초록 ▼

A case for dissipating heat from an electronic device is provided. The case includes an electronic circuit board with a heat generating electronic component installed thereon. A shield is positioned over the electronic component to protect it from electromagnetic interference. The shield includes an

A case for dissipating heat from an electronic device is provided. The case includes an electronic circuit board with a heat generating electronic component installed thereon. A shield is positioned over the electronic component to protect it from electromagnetic interference. The shield includes an aperture through its top surface. A heat transfer conduit is molded into and through the aperture to contact the top surface of the heat generating electronic component. Outer housing, which is made of a thermally conductive material, is placed into contact with the top surface of the heat transfer conduit which extends outside the shield. As a result, heat is dissipated from the electronic component and through the housing of the electronic device via the heat transfer conduit while shielding the electronic component from electromagnetic interference.

대표청구항 ▼

1. A case for dissipating heat from an electronic device, comprising:an electronic circuit board; a heat generating electronic component disposed on said circuit board; and a housing positioned about said electronic circuit board and said heat generating electronic component; said housing being made

1. A case for dissipating heat from an electronic device, comprising:an electronic circuit board; a heat generating electronic component disposed on said circuit board; and a housing positioned about said electronic circuit board and said heat generating electronic component; said housing being made of a net-shaped moldable thermally conductive composite material of a polymer base matrix with thermally conductive filler therein; said housing being in thermal communication with said electronic component with heat being dissipating from said heat generating electronic component and through said housing.