초록 ▼

An end-effector with integrated cooling features comprises heat transferring mechanisms that transfer heat energy away from the end-effector. The end-effector advantageously minimizes the cooling overhead of a processed substrate as it is transported from a process module to a low-cost storage casse

An end-effector with integrated cooling features comprises heat transferring mechanisms that transfer heat energy away from the end-effector. The end-effector advantageously minimizes the cooling overhead of a processed substrate as it is transported from a process module to a low-cost storage cassette. The reduced cooling overhead of the processed substrate, as a consequence, improves substrate throughput. In the preferred embodiments, the heat transferring mechanisms include a high surface area heat sink connecting the substrate-supporting paddle with a robot arm. Cooling fins can enhance surface area and thus enhance heat dissipation from the heat sink. Cooling channels can extend through paddle and heat sink, either containing circulating fluid for carrying heat beyond the end-effector or a phase changing material in an enclosed heat pipe.

대표청구항 ▼

1. An end-effector for transporting substrates within a semiconductor fabrication environment:the end-effector comprising a paddle portion configured to underlie at least 60% of a substrate and thereby support and conductively exchange heat with the substrate; a handle portion in conductive thermal

1. An end-effector for transporting substrates within a semiconductor fabrication environment:the end-effector comprising a paddle portion configured to underlie at least 60% of a substrate and thereby support and conductively exchange heat with the substrate; a handle portion in conductive thermal contact with the paddle portion, the handle portion configured to connect the paddle portion to a robot arm; and an integrated cooling mechanism configured to dissipate heat from the end-effector by convection, wherein the integrated cooling mechanism comprises a plurality of surface area enhancing fins projecting from the handle portion.