A one-part curable epoxy adhesive composition is provided. The adhesive comprises curable epoxy resin, a latent curative system comprising (a) at least one first curative encapsulated in thermoplastic polymeric microcapsules and (b) a second latent curative admixed in the curable epoxy resin, and su
A one-part curable epoxy adhesive composition is provided. The adhesive comprises curable epoxy resin, a latent curative system comprising (a) at least one first curative encapsulated in thermoplastic polymeric microcapsules and (b) a second latent curative admixed in the curable epoxy resin, and sufficient particulate thermoplastic polymeric material to at least partially regionally plasticize the cured epoxy resin wherein up to all of the particulate thermoplastic polymeric material may be provided by the walls of the microcapsules. A method of curing the adhesive by heating the composition is also provided. A joint made by adhering members together with the adhesive composition and a method of making the joint are also provided.
대표청구항▼
A one-part curable epoxy adhesive composition is provided. The adhesive comprises curable epoxy resin, a latent curative system comprising (a) at least one first curative encapsulated in thermoplastic polymeric microcapsules and (b) a second latent curative admixed in the curable epoxy resin, and su
A one-part curable epoxy adhesive composition is provided. The adhesive comprises curable epoxy resin, a latent curative system comprising (a) at least one first curative encapsulated in thermoplastic polymeric microcapsules and (b) a second latent curative admixed in the curable epoxy resin, and sufficient particulate thermoplastic polymeric material to at least partially regionally plasticize the cured epoxy resin wherein up to all of the particulate thermoplastic polymeric material may be provided by the walls of the microcapsules. A method of curing the adhesive by heating the composition is also provided. A joint made by adhering members together with the adhesive composition and a method of making the joint are also provided. aid conductive filler material is selected from the group consisting of carbon black, graphite, metallic particles, intrinsically conductive polymers, carbon fibers, and mixtures thereof. 3. The semiconductive jacket material of claim 1, wherein said minor phase material is a semicrystalline polymer having a crystallinity from about 30% to about 80%. 4. The semiconductive jacket material of claim 1, wherein said semicrystalline polymer is high density polyethylene with a crystallinity of about ≥70%. 5. The semiconductive jacket material of claim 1, wherein said major phase material is comprised of a poly(ethylene-co-vinyl acetate). 6. The semiconductive jacket material of claim 5, wherein said poly(ethylene-co-vinyl acetate) has a vinyl acetate content of greater than about 40% by weight and said minor phase material with conductive filler material dispersed therein comprising about 50% by weight of said ternary composite. 7. The semiconductive jacket material of claim 5, wherein said poly(ethylene-co-vinyl acetate) has a vinyl acetate content of less than about 40% by weight. 8. The semiconductive jacket material of claim 1, wherein said minor phase material has a solubility parameter δA,said major phase material has a solubility parameter δB,and said ternary composite meets the following criteria for immiscibility, 7≥(δA-δB)2≥0. 9. The semiconductive jacket material of claim 1, wherein said semicrystalline polymer high density polyethylene of crystallinity of ≥70%, said major phase material is a poly(ethylene-co-vinyl acetate) with vinyl acetate content of less than about 40%, and said conductive filler material is selected from the group consisting of carbon black, graphite, metallic particles, intrinsically conductive polymers, carbon fibers, and mixtures thereof. 10. The semiconductive jacket material of claim 1, further comprising: a second major phase material, wherein said ternary composite is dispersed in an amount sufficient for said ternary composite to be continuous within said second major phase material, said second major phase material being selected from a group of polymers which when mixed with said ternary composite forms a quaternary composite of an immiscible polymer blend having co-continuous distinct phases. 11. The semiconductive jacket material of claim 1, further comprising a material selected from the group consisting of an antioxidant, a nucleating agent, and mixtures thereof. 12. A semiconductive jacket material for jacketing a cable, comprising: a minor phase material comprising a semicrystalline polymer having a crystallinity from about 30% to about 80%; a conductive filler material dispersed in and residing in said minor phase material in an amount of about 10% by weight or less to form a binary composite; and a major phase material, said major phase material being a polymer which when mixed with said binary composite forms a ternary composite of an immiscible polymer blend, said major phase material having said binary composite dispersed therein in an amount sufficient to be equal to or greater than an amount required to generate a continuous conductive network in said major phase material, said ternary composite being free of hydrogen bonding and having co-continuous distinct phases. 13. A semiconductive jacket material for jacketing a cable, comprising: a minor phase material comprising a semicrystalline polymer; a conductive filler material dispersed in and residing in said minor phase material in an amount of about 10% by weight or less to form a binary composite; a major phase material, said major phase material being a polymer which when mixed with said binary composite forms a ternary composite of an immiscible polymer blend, said major phase material having said binary composite dispersed therein in an amount sufficient to be equal to or greater than an amount required to generate a continuous conductive netw ork in said major phase material, said ternary composite being free of hydrogen bonding and having co-continuous distinct phases; and a second major phase material, wherein said ternary composite is dispersed in an amount sufficient for said ternary composite to be continuous within said second major phase material; said second major phase material being selected from a group of polymers which when mixed with said ternary composite forms a quaternary composite of an immiscible polymer blend having co-continuous distinct phases. 14. A semiconductive jacket material for jacketing a cable, comprising: a minor phase material comprising a semicrystalline polymer; a conductive filler material dispersed in and residing in said minor phase material in an amount of about 10% by weight or less to form a binary composite; and a major phase material, said major phase material being a polymer which when mixed with said binary composite forms a ternary composite of an immiscible polymer blend, said major phase material having said binary composite dispersed therein in an amount sufficient to be equal to or greater than an amount required to generate a continuous conductive network in said major phase material, said ternary composite being free of hydrogen bonding and having co-continuous distinct phases wherein said minor phase material has a solubility parameter δA,said major phase material has a solubility parameter δB,and said ternary composite meets the following criteria for immiscibility, 7≥(δA-δb)2≥0. 15. A semiconductive jacket material for jacketing a cable, comprising: a minor phase material comprising a semicrystalline polymer; metallic particles dispersed in and residing in said minor phase material in an amount of about 85% by weight or greater to form a binary composite; and a major phase material, said major phase material being a polymer which when mixed with said binary composite forms a ternary composite of an immiscible polymer blend, said major phase material having said binary composite dispersed therein in an amount sufficient to be equal to or greater than an amount required to generate a continuous conductive network in said major phase material, said ternary composite being free of hydrogen bonding and having co-continuous distinct phases, a volume resistivity of about ≤100Ω·m, an unaged tensile strength of at least about 1200 psi, a tensile strength of at least about 75% of said unaged tensile strength after aging in an air oven at 100° C. for 48 hours, an aged and unaged elongation at break of at least about 100%, a heat distortion at 90° C. of at least about -25%, and a brittleness temperature of about ≤-10° C. 16. A semiconductive jacket material for jacketing a cable, comprising: a minor phase material comprising a semicrystalline polymer selected from the group consisting of high density polyethylene, polypropylene, polypropene, poly-1-butene, poly(styrene), polycarbonate, poly(ethylene terephthalate), polyethylene, nylon 66 and nylon 6; a conductive filler material selected from the group consisting of carbon black, polyacetylene, polyaniline, polypyrrole, graphite and carbon fibers, dispersed in and residing in said minor phase material in an amount of about 10% by weight or less to form a binary composite; and a major phase material selected from the group consisting of poly(ethylene-co-vinyl acetate), polybutylene terephthalate, poly(styrene), poly (methyl methacrylate), polyethylene, polypropylene, polyisobutylene, poly(vinyl chloride), poly(vinylidene chloride), poly(tetrafluoroethylene), poly(vinyl acetate), poly(methyl acrylate), polyacrylonitrile, polybutadiene, poly(ethylene terephthalate), poly(8-aminocaprylic acid) and poly(hexamethylene adipamide), said major phase material which when mixed with said binary composite forms a ternary composite of an immiscible polymer blend, said major phase material having sa
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (30)
Maranci Artun (Westport CT) Peake Steven L. (Ridgefield CT) Kaminski Stanley S. (Stamford CT), Advance composites with thermoplastic particles at the interface between layers.
Hoffman Dwight K. (Midland MI) Dellar David V. (Beaverton MI) Schlameus Herman W. (San Antonio TX), Encapsulated active materials and method for preparing same.
Folda Thomas (Neuleiningen CA DEX) Boyd Jack D. (Westminster CA) Tesch Helmut (Birkenheide DEX) Weber Thomas (Ludwigshafen CA DEX) Recker Hans G. (Irvine CA), Toughened thermosetting structural materials.
Recker Hans G. (Irvine CA) Hartness J. Timothy (Tega Cay SC) Folda Thomas (Neuleiningen DEX) Tesch Helmut (Birkenheide DEX) Weber Thomas (Ludwigshafen DEX) Boyd Jack D. (Westminster CA), Toughened thermosetting structural materials.
Recker Hans G. (Irvine CA) Altsaedt Volker (Gernsheim DEX) Tesch Helmut (Roedersheim/Gronau DEX) Weber Thomas (Ludwigshafen DEX), Toughened, fiber-reinforced thermosetting resin matrix prepregs and composites made therefrom.
Sahouani, Hassan; Caruso Dailey, Mary M.; Heinzen, Luke E.; El Hedok, Ibrahim A., Release of biologically active agents from polymeric composite particles.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.