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PCB-to-chassis mounting schemes 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/14
  • H05K-001/14
  • H01B-017/14
출원번호 US-0934871 (2001-08-21)
발명자 / 주소
  • David S. De Lorenzo
  • Casey R. Winkel
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    Blakely, Sokoloff, Taylor & Zafman LLP
인용정보 피인용 횟수 : 59  인용 특허 : 10

초록

A method and assembly for mounting printed circuit boards (PCBs) to a chassis. In one embodiment, a plurality of internally-threaded mounting posts are secured (e.g., press-fit) to the chassis and the PCB includes a plurality of holes into which the mounting posts extend. Each hole includes a pair o

대표청구항

1. A printed circuit board (PCB)-to-chassis mount comprising:an internally-threaded standoff, adapted to be fixedly secured to a chassis upon assembly; a PCB subassembly, comprising: a PCB, having a hole defined therein through which a portion of the internally-threaded standoff passes through upon

이 특허에 인용된 특허 (10)

  1. Wark James M. ; Bettinger Michael J., Apparatus and method for facilitating circuit board processing.
  2. Crockett Robert J. (Central SC), Apparatus for containing and supporting electronic components.
  3. Lanzone Chris Allan ; Pierson Richard A. ; Sandage Andrea T., Chassis grounding ring for a printed wiring board mounting aperture.
  4. Duncan ; Jr. Wayne P. (Houston TX), Non-occluding mounting hole with solder pad for printed circuit boards.
  5. Lee Cheon-Yeol,KRX, Printed circuit board mounting assembly within a portable computer.
  6. Wade White, Printed circuit board top side mounting standoff.
  7. Suski Edward D. (Lake Forest CA) Silva David J. (Trabuco CA) Miner Glenn G. (Weatherford TX), Solder pad for printed circuit boards.
  8. Petri Hector D. (384 Edmunds Rd. Framingham MA 01701), Spacer for circuit boards and circuit board assembly including same.
  9. Bum-Young Won KR; Bum-Su Park KR, Structure for mounting a PCB in an electronic apparatus housing.
  10. Swanstrom Kenneth A. (Buckingham Township ; Bucks County PA), Stud for mounting and method of mounting heat sinks on printed circuit boards.

이 특허를 인용한 특허 (59)

  1. Mueller, Donald; Stambaugh, Deron; Russo, Anthony, Apparatus and methods for interconnecting electrical circuit substrates and components.
  2. Estes,Larry Glenn; Octaviano, II,Raymond Gary, Apparatus for resiliently mounting a circuit board within a device housing.
  3. Lim, Deok-Young; Yang, Chun-Suk, Board apparatus.
  4. Chou,Shen Hong, Bottom lighting module.
  5. Luo,Zi Gui; Ma,Eva; Fan,Bg, Circuit board fixer structure.
  6. Kuo,Peter; Du,Bing, Circuit board fixing structure.
  7. Ireland, John A., Circuit board standoff.
  8. Barsun, Stephan K.; Hahn, Steven R.; Augustin, Thomas J., Circuit board support assembly.
  9. Ireland,John A., Circuit board threadplate.
  10. Wainwright,Richard E.; Kersting,James K., Combination IGBT mounting method.
  11. Blackwell, Donald A., Displaceable card guide for high packing ratio housings.
  12. Sporer, Bernd; Weinmann, Klaus; Pitzl, Andreas; Kirsch, Thomas, Double-threaded connector.
  13. Stotz, Jr., Robert F., Dynamic mounting system.
  14. Hublier, Philippe; Hamon, Fabrice, Electrical connection terminal.
  15. Yamamoto, Nobuhiro; Funayama, Takahisa, Electronic apparatus and hard disk drive.
  16. Monda, Tomoko; Mukai, Minoru, Electronic apparatus having circuit board.
  17. Skofljanec, Robert, Electronic control device for use in vehicles.
  18. Liu, Chi-Yuan, Electronic device and connection mechanism thereof.
  19. Boudreaux,Brent; Peterson,Eric, Electronic system and method.
  20. Hsieh, Ming-Chih; Li, Tsung-Hsi, Fastener and electronic device having the same.
  21. Johnson, Patrick S.; Atkinson, Jr., Robert R.; Byquist, Tod A.; Broili, Ben M., Fastening techniques for electronic devices.
  22. Muttam, Balaji Prasad; Cherian, Jaison; Deshpande, Ajit, Field device having chassis ground connection in a potted configuration.
  23. Eifert, Daniel J., Gripping PWB hex standoff.
  24. Ni, Jim Chin-Nan; Li, Ken Qi-Jin; Ma, Abraham C.; Shen, Ming-Shiang, Hard drive with metal casing and ground pin standoff to reduce ESD damage to stacked PCBA's.
  25. Blackwell, Donald A., Hot pluggable adapter for legacy power supply connectors.
  26. Blackwell,Donald A., Housing for hot pluggable network taps.
  27. Shahoian, Erik J., Interposer connectors.
  28. Fosnes, Greg; Miletich, Aaron; Ligtenberg, Chris; Anastas, Jay; Shahoian, Erik James; Knopf, Eric; Arnold, Peter, Interposer connectors with alignment features.
  29. Ni, Jim Chin-Nan; Hiew, Siew S.; Ma, Abraham C., Light-weight solid state drive with rivet sets.
  30. Strickland, Stephen E.; Leone, Jason J.; Boudreau, Maida, Memory module mounting system.
  31. Pav,Darren; Eddings,Richard; Falkin,Andrea, Method and apparatus for board mounting in a chassis.
  32. DiBene, II, Joseph Ted; Hartke, David H., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.
  33. DiBene, II,Joseph T.; Derian,Edward J., Micro-spring interconnect systems for low impedance high power applications.
  34. Chen, Ken-Ching; Tseng, I-Ming; Wang, Chun-Chiang, Mounting bracket.
  35. Wynar, Agnieszka; Wisniewski, Stan; Campagna, Michael; Wisniewski, Scott, Multiple board standoff.
  36. Ni, Jim Chin-Nan; Lee, Charles C.; Yu, Frank; Ma, Abraham C.; Shen, Ming-Shiang, Open-frame solid-state drive housing with intrinsic grounding to protect exposed chips.
  37. Chen, Yang-Yuan; Kuo, Heng-Chen, Over-voltage protection device.
  38. Kim, Myoung-Kon, Plasma display device and its method of manufacture.
  39. Jeong,Jae Seok; Kang,Tae Kyoung, Plasma display device with grounding module.
  40. Meguro, Hiromasu; Chiba, Yasunori; Okumura, Shinya, Portable device.
  41. Tu, Chun Tang; Tseng, Chuan-Chieh; Liu, Yung-Lung, Positioning structure, positioning securing structure and electronic device.
  42. Liu, Lei, Power supply unit.
  43. Fu, Jianyong, Printed circuit board and design method thereof.
  44. Sivertsen, Clas Gerhard, Rack-mount apparatus for mounting electronic components.
  45. Grossman, Owen D.; Hagenson, Dale J.; Lin, Harrison; Requa, III, Mark Lawrence, Radiation shield standoff.
  46. Hartke, David H.; DiBene, II, J. Ted, Right-angle power interconnect electronic packaging assembly.
  47. Liang,Chien Kuo, Screwing control device of a computer chassis.
  48. Rubenstein, Brandon; Barsun, Stephan, Securable electronic module.
  49. Derian, Edward J.; DiBene, II, Joseph Ted; Hartke, David H., Separable power delivery connector.
  50. Chou, Peter Leekuo; Chien, Stephen; Tai, William, Solid state drive (SSD) assembly method.
  51. Hiew, Siew S.; Ni, Jim Chin Nan; Ma, Abraham C.; Li, Qijin; Nan, Nan, Solid state drive (SSD) with open top and bottom covers.
  52. Gonzalez,Juan; Jensen,Ralph W.; McGuff,Matthew S.; Rodriguez,Alex Z.; Schmitt,Ty R., Spring loaded plunger for circuit board installation and removal.
  53. Urai, Takashi, Strain reduction fixing structure.
  54. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., System and method for processor power delivery and thermal management.
  55. Noonan, Kevin Mark, Thermal stand-off with tortuous solid-wall thermal conduction path.
  56. Mejia,Charles G.; Moallem,Bahman, Thermal standoff for close proximity thermal management.
  57. Ni, Jim Chin Nan; Lee, Charles C.; Ma, Abraham C.; Shen, Ming Shiang, Thin hard drive with 2-piece-casing and ground pin standoff to reduce ESD damage to stacked PCBA's.
  58. Gilliland,Don A.; Thompson,Guy A., Toolless method for alignment, retention, connection, termination and test on printed circuit boards.
  59. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., Ultra-low impedance power interconnection system for electronic packages.
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