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A method for forming a multi-layer protective coating over a porous low-k (dielectric constant) material for use in a multiple layer semiconductor device including providing a semiconductor process wafer including a process surface said process surface including an uppermost surface of a low-k porou

A method for forming a multi-layer protective coating over a porous low-k (dielectric constant) material for use in a multiple layer semiconductor device including providing a semiconductor process wafer including a process surface said process surface including an uppermost surface of a low-k porous material layer said low-k porous material layer including a plurality of openings penetrating the process surface; and, spin coating a flowable dielectric onto the process surface to form a plurality of protective sealing layers such that the porosity of the low-k porous material layer is substantially maintained and the plurality of protective sealing layers are formed such that the migration of water (H2O) is substantially blocked through at least an uppermost protective sealing layer surface.

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1. A method for forming a multi-layer protective coating over a porous low-k (dielectric constant) material for use in a multiple layer semiconductor device comprising the steps of:providing a semiconductor process wafer including a process surface; forming a low-k porous material layer over said pr

1. A method for forming a multi-layer protective coating over a porous low-k (dielectric constant) material for use in a multiple layer semiconductor device comprising the steps of:providing a semiconductor process wafer including a process surface; forming a low-k porous material layer over said process surface wherein said low-k porous material layer including a plurality of openings penetrating the process surface to form a plurality of pore openings; and forming a flowable dielectric onto the process surface to form a plurality of protective layers such that the porosity of the low-k porous material layer is substantially maintained and the plurality of protective layers are formed such that migration of water (H2O) is substantially blocked through at least an uppermost protective layer surface.