초록 ▼

Compositions comprising (A) an oligomer or polymer containing at least one carboxylic acid group in the molecule; (B) at least one compound of formulas (I, II, III, IV, V or VI), wherein R1 inter alia is phenyl or alkyl; R2 is for example C2-C12alkonoyl which is unsubstituted or substituted or is be

Compositions comprising (A) an oligomer or polymer containing at least one carboxylic acid group in the molecule; (B) at least one compound of formulas (I, II, III, IV, V or VI), wherein R1 inter alia is phenyl or alkyl; R2 is for example C2-C12alkonoyl which is unsubstituted or substituted or is benzoyl; R3, R4, R5, R6 and R7 independently of one another are for instance hydrogen, C1-C12alkyl, cyclohexyl or phenyl which is unsubstituted or substituted, or are benzyl, benzoyl, C2-C12alkanoyl or phenoxycarbonyl; R8 is for example hydrogen or C1-C12alkyl or a group (B); M is for example C1-C12alkylene, cyclohexylene or phenylene; M1 inter alia is a direct bond or C1-C12alkylenoxy; and Ar is a 5- or 6-membered aromatic heterocyclic ring; (C) a photopolymerizable reactive or unreactive diluent; and (D) as a thermosetting component an epoxy compound containing at least two epoxy groups in one molecule; are highly suitable as resists which are alkaline developable.

대표청구항 ▼

may be a group [EQU27]R12, R13, R14, R15, R16, R17, R18 and R19 independently of one another are hydrogen, halogen, C1-C12alkyl, cyclopentyl, cyclohexyl or phenyl which is unsubstituted or substituted by one or more OR8, SR9 or NR10R11, or R12, R13, R14, R15, R16, R17, R18 and R19 are benzyl, benzoy

may be a group [EQU27]R12, R13, R14, R15, R16, R17, R18 and R19 independently of one another are hydrogen, halogen, C1-C12alkyl, cyclopentyl, cyclohexyl or phenyl which is unsubstituted or substituted by one or more OR8, SR9 or NR10R11, or R12, R13, R14, R15, R16, R17, R18 and R19 are benzyl, benzoyl, C2-C12alkanoyl, C2-C12alkoxycarbonyl optionally interrupted by one or more -O- and/or optionally substituted by one or more hydroxyl groups or R12, R13, R14, R15, R16, R17, R18 and R19 are phenoxycarbonyl or a group OR8, SR9, SOR9, SO2R9, NO2, CN, CONR10R11, or NR10R11, wherein the substituents OR8, SR9 and NR10R11 may form 5- or 6-membered rings via the radicals R8, R9, R10 and/or R11 with further substituents on the phenyl ring or with one of the carbon atoms of the phenyl ring or, when M4 is a direct bond, R15 and R16 together are ethylene or ethynylene; t is 0 or 1; M is C1-C12alkylene, cyclohexylene, phenylene, -COO-(C2-C12alkylene)-OOC-, -COO-(CH2CH2O)n-OC- or -CO-(C2-C12-alkylene)-CO-; M1 is a direct bond or C1-C12alkylenoxy, optionally interrupted by 1 to 5 -O-, -S- and/or -NR10-; M2 is a direct bond or C1-C12-alkylene-S-, optionally interrupted by 1 to 5 -O-, -S- and/or -NR10-; M3 is a direct bond, a piperazino group, or C1-C12alkylene-NR10-, optionally interrupted by 1 to 5 -O-, -S- and/or -NR10-; M4 is a direct bond, -O-, -S-, -SO-, -SO2-, -CO-, -CH2-, -NR10-, or a group [EQU28]Ar is a 5- or 6-membered aromatic heterocyclic ring, which is unsubstituted or substituted by one or more C1-C6alkyl, phenyl, halogen, OR8, SR9, NR10R11, CN, C2-C6alkanoyl or benzoyl; wherein 1-phenyl-1,2-propanedione-2-o-benzoyl oxime and 1-phenyl-1,2-propanedione-2-o-ethoxycarbonyl oxime are excluded; (C) a photopolymerizable reactive or unreactive diluent; and (D) as a thermosetting component an epoxy compound containing at least two epoxy groups in one molecule.