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Adhesion of polymeric materials to metal surfaces 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B44G-001/22
출원번호 US-0628036 (2000-07-27)
발명자 / 주소
  • Whitney, Jr., Dickson L.
  • Bokisa, George S.
  • Bishop, Craig V.
  • Vitale, Americus C.
출원인 / 주소
  • Atotech Deutschland GmbH
대리인 / 주소
    Renner, Otto, Boisselle & Sklar, LLP
인용정보 피인용 횟수 : 37  인용 특허 : 18

초록

The present invention relates to a process for treating a metal substrate to improve adhesion of polymeric materials thereto, comprising the steps of intergranular etching a surface of the metal substrate; and applying an immersion plated metal to the intergranular etched surface by immersing th

대표청구항

The present invention relates to a process for treating a metal substrate to improve adhesion of polymeric materials thereto, comprising the steps of intergranular etching a surface of the metal substrate; and applying an immersion plated metal to the intergranular etched surface by immersing th

이 특허에 인용된 특허 (18)

  1. Bokisa George S. (North Olmsted OH) Willis William J. (North Royalton OH), Aqueous electroless plating solutions.
  2. Sexsmith Frederick H., Aqueous silane adhesive compositions.
  3. Price Andrew David,GB2 ; McGrath Peter Thomas, Copper coating of printed circuit boards.
  4. Bishop Craig V. ; Kochilla John R. ; Durante Robert J. ; Bokisa George S., Copper etching compositions and method for etching copper.
  5. Aso Kazuyoshi,JPX ; Noguchi Masami,JPX ; Kobayashi Katsumi,JPX ; Yamagishi Takeshi,JPX, Copper foil for printed wiring board.
  6. Sadey Richard J. ; Zatt Dennis M., Metal foil with improved peel strength and method for making said foil.
  7. Ferrier Donald ; Yakobson Eric, Method for enhancing the solderability of a surface.
  8. Whewell Christopher J. (Chesterland OH) Clouser Sidney J. (Chardon OH) Lee Chin-ho (Lyndhurst OH), Method for printed circuit board pattern making using selectively etchable metal layers.
  9. Akahoshi Haruo (Hitachi JPX) Murakami Kanji (Mito JPX) Wajima Motoyo (Hitachi JPX) Kogawa Kiyonori (Hadano JPX) Toba Ritsuji (Hadano JPX) Shimazaki Takeshi (Hitachi JPX), Method of bonding copper and resin.
  10. Berdan Betty L. (Willowick OH) Luce Betty M. (Willowick OH), Method of forming a printed circuit.
  11. Maki Yoshiro,JPX ; Nakagawa Toshiko,JPX ; Yamada Yasushi,JPX ; Haruta Takashi,JPX ; Arimura Maki,JPX, Microetching method for copper or copper alloy.
  12. Bokisa George S., Multilayer circuit boards and processes of making the same.
  13. Palladino John V. (Paulsboro NJ), Multilayer printed circuit board formation.
  14. Mikado Yukinobu,JPX ; Hiramatsu Yasuji,JPX ; En Honchin,JPX, Printed wiring board and method for manufacturing the same.
  15. Ferrier Donald, Process for improving the adhesion of polymeric materials to metal surfaces.
  16. Fairweather William A.,GBX, Surface treatment of copper.
  17. Holtzman Abraham M. (Bat Yam ILX) Relis Joseph (Ramat Gan ILX), Use of immersion tin and tin alloys as a bonding medium for multilayer circuits.
  18. Holtzman Abraham M. (Bat Yam ILX) Relis Joseph (Ramat Gan ILX), Use of immersion tin coating as etch resist.

이 특허를 인용한 특허 (37)

  1. Hauf,Uwe; Fuerhaupter,Harry; Stiop,Alexey; Grieser,Udo, Acidic treatment liquid and method of treating copper surfaces.
  2. Owei, Abayomi I.; Nguyen, Hiep X.; Yakobson, Eric, Adhesion promotion in printed circuit boards.
  3. Owei, Abayomi I.; Nguyen, Hiep X.; Yakobson, Eric, Adhesion promotion in printed circuit boards.
  4. Owei, Abayomi I.; Nguyen, Hiep X.; Yakobson, Eric, Adhesion promotion in printed circuit boards.
  5. Owei,Abayomi I.; Nguyen,Hiep X.; Yakobson,Eric, Adhesion promotion in printed circuit boards.
  6. Naritomi, Masanori; Andoh, Naoki, Aluminum alloy composite and method for joining thereof.
  7. Moore, Richard, Coating solution for metal surfaces.
  8. Walsh, Sean R.; Harris, Christopher L., Composite binding materials.
  9. Kobayashi, Yoshiaki, Electric contact material, method for manufacturing the electric material, and electric contact.
  10. Ko,Yong Kyun; Chon,Sang Mun; Doh,In Hoi; Jun,Pil Kwon; Lee,Sang Mi; Lim,Kwang shin; Han,Myoung Ok, Etching composition, method of preparing the same, method of etching an oxide film, and method of manufacturing a semiconductor device.
  11. Cheung, Robin; Kong, Wen Zhong, Immersion platinum plating solution.
  12. Cheung, Robin; Kong, Wen Zhong, Immersion platinum plating solution.
  13. Wilson, Gary, Metal cladding composition.
  14. Wilson, Gary, Metal cladding composition, additive, method and system.
  15. Feng, Kesheng; Wang, Ming De; Castaldi, Steven A., Metal surface treatment composition.
  16. Geddes, Chris D.; Aslan, Kadir, Metal-enhanced fluorescence from plastic substrates.
  17. Geddes, Chris D.; Aslan, Kadir, Metal-enhanced fluorescence from plastic substrates.
  18. Benjavasukul, Woraya; Somrubpornpinan, Thipyaporn; Charapaka, Panikan, Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide.
  19. Benjavasukul, Woraya; Somrubpornpinan, Thipyaporn; Charapaka, Panikan, Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide.
  20. Benjavasukul, Woraya; Somrubpornpinan, Thipyaporn; Charapaka, Panikan, Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide.
  21. Long, Ernest; Toscano, Lenora M.; Romaine, Paul; McKirryher, Colleen; Kologe, Donna M.; Castaldi, Steven A.; Steinecker, Carl P., Method for enhancing the solderability of a surface.
  22. Lee, S. Kevin; Lee, Harry; Ram, J. Rajeev, Method of hydrolytically stable bonding of elastomers to substrates.
  23. Mathew, Varughese, Method of improving adhesion of bond pad over pad metallization with a neighboring passivation layer by depositing a palladium layer.
  24. Kurii, Yoshihiro; Kameda, Etsuji; Nakamura, Sachiko, Micro-etching composition for copper or copper alloy, micro-etching method, and method for manufacturing printed circuit board.
  25. Feng,Kesheng; Kapadia,Nilesh; Castaldi,Steve, Microetching solution.
  26. Kurii, Masayo; Tai, Kiyoto; Nakamura, Mami, Microetching solution for copper, replenishment solution therefor and method for production of wiring board.
  27. Kurii, Masayo; Tai, Kiyoto; Nakamura, Mami, Microetching solution for copper, replenishment solution therefor and method for production of wiring board.
  28. He, Lingyun; Whisenhunt, Jr., Donald W.; Melzer, Jeffrey I.; Eodice, Andrea Keys; Chisholm, Bret; Carter, Christopher M.; Su, Shiu-Chin H; Guyer, Kendall L.; Hunter, Matthew M., No-rinse pretreatment methods and compositions.
  29. Chamberlin, Bruce John; Chu, Chang-Min; Hu, Gao-Bin; Kuczynski, Joseph; Tsang, Kaspar Ka Chung, Plated through hole void detection in printed circuit boards by detecting a pH-sensitive component.
  30. Chamberlin, Bruce John; Chu, Chang-Min; Hu, Gao-Bin; Kuczynski, Joseph; Tsang, Kaspar Ka Chung, Plated through hole void detection in printed circuit boards by detecting a pH-sensitive component.
  31. Grieser, Udo; Meyer, Heinrich; Hauf, Uwe, Process for the preliminary treatment of copper surfaces.
  32. Sirinorakul, Saravuth, Semiconductor package with full plating on contact side surfaces and methods thereof.
  33. Yenrudee, Suebphong; Kongpoung, Chanapat; Hongsongkiat, Sant; Ounkaew, Siriwanna; Injan, Chatchawan; Sirinorakul, Saravuth, Semiconductor package with plated metal shielding and a method thereof.
  34. Gonthier,Michel, Sized glass yarns, sizing composition and composites comprising said yarns.
  35. Thomas, Christina Kay; Ryves, Luke J.; Storey, Daniel M., Spinulose titanium nanoparticulate surfaces.
  36. Su, Shiu-Chin (Cindy) H.; Guyer, Kendall L.; Melzer, Jeffrey I.; Carter, Christopher M.; Hunter, Matthew M.; Eodice, Andrea Keys; Whisenhunt, Jr., Donald W.; He, Lingyun; Chisholm, Bret, Storage stable composition of partial and/or complete condensate of hydrolyzable organofunctional silane.
  37. Tsuchida, Katsuyuki; Kumagai, Masashi; Akase, Fumiaki, Surface treated copper film.
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