$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Ambient-temperature-stable, one-part curable epoxy adhesive

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-009/04
  • B32B-027/38
  • B32B-027/04
  • C08J-007/18
  • C08K-009/00
출원번호 US-0010690 (2001-11-09)
발명자 / 주소
  • Brandys, Frank A.
  • Irwin, Michael J.
  • Tarbutton, Kent S.
출원인 / 주소
  • 3M Innovative Properties Company
대리인 / 주소
    Little, Douglas B.Knecht, Harold C.
인용정보 피인용 횟수 : 24  인용 특허 : 30

초록

A one-part curable epoxy adhesive composition is provided. The adhesive comprises curable epoxy resin, a latent curative system comprising (a) at least one first curative encapsulated in thermoplastic polymeric microcapsules and (b) a second latent curative admixed in the curable epoxy resin, and su

대표청구항

A one-part curable epoxy adhesive composition is provided. The adhesive comprises curable epoxy resin, a latent curative system comprising (a) at least one first curative encapsulated in thermoplastic polymeric microcapsules and (b) a second latent curative admixed in the curable epoxy resin, and su

이 특허에 인용된 특허 (30)

  1. Maranci Artun (Westport CT) Peake Steven L. (Ridgefield CT) Kaminski Stanley S. (Stamford CT), Advance composites with thermoplastic particles at the interface between layers.
  2. Drain Kieran F. (Madison Heights MI) Dunn David J. (Aurora OH), Compositions curable by in situ generation of cations.
  3. Hoffman Dwight K. (Midland MI) Dellar David V. (Beaverton MI) Schlameus Herman W. (San Antonio TX), Encapsulated active materials and method for preparing same.
  4. Turpin Russell L. (Canyon Country CA) Green Anthony L. (Arcadia CA), Encapsulation of thermoplastic particles for production of composites.
  5. Marhevka Virginia C. ; Griggs Allen L. ; Tarbutton Kent S., Epoxy adhesives with dithiooxamide adhesion promoters.
  6. Babayan Eduard P. (Huntington Beach CA) Nguyen Hoa X. (Santa Ana CA), Epoxy matrix containing amine hardener and micropulverized polyimide.
  7. Ashida Tadashi (Yokohama JPX) Ohnishi Masahiko (Yokosuka JPX) Nagase Toshio (Ibaragi JPX) Nakayama Akira (Yokosuka JPX), Epoxy resin adhesive composition.
  8. Tarbutton Kent S. (Lake Elmo MN) Robins Janis (St. Paul MN) Tangen John C. (Glenwood MN), Epoxy resin composition.
  9. Tarbutton Kent S. (Lake Elmo MN) Robins Janis (St. Paul MN) Tangen John C. (Glenwood MN), Epoxy resin composition.
  10. Hagiwara Shinsuke,JPX ; Saitoh Hiroyuki,JPX ; Sashima Hiroki,JPX ; Huber Peter,DEX ; Deubzer Bernward,DEX ; Geck Michael,DEX, Epoxy resin molding for sealing electronic parts containing organic polymer-grafted silicone.
  11. Hirano Yasuhiro,JPX ; Akiba Masatsugu,JPX ; Yokota Akira,JPX ; Nakamura Hiroshi,JPX ; Naitoh Shigeki,JPX, Epoxy resin, resin composition, and resin-encapsulated semiconductor device.
  12. Wong Raymond S. (San Ramon CA), Expandable films and molded products therefrom.
  13. Lamon Alain H. (Osny FRX) Le Cozannet Sylvie C. (Maisons-Laffite FRX), Fire-resistant essentially halogen-free epoxy composition.
  14. Thom ; Karl F., Imidazole type curing agents.
  15. Thom ; Karl Friedrich, Imidazole type curing agents and latent systems containing them.
  16. Newell Richard G. (Woodbury MN), Latent Lewis acid catalyst system and process.
  17. Lehmann Hans (Aesch CHX), Liquid or pasty thermosetting adhesive which can be pre-gelled and which is based on epoxide resin, and the use of this.
  18. Sawaoka Ryuji,JPX ; Kouchi Shinji,JPX ; Muraki Toshio,JPX, Microcapsule-type curing agent, method for producing the same, thermosetting resin composition, prepreg and fiber reinf.
  19. Hayai Hiroshi,JPX, Multilayer printed circuit board and process for producing and using the same.
  20. Wong Raymond S. (San Ramon CA), Oriented expanded molded products.
  21. Oka Koichiro (Ibaraki JPX) Hagiwara Ikuo (Ohtsu JPX), Powdery adhesive and process for preparation thereof.
  22. Oosedo Hiroki,JPX ; Noda Shunsaku,JPX, Prepreg of reinforcing fibers, epoxy resins, crosslinked rubber particles and curing agent.
  23. Chernack Milton (399 June Pl. West Hempstead NY 11552), Pressure sensitive adhesive composition.
  24. Takeda Keiji (Kanagawa JPX) Tsukahara Jiro (Kanagawa JPX) Sato Kozo (Kanagawa JPX), Process for formation of base and light-sensitive material.
  25. Yamamoto Hiroshi (Moriguchi JPX) Fukui Taro (Osaka JPX), Thermosetting polyimide composition, thermoset product thereof and manufacturing process thereof.
  26. Boyd Jack D. (Westminster CA), Toughened thermosetting structural materials.
  27. Folda Thomas (Neuleiningen CA DEX) Boyd Jack D. (Westminster CA) Tesch Helmut (Birkenheide DEX) Weber Thomas (Ludwigshafen CA DEX) Recker Hans G. (Irvine CA), Toughened thermosetting structural materials.
  28. Recker Hans G. (Irvine CA) Hartness J. Timothy (Tega Cay SC) Folda Thomas (Neuleiningen DEX) Tesch Helmut (Birkenheide DEX) Weber Thomas (Ludwigshafen DEX) Boyd Jack D. (Westminster CA), Toughened thermosetting structural materials.
  29. Recker Hans G. (Irvine CA) Altsaedt Volker (Gernsheim DEX) Tesch Helmut (Roedersheim/Gronau DEX) Weber Thomas (Ludwigshafen DEX), Toughened, fiber-reinforced thermosetting resin matrix prepregs and composites made therefrom.
  30. Recker Hans G. (Irvine CA), Toughening of brittle epoxy resin matrices with functionalized particulate elastomers.

이 특허를 인용한 특허 (24)

  1. Czaplicki, Michael J.; Kosal, David, Activatable material.
  2. Czaplicki,Michael J.; Hable,Christopher; Carlson,David, Activatable material for sealing, baffling or reinforcing and method of forming same.
  3. Sheasley,David; Kosal,David; Antrim,Jeanne, Activatable material for sealing, baffling or reinforcing and method of forming same.
  4. Kassa, Abraham; Hable, Christopher; Finerman, Terry, Adhesive materials, adhesive parts formed therewith and their uses.
  5. Wolf, II, Erich W., Apparatus and method for the dispensing of bone cement.
  6. Werner, Dietmar, Cavity filling.
  7. Schroeder, Jessica A.; Sachdev, Anil K.; Verbrugge, Mark W.; Pederson, Thomas C., Corrosion inhibitors in adhesive bonding of vehicle body structures.
  8. Kassa,Abraham; Harthcock,Matthew; Apfel,Jeffrey, Expandable material.
  9. Anning,Bruce D., Helicopter rotor and method of repairing same.
  10. Liu, Chenmin; Lu, Dong; Lang, Xianxin; Wang, Bo; Li, Zhiying, High performance die attach adhesives (DAAs) nanomaterials for high brightness LED.
  11. Knight,Andrew F., Ink pen for dispensing ink having time-dependent characteristics.
  12. Plaut, David J.; Tsuji, Sean M.; Ong, Chin Teong; Lee, Siang Kwang, Low temperature curable epoxy tape and method of making same.
  13. Kassa, Abraham; Apfel, Jeffrey R., Magnetic composition.
  14. Finerman, Terry; Carlson, David; Harthcock, Matthew; Knepper, Craig; Chmielewski, Craig; Ferng, William B.; Hable, Christopher; Kassa, Abraham; Jensen, Blair, Method of sealing an interface.
  15. Kassa,Abraham; Bradley,Renee, Paintable seal system.
  16. Carlson, David; Madaus, Brandon; Harthcock, Matthew; Barton, Kearney; Taylor, Charles L.; Walker, Jason, Panel structure.
  17. Sahouani, Hassan; Caruso Dailey, Mary M.; Heinzen, Luke E.; El Hedok, Ibrahim A., Release of biologically active agents from polymeric composite particles.
  18. Finerman, Terry; Kassa, Abraham, Sealant material.
  19. Chmielewski, Craig; Madaus, Brandon, Structural composite laminates.
  20. Czaplicki, Michael J.; Kosal, David J.; Antrim, Jeanne, Structural hot melt material and methods.
  21. Czaplicki, Michael J.; Kosal, David J.; Madaus, Keith, Two component (epoxy/amine) structural foam-in-place material.
  22. Czaplicki,Michael J.; Kosal,David J.; Hicks,Kevin, Two component (epoxy/amine) structural foam-in-place material.
  23. Czaplicki, Michael J.; Kosal, David J.; Madaus, Keith, Two-component (epoxy/amine) structural foam-in-place material.
  24. Finerman,Terry; Kassa,Abraham, Weldable synthetic material.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트