A method and apparatus for removing moisture from within an electronics enclosure is provided. In particular, dehumidification is accomplished by removing air from the enclosure, cooling the air thereby causing condensation of water vapor from the air, then heating the dehumidified air and returning
A method and apparatus for removing moisture from within an electronics enclosure is provided. In particular, dehumidification is accomplished by removing air from the enclosure, cooling the air thereby causing condensation of water vapor from the air, then heating the dehumidified air and returning the heated and dehumidified air to the enclosure. A single heat pump provides cooling and heating functions, effectively recouping heat extracted from the air to be cooled, and transferring the extracted heat to the air prior to its return to the enclosure. In this manner, electronics within the enclosure may be operated at temperatures below the dew point of ambient air surrounding the enclosure, without requiring a thermally insulated enclosure. Devices are provided to collect and purge condensate from the system, either in a continuous or periodic manner. Embodiments employing conventional vapor compression cycle heat pumps and thermoelectric heat pumps are described. A defrost cycle is provided to eliminate frost that may accumulate on the heat exchanger associated with the heat pump normally cold element. Defrost is accomplished by reversing heat pump polarity, heating the normally cold element. Control mechanisms and logic are provided to automate system operation. In preferred embodiments, dehumidification and defrost modes are activated by a controller monitoring the dew point within the enclosure, and the air pressure at the normally cold element. Dehumidification is performed intermittently, when the enclosure dew point exceeds a set point Substantially sealing the enclosure against ingress of ambient air reduces the system's operational duty cycle.
대표청구항▼
1. An apparatus for conditioning the air surrounding cooled electronic modules, said apparatus comprising:an enclosure containing said electronic modules, said enclosure being substantially sealed against ingress of ambient air; a heat pump having a normally cold element and a normally hot element,
1. An apparatus for conditioning the air surrounding cooled electronic modules, said apparatus comprising:an enclosure containing said electronic modules, said enclosure being substantially sealed against ingress of ambient air; a heat pump having a normally cold element and a normally hot element, said heat pump capable of causing heat to flow from said normally cold element to said normally hot element; a conduit having an inlet port, an outlet port, an inlet side, an outlet side, and a sump, said inlet and outlet ports being in airflow communication with said enclosure, said inlet port normally being in airflow communication with said inlet side, said outlet port normally being in airflow communication with said outlet side, said sump portion being in airflow communication with said inlet and outlet sides, said sump also being disposed beneath said normally cold element; a normally cold heat exchanger in thermal contact with said normally cold element, said normally cold heat exchanger disposed within said inlet side and providing heat flow between said normally cold element and air within said inlet side; a normally hot heat exchanger in thermal contact with said normally hot element, said normally hot heat exchanger disposed within said outlet side and providing heat flow between said normally hot element and air within said outlet side; an air moving device, capable of causing airflow from said inlet side to said outlet side; enclosure airflow control, capable of causing air exiting said outlet port to circulate within said enclosure before entering said inlet port; removal means for removing condensate from said sump portion.
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이 특허에 인용된 특허 (9)
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Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Dehumidifying and re-humidifying apparatus and method for an electronics rack.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Dehumidifying and re-humidifying cooling apparatus and method for an electronics rack.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Dehumidifying cooling apparatus and method for an electronics rack.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Dehumidifying cooling apparatus and method for an electronics rack.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Dehumidifying cooling apparatus and method for an electronics rack.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Dehumidifying cooling apparatus and method for an electronics rack.
Quisenberry, Tony, Method and system for maximizing the thermal properties of a thermoelectric cooler and use therewith in association with hybrid cooling.
Quisenberry, Tony, Method and system for maximizing thermal properties of a thermoelectric cooler and use therewith in association with hybrid cooling.
Akei, Masao; Ignatiev, Kirill M; Jayanth, Nagaraj; Pham, Hung M; Caillat, Jean-Luc M, Vapor compression circuit and method including a thermoelectric device.
Akei, Masao; Ignatiev, Kirill; Jayanth, Nagaraj; Pham, Hung M.; Caillat, Jean-Luc M., Vapor compression circuit and method including a thermoelectric device.
Akei,Masao; Ignatiev,Kirill M; Jayanth,Nagaraj; Pham,Hung M; Caillat,Jean Luc M, Vapor compression circuit and method including a thermoelectric device.
Akei,Masao; Ignatiev,Kirill M; Jayanth,Nagaraj; Pham,Hung M; Caillat,Jean Luc M, Vapor compression circuit and method including a thermoelectric device.
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