초록 ▼

A clamping system decouples the clamping forces in an electrical circuit assembly coupled to a heatsink. A heatsink clamping assembly applies controllable and predictable force on the electrical circuit assembly including an integrated circuit device ("chip"). The applied force is controlled to effe

A clamping system decouples the clamping forces in an electrical circuit assembly coupled to a heatsink. A heatsink clamping assembly applies controllable and predictable force on the electrical circuit assembly including an integrated circuit device ("chip"). The applied force is controlled to effectively ensure intimate contact between the chip and the heatsink to facilitate efficient chip cooling. The force applied to the chip is decoupled from the much higher force required to clamp the electrical interposer interconnect structure between the electrical circuit assembly and the printed circuit board.

대표청구항 ▼

1. A clamping system for electrical assembly systems, comprising:an electrical circuit assembly having a first surface and a second surface; an electrical circuit mounted on the first surface of the electrical circuit assembly and electrically coupled to the electrical circuit assembly; a first set

1. A clamping system for electrical assembly systems, comprising:an electrical circuit assembly having a first surface and a second surface; an electrical circuit mounted on the first surface of the electrical circuit assembly and electrically coupled to the electrical circuit assembly; a first set of electrical contacts mounted on the second surface of the electrical circuit assembly and electrically coupled to the electrical circuit assembly; a printed circuit board including a second set of electrical contacts; a clamp plate mounted on the first surface of the electrical circuit assembly dimensioned not to overlap with the electrical circuit; a first clamping assembly mechanically coupling the clamp plate to the printed circuit board and configured to apply a first force onto the first surface of the electrical circuit assembly by compressing the electrical circuit assembly between the clamp plate and the printed circuit board, the first force contributing to an electrical coupling between the first set of electrical contacts and the second set of electrical contacts; a heatsink assembly mounted on the electrical circuit; and a second clamping assembly mechanically coupling the heatsink assembly to the printed circuit board and configured to apply a second force onto the electrical circuit by compressing the electrical circuit between the heatsink assembly and the printed circuit board, the second force contributing to a thermodynamic coupling between the heatsink assembly and the electrical circuit.