$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Server having an air flow guide device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0950649 (2001-09-13)
우선권정보 TW-089219263 (2000-11-06)
발명자 / 주소
  • Wu, Jeff
출원인 / 주소
  • Giga-Byte Technology Co., Ltd.
대리인 / 주소
    Rosenberg, Klein & Lee
인용정보 피인용 횟수 : 64  인용 특허 : 8

초록

A server having an air flow guide device includes a support frame, a fan set mounted in the support frame, and an air flow guide device including a guide body mounted in the support frame and located behind the fan set. The guide body defines an air flow guide region. Thus, the air flow guide region

대표청구항

1. A server having an air flow guide device, comprising: a support frame; a fan set mounted in said support frame; and an air flow guide device including a guide body mounted in said support frame and located behind said fan set, to guide and collect an air flow produced by operation of said fa

이 특허에 인용된 특허 (8)

  1. Fritschle Claus,DEX ; Heesen Klaus,DEX, Casing with a fan unit and fan unit.
  2. Daniel D. Gonsalves ; Robert S. Antonuccio, Chip cooling management.
  3. Gordon Mark G., Chip stack with active cooling system.
  4. Butterbaugh Matthew A. (Rochester MN) Dingfelder Donald W. (Winona MN) Herman Peter M. (Oronoco MN) Kang Sukhvinder S. (Rochester MN), Cooling apparatus for electronic chips.
  5. Gerard MacManus GB; Bruce Fryers GB; Nicholas Foley GB; Michael Tate GB, Cooling devices.
  6. Crane ; Jr. Stanford W. ; Krishnapura Lakshminarasimha ; Behar Moises ; Dutta Arindum ; Link Kevin J. ; Ahearn Bill, Cooling system for semiconductor die carrier.
  7. Marquis Terrance M. ; Duley Raymond S., Duct processor cooling for personal computer.
  8. Lee Richard (7F ; No. 152-1 ; Sec. 7 ; Chung Shan N. Rd. Taipei TWX), Heat dissipating apparatus.

이 특허를 인용한 특허 (64)

  1. Tanner, James; Hamburgen, William Riis, Active cooling debris bypass fin pack.
  2. Tanner, James; Hamburgen, William Riis, Active cooling debris bypass fin pack.
  3. Tanner, James; Hamburgen, William Riis, Active cooling debris bypass fin pack.
  4. Lai, Yu-Chia, Air guiding device and heat dissipation system having same.
  5. Barsun,Stephan K., Airflow control baffle.
  6. Scott, Walter Denton; Defilippi, Jeffrey Carl; Borland, David James; Beatty, Stephan Leonidas; Geist, Edward D., Airflow ducting apparatus for data processing systems.
  7. Slagle, Richard A., Airflow guides using silicon walls/creating channels for heat control.
  8. Guan, Zhi-Bin, Airflow guiding cover and electronic device having the same.
  9. Stock, Michael; Campbell, Brenda; Robbins, Jonathan, Apparatus and method for cooling electrical components of a computer.
  10. Holmes, Steven; Heirich, Douglas L., Apparatus for air cooling of an electronic device.
  11. Holmes, Steven; Heirich, Douglas L., Apparatus for air cooling of an electronic device.
  12. Holmes,Steven; Heirich,Douglas L., Apparatus for air cooling of an electronic device.
  13. Holmes,Steven; Heirich,Douglas L., Apparatus for air cooling of an electronic device.
  14. McClellan, Jeffrey R.; Heller, Deborah H.; Torok, James Xavier; Krisher, Dale, Apparatus for cooling electronics.
  15. Hung,Kuo Chuan, CPU heat dissipating unit.
  16. Farrow, Timothy Samuel; Ent, Ali Kathryn; Li, Shuang; Makley, Albert Vincent; Hilliard, Sean, Computer baffle.
  17. Brooks,Michael A.; Larson,Thane M., Computer cooling system and method.
  18. Tracy, Mark S.; Doczy, Paul J.; Lev, Jeffrey A., Computer device cooling system.
  19. Lee, Sheng-Hung; Yin, Xiu-Zhong; Chen, Li-Ping, Computer enclosure with airflow-guiding device.
  20. Chang, Yao-Ting, Computer having airflow guiding device.
  21. Lai, Hsiu-Chang; Ye, Zhen-Xing; Sun, Ke; Chen, Ming-Ke; Chen, Xiao-Zhu, Computer having apparatuses for cooling elements.
  22. Coglitore,Giovanni, Computer rack cooling system with variable airflow impedance.
  23. Kim, David J.; Ruckman, William W.; Kozaczuk, Anthony, Computer system and enclosure thereof.
  24. Cheng, Hao-Der, Computer system with backplane.
  25. Olesiewicz,Timothy W.; White,M. Sean, Configurable flow control air baffle.
  26. Nakamura,Hiroyoshi, Control box.
  27. Whitted, William H., Cooling baffle and fan mount apparatus.
  28. Le, Thoai-Thai; Gerstmeier, Guenter; Ma, David SuitWai; Wang, Tao, Cooling hood for circuit board.
  29. Lai, Yu-Chia, Cooling system for electronic device and electronic device having same.
  30. Lin, Tai-Wei; Chen, Chin-Hui, Cooling system for electronic device and electronic device having same.
  31. Suzuki, Osamu; Yasuda, Yosuke; Horiuchi, Keisuke; Hayashi, Tomoo; Nishihara, Atsuo; Funakoshi, Sunao, Cooling system for onboard electrical power converter, and electrical power converter for railway vehicle.
  32. Chang,Yao Ting, Cooling system for server and server having the same.
  33. Whitted, William H., Drive cooling baffle.
  34. Shan, Liang-Qing; Li, Yang; Lin, Yu-Hsu; Wu, Jeng-Da; Cao, Liang-Liang; Guo, Lei, Electronic apparatus with air guiding element.
  35. Fujiya,Hiromitsu; Kimura,Hideki, Electronic component unit.
  36. Fujiya, Hiromitsu; Kimura, Hideki, Electronic component unit and electronic apparatus.
  37. Chen, Jing; Chen, Chien-Lung, Electronic device.
  38. Umematsu, Misao, Electronic device.
  39. Lee, Sheng-Hung; Chen, Li-Ping, Electronic device with air guiding duct.
  40. Guan, Zhi-Bin, Electronic device with thermal insulation member for heat sink.
  41. Kajiura,Katsuyuki, Electronic equipment.
  42. Suzuki,Katsuyoshi; Takahashi,Hirokazu; Horii,Masakatsu; Tateyama,Kenichi; Takahashi,Taro; Suwa,Hiroshi; Furuta,Kouji, Electronic equipment.
  43. Chen,Yu Lin, Electronic product having airflow-guiding device.
  44. Kubo, Hideo; Suzuki, Masahiro, Electronics device unit.
  45. Gan, Li Yuan, Fan duct assembly.
  46. Liu, Lei; He, Ai-Ling, Heat dissipation device and electronic device having same.
  47. Chen,Chin Hui, Heat dissipation device incorporating fan duct.
  48. Huang, Guo-He, Heat dissipation system.
  49. Sygulla, John Michael; Ramakrishnan, Arun; Slowiak, Greg, Hierarchical system manager rollback.
  50. Gundlach,John G., Hot swappable cooling fan system.
  51. Chu, Richard C.; Ellsworth, Jr., Michael J.; Furey, Edward; Schmidt, Roger R.; Simons, Robert E., Method for combined air and liquid cooling of stacked electronics components.
  52. Seibold, Lawrence B., Power supply cooling system.
  53. Coster, Daniel J.; De Iuliis, Daniele; Goh, Chiew-Siang; Heirich, Douglas L.; Holmes, Steven; Ive, Jonathan; Kim, Sung; Mariano, Rick; Misage, Thomas J.; Riccio, Dan; Tan, Tang Yew; Yaekel, Jeremy, Quick release structures for a computer.
  54. Coster, Daniel J.; De Iuliis, Daniele G.; Goh, Chiew-Siang; Heirich, Douglas L.; Holmes, Steven W.; Ive, Jonathan P.; Kim, Sung H.; Mariano, Ricardo A.; Misage, Thomas J.; Riccio, Daniel J.; Tan, Tang Y.; Yaekel, Jeremy, Quick release structures for a memory drive.
  55. Wobig,Eric C.; Thornton,David S.; Duncan,Tyler B., Reinforced air shroud.
  56. Searby, Tom J.; Crane, Robert L., Removable airflow guide assembly for a computer system.
  57. Chen, Po-Ching, Server and cooler moduel arrangement.
  58. Kinstle, Robert Michael; Schlichter, Kevin; Barron, Seitu, Server with heat pipe cooling.
  59. Kinstle, Robert Michael; Schlichter, Kevin; Barron, Seitu, Server with heat pipe cooling.
  60. Zhang, Xin-Ping, Server with improved layout.
  61. Bash,Cullen E.; Simon,Glenn C.; Malone,Christopher G.; Sharma,Ratnesh K., Small form factor liquid loop cooling system.
  62. Tucker,Sean W.; Searby,Tom J.; Roesner,Arlen L., System and method for cooling components in an electronic device.
  63. Dey, Subhrajit; Moeleker, Petrus Joannes Joseph; Balan, Chellappa, System and method for cooling electronic systems.
  64. Dey,Subhrajit (nmn); Moeleker,Petrus Joannes Joseph; Balan,Chellappa (nmn), System and method for cooling electronic systems.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로