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Snap lid image sensor package 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/02
출원번호 US-0457516 (1999-12-08)
발명자 / 주소
  • Thomas P. Glenn
  • Steven Webster
출원인 / 주소
  • Amkor Technology, Inc.
대리인 / 주소
    Gunnison, McKay & Hodgson, L.L.P.
인용정보 피인용 횟수 : 45  인용 특허 : 25

초록 ▼

An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in plac

대표청구항

1. A structure comprising:a molding comprising a locking feature; a snap lid comprising: a compression ring section comprising an aperture; and a snap comprising a tab attached to said locking feature; and a window, said window being exposed through said aperture.

이 특허에 인용된 특허 (25)

  1. Runyan Daniel (Hickmans) Irons Gary J. (Lincoln) Edds Thomas A. (Lincoln NE), Circuit breaker auxiliary device snap-on package and method of assembling same.
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  2. Cassarly James W. (Huntingdon PA) Rollings Robert W. (Huntingdon PA) Youngfleish Frank C. (Pennsylvania Furnace PA), Connector mounting for integrated circuit chip packages.
    상세보기
  3. Okuaki Hiroshi (Tokyo JPX), EPROM device.
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  4. Fusaroli Marzio (Milan ITX) Ceriati Laura (Sesto S. Giovanni ITX), EPROM semiconductor device erasable with ultraviolet rays and manufacturing process thereof.
    상세보기
  5. Benasutti John E. (Lansdale PA), Electrical connector assembly for an integrated circuit package.
    상세보기
  6. Saito Jun (Tokyo JPX), Electronic component socket.
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  7. Okajima Hidekazu (Kanagawa JPX), Helically threaded mechanism.
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  8. Murano Shunji (Yokaichi JPX) Miyauchi Kouji (Oumihachiman JPX) Taguchi Akira (Oumihachiman JPX) Shirao Kazuhiko (Oumihachiman JPX), Image device having a spacer with image arrays disposed in holes thereof.
    상세보기
  9. Murano Shunji (Aira JPX), Image devices.
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  10. Beaman Bryan A. ; Gerstenberger Julie K. ; Orlicki David M., Imager package substrate.
    상세보기
  11. Walton R. Thomas (Torrance CA) Hathaway James A. (Redondo Beach CA) Runyan Michael D. (Torrance CA) Turnage Michael L. (Sunnymead CA), Integrated circuit package carrier.
    상세보기
  12. Walton R. Thomas (Torrance CA), Integrated circuit package carrier and test device.
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  13. Doggett David E. (Sunnyvale CA), Laser diode/lens assembly.
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  14. Kamata Kazuo,JPX, Lens-fitted film unit with plastic taking lens.
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  15. Shimomura Jun (Tokyo JA), Light receiving device for photoelectric conversion element.
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  16. Fukushima Tetsuo (Hirakata JPX) Otsuki Toshinori (Yawata JPX) Okada Shinji (Neyagawa JPX) Seutsugu Kenichiro (Amagasaki JPX), Method of molding a lens array.
    상세보기
  17. Glenn Thomas P. ; Webster Steven, Molded window array for image sensor packages.
    상세보기
  18. Glenn Thomas P., Mounting for a semiconductor integrated circuit device.
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  19. Glenn Thomas P., Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device.
    상세보기
  20. Campbell Hugh P. ; Behringer Rheinhold W., Precision optical sensor packaging.
    상세보기
  21. Grabbe Dimitry G. (Middletown PA) Korsunsky Iosif (Harrisburg PA), Protective carrier and securing means therefor.
    상세보기
  22. Herpst Robert D., Protective window assembly and method of using the same for a laser beam generating apparatus.
    상세보기
  23. Chapnik Philip (Newton MA), Spatially multiplexed image display system.
    상세보기
  24. Clover George R. (London GB2), Transparency viewers.
    상세보기
  25. Hodges Joe (Boise ID), UV light sensitive die-pac for securing semiconductor dies during transport.
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이 특허를 인용한 특허 (45)

  1. Kuboi, Toru, Airtight apparatus having a lid with an optical window for passage of optical signals.
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  2. Webster,Steven, Camera module fabrication method including singulating a substrate.
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  3. Webster,Steven, Camera module fabrication method including the step of removing a lens mount and window from the mold.
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  4. Webster,Steven, Camera module having a threaded lens barrel and a ball grid array connecting device.
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  5. Glenn, Thomas P.; Webster, Steven, Camera module with window mechanical attachment.
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  6. Silverbrook,Kia, Chips with wafer scale caps formed by molding.
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  7. Kato,Takuji; Ochiai,Isao; Shibusawa,Katsuhiko, Circuit device and method for manufacturing the same.
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  8. Coppeta, Jonathan R.; Shelton, Kurt; Sheppard, Jr., Norman F.; Snell, Douglas; Santini, Catherine M. B., Compression and cold weld sealing method for an electrical via connection.
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  9. Bolken, Todd O.; Baerlocher, Cary J.; Heppler, Steven W.; Cobbley, Chad A., Electronic device package.
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  10. Bolken, Todd O.; Baerlocher, Cary J.; Heppler, Steven W.; Cobbley, Chad A., Electronic devices.
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  11. Yang,Wen Kun; Yang,Chin Chen; Sun,Wen Bin; Chang,Jui Hsien; Yu,Chun Hui; Yuan,His Ying, FBGA and COB package structure for image sensor.
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  12. Potter,Curtis Nathan, Hermetic MEMS package and method of manufacture.
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  13. Coppeta, Jonathan R.; Shelton, Kurt; Sheppard, Jr., Norman F.; Snell, Douglas; Santini, Catherine M. B., Hermetically sealing using a cold welded tongue and groove structure.
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  14. Lu, Chien-Hsin; Wu, Zheng-Yu, Image detecting module and lens module.
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  15. Chen,Po Hung, Image sensing chip package structure.
    상세보기
  16. Hsin,Chung Hsien; Wang,Tony; Hsieh,Figo; Chou,Chin Hai, Image sensor module structure with lens holder having vertical inner and outer sidewalls.
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  17. Onishi,Hiroaki; Fujimoto,Hisayoshi, Image sensor module with substrate and frame and method of making the same.
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  18. Webster, Steven, Image sensor package fabrication method.
    상세보기
  19. Yang, Wen Kun; Yang, Chin Chen; Yang, Wen Ping; Sun, Wen Bin; Chou, Chao nan; Yuan, His Ying; Chang, Jui Hsien, Image sensor with a protection layer.
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  20. Maeda,Mitsuo; Sato,Tomohiro; Yoshida,Shigehide, Lid made of resin for case for accommodating solid-state imaging device and solid-state imaging apparatus.
    상세보기
  21. Haskett, Bradley Morgan; O'Connor, John Patrick; Miller, Mark Myron; Crowley, Sean Timothy; Miks, Jeffrey Alan; Popovich, Mark Phillip, Micro-optical device packaging system.
    상세보기
  22. Akram, Salman, Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers.
    상세보기
  23. Akram, Salman, Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers.
    상세보기
  24. Jerominek, Hubert; Alain, Christine, Miniature microdevice package and process for making thereof.
    상세보기
  25. Bolken, Todd O.; Baerlocher, Cary J.; Heppler, Steven W.; Cobbley, Chad A., Moisture-resistant electronic device package and methods of assembly.
    상세보기
  26. Bolken,Todd O.; Baerlocher,Cary J.; Heppler,Steven W.; Cobbley,Chad A., Moisture-resistant electronic device package and methods of assembly.
    상세보기
  27. Webster, Steven, Molded image sensor package and method.
    상세보기
  28. Webster, Steven, Molded semiconductor package.
    상세보기
  29. Webster, Steven, Molded semiconductor package with snap lid.
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  30. Akram,Salman, Optical device and assembly for use with imaging dies, and wafer-label imager assembly.
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  31. Hashimoto,Nobuaki, Optical device and method of manufacturing the same, optical module, circuit board, and electronic instrument.
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  32. Hashimoto,Nobuaki, Optical device, method of manufacturing the same, optical module, circuit board and electronic instrument.
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  33. Park, Heung Woo; Park, Chang Su, Optical modulator module package.
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  34. Rissing, Lutz; Braasch, Jan, Optoelectronic component assembly.
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  35. Chen,Po Hung, Packaging structure of a light-sensing element and fabrication method thereof.
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  36. Silverbrook,Kia, Placement tool for wafer scale caps.
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  37. Sorrieul, Marika; Saxod, Karine, Process of fabrication of electronic devices and electronic device with a double encapsulation ring.
    상세보기
  38. Kawai, Fumihiko; Fukuda, Toshiyuki; Minamio, Masanori; Takeuchi, Noboru; Ogata, Shuichi; Tara, Katsushi; Nakatsuka, Tadayoshi, Resin encapsulated semiconductor device and method for manufacturing the same.
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  39. Shoji,Hiroyuki, Resin-molded package with cavity structure.
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  40. Saitoh, Hiroshi; Suzuki, Toshihisa; Sakakibara, Shingo, Semiconductor device and manufacturing method thereof.
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  41. Pagaila, Reza A.; Do, Byung Tai; Merilo, Dioscoro A., Semiconductor device and method of forming bond wires between semiconductor die contact pads and conductive TOV in peripheral area around semiconductor die.
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  42. Bauer, Michael; Haimerl, Alfred; Kessler, Angela; Mahler, Joachim; Schober, Wolfgang, Semiconductor device having a sensor chip, and method for producing the same.
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  43. Glenn,Thomas P.; Webster,Steven, Snap lid camera module.
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  44. Yang,Wen Kun; Yang,Wen Pin, Structure of image sensor module and a method for manufacturing of wafer level package.
    상세보기
  45. Yang,Wen Kun; Yang,Wen Pin, Structure of image sensor module and method for manufacturing of wafer level package.
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