초록 ▼

A metal base substrate for mounting a plurality of bare semiconductor chip devices thereon has first and second main surfaces. The first main surface has formed thereon at least one projection, and at least two recesses in which the bare semiconductor chip devices are to be mounted. The depth of the

A metal base substrate for mounting a plurality of bare semiconductor chip devices thereon has first and second main surfaces. The first main surface has formed thereon at least one projection, and at least two recesses in which the bare semiconductor chip devices are to be mounted. The depth of these recesses is smaller than the length of said projection, and the recesses have a higher surface smoothness than said main surfaces of said metal substrate. The metal base substrate is partially chemically etched to form the projection, and the first main surface of the substrate is mechanically worked to form at least the recesses. The conductive projection is isolated from the portion on which the bare semiconductor chip devices are mounted, of the base substrate, and the conductive projection acts as a terminal that can be electrically connected to the outside on the first and second main surfaces of the base substrate.

대표청구항 ▼

1. A multi-chip module structure comprising:a conductive base substrate having first and second main surfaces, said first main surface having provided thereon at least two recesses for bare semiconductor chips to be mounted thereon; at least a plurality of said bare semiconductor chips mounted on sa

1. A multi-chip module structure comprising:a conductive base substrate having first and second main surfaces, said first main surface having provided thereon at least two recesses for bare semiconductor chips to be mounted thereon; at least a plurality of said bare semiconductor chips mounted on said recesses of said first main surface; at least one conductive block arranged to provide an electrical connection between a first conductor on a first side on which said first main surface of the conductive base substrate exists and a second conductor on a second side on which said second main surface of the substrate exists; an insulating material filled in a space between said conductive block, said base substrate, and said bare semiconductor chips to insulate said conductive block from said base substrate and from said bare semiconductor chips; and an electric connection conductor provided on said insulating material, said electric connection conductor including said first conductor.