초록 ▼

An implantable substrate sensor has electronic circuitry and electrodes formed on opposite sides of a substrate. A protective coating covers the substrate, effectively hermetically sealing the electronic circuitry under the coating. Exposed areas of the electrodes are selectively left uncovered by t

An implantable substrate sensor has electronic circuitry and electrodes formed on opposite sides of a substrate. A protective coating covers the substrate, effectively hermetically sealing the electronic circuitry under the coating. Exposed areas of the electrodes are selectively left uncovered by the protective coating, thereby allowing such electrodes to be exposed to body tissue and fluids when the sensor is implanted in living tissue. The substrate on which the electronic circuitry and electrodes are formed is the same substrate or "chip" on which an integrated circuit (IC) is formed, which integrated circuit contains the desired electronic circuitry. Such approach eliminates the need for an hermetically sealed lid or cover to cover hybrid electronic circuitry, and allows the sensor to be made much thinner than would otherwise be possible. In one embodiment, two such substrate sensors may be placed back-to-back, with the electrodes facing outward. As required, capacitors that form part of the sensor's electronic circuits are formed on the substrate by placing metalization layers and a dielectric in vacant areas of the substrate surface.

대표청구항 ▼

1. A method of making an implantable sensor, said implantable sensor including a substrate, electrodes formed on one side of the substrate, and electrical circuitry formed on the other side of the substrate, said method comprising:forming the electrical circuitry on an active surface of a semiconduc

1. A method of making an implantable sensor, said implantable sensor including a substrate, electrodes formed on one side of the substrate, and electrical circuitry formed on the other side of the substrate, said method comprising:forming the electrical circuitry on an active surface of a semiconductor substrate; forming electrodes on a non-active surface of the semiconductor substrate; electrically interconnecting the electrodes with the electrical circuitry through the use of stair-stepped conductive vias that pass through the body of the semiconductor substrate; and depositing a protective layer of a biocompatible material over the entire surface area of the substrate except for an exposed area of the electrodes.