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Failure-tolerant high-density card rack cooling system and method 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0882167 (2001-06-15)
발명자 / 주소
  • Heard, Christopher S.
출원인 / 주소
  • Cereva Networks. Inc.
대리인 / 주소
    Kudirka & Jobse, LLP
인용정보 피인용 횟수 : 26  인용 특허 : 9

초록

Impellers are used in the pull tray of a failure tolerant cooling system and are isolated from each other by baffles, so that each impeller has its own exhaust air flow path with an predetermined airflow resistance. The exhaust airflow resistance is sufficiently low that the associated impeller can

대표청구항

Impellers are used in the pull tray of a failure tolerant cooling system and are isolated from each other by baffles, so that each impeller has its own exhaust air flow path with an predetermined airflow resistance. The exhaust airflow resistance is sufficiently low that the associated impeller can

이 특허에 인용된 특허 (9)

  1. Scheibler Edy (Wetzikon CHX), Card cage having an air cooling system.
  2. Lee Mario J. ; Eberhardt Anthony N. ; Eberhardt Eric R., Compact computer having a redundant air moving system and method thereof.
  3. Schmitt Ty, Computer and an assembly and method for cooling a computer.
  4. Koike Norihiro (Tokyo JPX), Cooling system for cooling electronic apparatus.
  5. French F. William, Electrical cabinet.
  6. Ekrot Alexander C. ; Shero James P., Electronic apparatus having removable processor/heat pipe cooling device modules therein.
  7. Yoshikawa Minoru,JPX, Electronic device cooling system having guides for guiding a flow of the air evenly.
  8. Heckner Helmut,DEX ; Rickinger Thomas,DEX ; Neblich Josef,DEX ; Spateneder Werner,DEX, Means for the ventilation of electrical and electronic equipment and subassemblies.
  9. Sachs Ernest J. (Framingham MA) Spechts Lee (Billerica MA) Tirrell Paul (Uxbridge MA) ..AP: EMC Corporation (Hopkinton MA 02), Self-aligning hot-pluggable fan assembly.

이 특허를 인용한 특허 (26)

  1. Lima,David J.; Prather,Eric R., Airflow distribution through an electronic device.
  2. Gravell, Anthony R.; Barlow, Richard J., Balanced flow cooling.
  3. Cheng, Hao-Der; Peng, Wen-Tang, Computer server system and fan module thereof.
  4. Vorreiter, Loren, Configurable telecommunication equipment chassis.
  5. Carlson, Brian P.; Chernik, Ryan A.; Dahlgren, Aron D.; Nelson, Wesley M., Controller enclosure, mounting and orientation of same.
  6. Bisson, Sylvio; Lotz, Willi Manfred, Cooling high performance computer systems.
  7. Yamada,Satoru, Cooling structure of electronic equipment and information processing equipment using the cooling structure.
  8. Carlson, Andrew; Hamburgen, William; Clidaras, Jimmy, Data center air circulation.
  9. Mease,Keith D.; Smith,Grant M.; Ruscitelli,John, Fan tray assembly.
  10. Coglitore, Giovanni; Casebolt, Matthew P.; Weisikle, Robert L., Flow-through cooling for computer systems.
  11. Sygulla, John Michael; Ramakrishnan, Arun; Slowiak, Greg, Hierarchical system manager rollback.
  12. Jacques,Joseph; Nguyen,Hiep; Garcia,Osvalso, High efficiency counter-flow shelf cooling system.
  13. Kobayashi, Norio, Information-processing apparatus and cooling system used therein.
  14. Kirklin, Matthew C, Method for remedial action in the event of the failure of the primary air flow measurement device in a fuel cell system.
  15. Sharma, Viswa N.; Chu, William; James, Allen D.; Tseng, Ming Siu; Schlegel, Neil; Lentz, David; Sonnek, Christopher D., Modular chassis providing scalable mechanical, electrical and environmental functionality for MicroTCA and Advanced TCA boards.
  16. Clidaras, Jimmy; Whitted, William; Hamburgen, William; Sykora, Montgomery; Leung, Winnie; Aigner, Gerald; Beaty, Donald L., Modular computing environments.
  17. Modica, Steve, Modular fan brick and method for exchanging air in a brick-based computer system.
  18. Sharma, Viswa; Holschbach, Roger; Stuck, Bart; Chu, William, Omni-protocol engine for reconfigurable bit-stream processing in high-speed networks.
  19. Anderl, William James; Huettner, Cary Michael, Real time adaptive active fluid flow cooling.
  20. Wang, Shi-Feng, Server.
  21. Huang, Ying-Hui; Tung, Tien-Hsiung; Mo, Pao-Kang; Liu, Te-Wei, Server device.
  22. Kinstle, Robert Michael; Schlichter, Kevin; Barron, Seitu, Server with heat pipe cooling.
  23. Kinstle, Robert Michael; Schlichter, Kevin; Barron, Seitu, Server with heat pipe cooling.
  24. Sharma, Viswa N.; Ketchum, Breton A., Shelf management controller with hardware/software implemented dual redundant configuration.
  25. French,F. William; Nigro, Jr.,Arthur Robert, Techniques for cooling a set of circuit boards within a rack mount cabinet.
  26. Ong, Tony, Thermal control system.
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