초록 ▼

A method of creating and using a polishing substrate having a coating layer that includes providing a substrate having a predetermined pattern disposed on a surface of the substrate and coating the surface of the substrate with an abrasive to form a coated substrate conforming to the predetermined p

A method of creating and using a polishing substrate having a coating layer that includes providing a substrate having a predetermined pattern disposed on a surface of the substrate and coating the surface of the substrate with an abrasive to form a coated substrate conforming to the predetermined pattern is described. In addition, an apparatus enabling preparation and use of a fixed abrasive polishing member is described that includes a patterned substrate, an abrasive coating a surface of the patterned substrate and a vacuum deposition chamber in which the abrasive is applied to the surface of the substrate. In addition, rather than a fixed abrasive, non-abrasive material may be applied to the surface of the patterned substrate, in which case, a conventional slurry may be used in planarization of an applied semiconductor wafer.

대표청구항 ▼

1. A method of preparation and use of a polishing substrate to polish a semiconductor wafer comprising:providing a substrate having a substrate pattern on a surface of the substrate; coating the surface of the substrate with a coating layer; transferring the substrate to a chemical-mechanical polish

1. A method of preparation and use of a polishing substrate to polish a semiconductor wafer comprising:providing a substrate having a substrate pattern on a surface of the substrate; coating the surface of the substrate with a coating layer; transferring the substrate to a chemical-mechanical polishing chamber subsequent to coating the surface of the substrate with the coating layer; planarizing a semiconductor wafer using the coated substrate transferring the substrate to a cleaning chamber subsequent to planarizing at least one semiconductor wafer; cleaning the substrate by at least removing a remainder of the coating layer from the surface of the substrate; transferring the substrate to a position in which the surface of the substrate is positioned to receive a new coating layer; and coating the surface of the substrate with the new coating layer.