초록 ▼

An ultraviolet light reaction system is constructed for surface cleaning/surface processing, a processing speed and an apparatus size that can not be attained by any conventional chemical reaction system, are realized, and realization of a time-sharing performance/a high-throughput performance/a com

An ultraviolet light reaction system is constructed for surface cleaning/surface processing, a processing speed and an apparatus size that can not be attained by any conventional chemical reaction system, are realized, and realization of a time-sharing performance/a high-throughput performance/a compact size is intended. Using an excimer ultraviolet lamp whose light source is excimer ultraviolet rays of a wavelength that transmissive distances to air, gas, and water are 2 mm or more, respectively, surface processing (such as a surface cleaning process) of a substrate disposed in a one-by-one substrate chamber is preformed.

대표청구항 ▼

1. An ultraviolet processing apparatus used purification of a surface and a material in relation to manufacturing a semiconductor device or a liquid crystal display device, comprising, as a light-source, an ultraviolet lamp for applying ultraviolet rays of a wavelength that have a 50% transmissiv

1. An ultraviolet processing apparatus used purification of a surface and a material in relation to manufacturing a semiconductor device or a liquid crystal display device, comprising, as a light-source, an ultraviolet lamp for applying ultraviolet rays of a wavelength that have a 50% transmissive distance to air, water, steam, and a gas of 2 mm or more, respectively. 2. An ultraviolet processing apparatus described in claim 1, wherein said surface is one selected from among process surfaces from a substrate to a semiconductor device, surfaces of process apparatus and process apparatus parts, and surfaces of apparatus and apparatus parts in relation to lithographic processes. 3. An ultraviolet processing apparatus described in claim 1, wherein said material is one selected from among raw water, pure water, drain, general gases, and special material gases. 4. An ultraviolet processing apparatus described in claim 1, wherein said ultraviolet lamp is an excimer ultraviolet lamp. 5. An ultraviolet processing apparatus described in claim 1, wherein it is disposed in a surface purification apparatus using steam, and a surface being processed with steam is irradiated with ultraviolet rays that have a 50% transmissive distance to steam of 2 mm or more, in a superimposition manner with steam. 6. An ultraviolet processing apparatus described in claim 1, wherein it is disposed in a one-by-one surface purification apparatus, and a surface being processed with steam is irradiated with ultraviolet rays that have a 50% transmissive distance to steam of 2 mm or more, in a superimposition manner with steam to remove organic matters and adhering particles. 7. An ultraviolet processing apparatus described in claim 1, wherein it is disposed in a one-by-one surface purification apparatus, and a surface being cleaned with ultrapure water or a liquid chemical is irradiated with ultraviolet rays that 50% transmissive distance to air is 2 mm or more, to perform a radical reaction process. 8. An ultraviolet, processing apparatus described in claim 1, wherein it is disposed in a resist removal apparatus used in a lithographic process and a surface being processed with steam is irradiated with ultraviolet rays to remove a resist.