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Actively controlled heat sink for convective burn-in oven 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01R-031/02
출원번호 US-0277233 (1999-03-26)
발명자 / 주소
  • Fredeman, John A.
  • Gardell, David L.
  • Knox, Marc D.
  • LaForce, Mark R.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Canale, Anthony J.Walsh, Robert A.Leas, James M.
인용정보 피인용 횟수 : 12  인용 특허 : 24

초록

A socket for testing or burning-in electronic components has a cover including a heat sink and a sensor. The heat sink and sensor are spring loaded so they make direct, temporary contact to an electronic component in the socket during burn-in. A heat transferring device is coupled to each heat sink.

대표청구항

A socket for testing or burning-in electronic components has a cover including a heat sink and a sensor. The heat sink and sensor are spring loaded so they make direct, temporary contact to an electronic component in the socket during burn-in. A heat transferring device is coupled to each heat sink.

이 특허에 인용된 특허 (24)

  1. Martinez Jose A. (Garden Grove CA) Gates ; Jr. Louis E. (Westlake Village CA), Adhesive heater and method for securing an object to a surface.
  2. Hashinaga Tatsuya (Yokohama JPX) Nishiguchi Masanori (Yokohama JPX), Burn-in apparatus and method which individually controls the temperature of a plurality of semiconductor devices.
  3. Jones Elmer R. (North Reading MA), Burn-in module.
  4. Jones Elmer R. (North Reading MA), Burn-in tower.
  5. Vandersande Ian W. ; Ewell Richard ; Fleurial Jean-Pierre ; Lyon Hylan B., Cooling device featuring thermoelectric and diamond materials for temperature control of heat-dissipating devices.
  6. Yamamoto Haruhiko (Yokohama JPX) Suzuki Masahiro (Tokyo JPX) Udagawa Yoshiaki (Tokyo JPX) Nakata Mitsuhiko (Kawasaki JPX) Katsuyama Koji (Yokohama JPX) Ono Izumi (Hachioji JPX) Kikuchi Shunichi (Yoko, Cooling system for an electronic circuit device.
  7. Hoover John W. (Huntington CT), Detachable apparatus for cooling integrated circuits.
  8. Atarashi Takayuki (Tsuchiura JPX) Hatada Toshio (Tsuchiura JPX) Daikoku Takahiro (Isehara JPX) Kawasaki Nobuo (Ibaraki-ken JPX) Iino Toshiki (Ibaraki-ken JPX) Tsukaguchi Tamotsu (Hiratsuka JPX) Kasai, Electronic apparatus.
  9. Johnson Robert G. (Minnetonka MN), Integrated voltage-isolation power supply.
  10. Fraser Douglas S. (Bloomingtion NY) Thompson ; Jr. Taylor N. (Kingston NY), Live component temperature conditioning device providing fast temperature variations.
  11. Thomas Daniel L. (San Jose CA) Hoover John W. (Huntington CT) Marracino Charles R. (Torrington CT), Low profile fan body with heat transfer characteristics.
  12. Gisdakis Spyridon (Munich DEX) Tews Helmut (Unterhaching DEX) Zwicknagl Peter (Stuttgart DEX), Measuring instrument for determining the temperature of semiconductor bodies and method for the manufacture of the measu.
  13. Hamilton Harold E. (Minneapolis MN) Bloch Brian R. (Cedar MN) Zimmer James R. (Cologne MN), Method for burn-in of high power semiconductor devices.
  14. Elder Richard A. (Dallas TX) Johnson Randy (Carrollton TX) Frew Dean L. (Garland TX) Wilson Arthur M. (Dallas TX), Non-destructive burn-in test socket for integrated circuit die.
  15. Laine Bernard (Nogent-sur-Marne FRX), Oven for burning in electronics modules.
  16. Pollock George G. (San Ramon CA), Precision control of high temperature furnaces using an auxiliary power supply and charged practice current flow.
  17. Clemens Donald (The Colony TX) Smithers Matthew C. (Lewisville TX), Strap spring for heat sink clip assembly.
  18. Burward-Hoy Trevor (Cupertino CA), Sub-ambient temperature electronic package.
  19. Hamilton Harold E., Temperature control for high power burn-in for integrated circuits.
  20. Burton David P. (Parteen IEX) Dillon Paul A. (Foxrock IEX) Stephenson Malcolm I. (Adare IEX), Temperature control instrument for electronic components under test.
  21. Jones Elmer R. (North Reading MA), Thermal control system for a semi-conductor burn-in.
  22. Kufis James C. (Sunnyvale CA) Semken Robert S. (Sunnyvale CA), Thermal fixture for testing integrated circuits.
  23. Kufis James C. (Sunnyvale CA) Semken Robert S. (Sunnyvale CA), Thermal fixture for testing integrated circuits.
  24. Lee Richard M. L. (8F-6 ; No. 100 ; Sec. 2 ; Hoping E. Road Taipei TWX), Thermostat controlled cooler for a CPU.

이 특허를 인용한 특허 (12)

  1. Wong, Wei Ping; Chiew, Chee Keong; Lee, Kok Hua, Burn-in system for electronic devices.
  2. Cho,Nam Soo; Jhee,Sung; Lee,Jang Seok, Defroster for heat exchanger and fabrication method thereof.
  3. Ono, Haruyoshi, Device and method for controlling temperature of semiconductor module.
  4. Conti,Dennis R.; Gamache,Roger; Gardell,David L.; Knox,Marc D.; Van Horn,Jody J, Device burn in utilizing voltage control.
  5. Wright, Nathan W., Heat transfer apparatus for burn-in board.
  6. Zhang, Yang, Method and apparatus for cooling a telecommunication device.
  7. Bowman, John K.; Cieluch, Steven R.; Boudreau, David; Field, Daniel A.; Morgan, Dale T., Power measurement transducer.
  8. Bowman, John K.; Cieluch, Steven R.; Boudreau, David; Field, Daniel A.; Morgan, Dale T., Power measurement transducer.
  9. Wienand, Karl-Heinz; Ullrich, Karlheinz, Semiconductor component with integrated circuit, cooling body, and temperature sensor.
  10. Hsieh, Wayne, Socket having fan.
  11. Belady, Christian L.; Haden, Stuart C.; Wirtzberger, Paul A., Test method for characterizing currents associated with powered components in an electronic system.
  12. Yen,Wen Dong, Testing apparatus and method for providing temperature stress to electronic component.
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