.
  23. Cameron,James A.; Reyling,Steven G., Method of removing substrates from a storage site and a multiple substrate batch loader.
  24. Larsen, Grant Kenji, Methods and apparatus for high speed object handling.
  25. Woodruff, Daniel J.; Harris, Randy, Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces.
  26. Hanson, Kyle M.; Eudy, Steve L.; Ritzdorf, Thomas L.; Wilson, Gregory J.; Woodruff, Daniel J.; Harris, Randy; Weber, Curtis A.; McGlenn, Tim; Anderson, Timothy A.; Bexten, Daniel P., Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces.
  27. Brodine, Jeffrey A.; Hudgens, Jeffrey C.; Kremerman, Izya, Robot systems, apparatus, and methods adapted to transport substrates in electronic device manufacturing.
  28. Gonzalez-Martin, Jose R.; Karlsrud, Chris, Robotic method of transferring workpieces to and from workstations.
  29. van der Meulen, Peter, Semiconductor manufacturing systems.
  30. Takizawa, Masahiro; Suwada, Masaei; Wada, Takashi, Semiconductor substrate transfer apparatus and semiconductor substrate processing apparatus equipped with the same.
  31. van der Meulen, Peter; Kiley, Christopher C; Pannese, Patrick D.; Ritter, Raymond S.; Schaefer, Thomas A., Semiconductor wafer handling and transport.
  32. van der Meulen, Peter; Kiley, Christopher C; Pannese, Patrick D.; Ritter, Raymond S.; Schaefer, Thomas A., Semiconductor wafer handling and transport.
  33. van der Meulen, Peter; Kiley, Christopher C; Pannese, Patrick D.; Ritter, Raymond S.; Schaefer, Thomas A., Semiconductor wafer handling and transport.
  34. van der Meulen, Peter; Kiley, Christopher C.; Pannese, Patrick D.; Ritter, Raymond S.; Schaefer, Thomas A., Semiconductor wafer handling transport.
  35. Yamagishi,Takayuki; Watanabe,Takeshi, Semiconductor-manufacturing apparatus equipped with cooling stage and semiconductor-manufacturing method using same.
  36. Cameron, James A.; Reyling, Steven G., Substrate handling robot with a batch loader and individual vacuum control at batch loader paddles.
  37. Wilson, Gregory J.; McHugh, Paul R.; Hanson, Kyle M., System for electrochemically processing a workpiece.
  38. Woodruff, Daniel J.; Harris, Randy, TRANSFER DEVICES FOR HANDLING MICROELECTRONIC WORKPIECES WITHIN AN ENVIRONMENT OF A PROCESSING MACHINE AND METHODS OF MANUFACTURING AND USING SUCH DEVICES IN THE PROCESSING OF MICROELECTRONIC WORKPIE.
  39. Tabrizi, Farzad; Barker, David, Transfer mechanism with multiple wafer handling capability.
  40. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
  41. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
  42. Stone,Stanley W., Wafer handler method and system.
  43. Mitchell,Robert J.; Weed,Allan D.; Gueler,Richard, Work-piece treatment system having load lock and buffer.
  44. Wilson,Gregory J.; McHugh,Paul R.; Hanson,Kyle M., Workpiece processor having processing chamber with improved processing fluid flow.
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