초록 ▼

A computer system and a printed circuit board assembly are provided comprising first and second semiconductor dies and an intermediate substrate. The intermediate substrate is positioned between a first active surface of the first semiconductor die and a second active surface of the second semicondu

A computer system and a printed circuit board assembly are provided comprising first and second semiconductor dies and an intermediate substrate. The intermediate substrate is positioned between a first active surface of the first semiconductor die and a second active surface of the second semiconductor die. The first semiconductor die is electrically coupled to the intermediate substrate. The intermediate substrate defines a passage there through The second semiconductor die is secured to the second surface of the intermediate substrate within a cavity in the second surface of the intermediate substrate such that the conductive bond pad of the second semiconductor die is aligned with the passage. The second semiconductor die is electrically coupled to the intermediate substrate by at least one conductive line extending from the second semiconductor die through the passage and to the first surface of the intermediate substrate.

대표청구항 ▼

A computer system and a printed circuit board assembly are provided comprising first and second semiconductor dies and an intermediate substrate. The intermediate substrate is positioned between a first active surface of the first semiconductor die and a second active surface of the second semicondu

A computer system and a printed circuit board assembly are provided comprising first and second semiconductor dies and an intermediate substrate. The intermediate substrate is positioned between a first active surface of the first semiconductor die and a second active surface of the second semiconductor die. The first semiconductor die is electrically coupled to the intermediate substrate. The intermediate substrate defines a passage there through The second semiconductor die is secured to the second surface of the intermediate substrate within a cavity in the second surface of the intermediate substrate such that the conductive bond pad of the second semiconductor die is aligned with the passage. The second semiconductor die is electrically coupled to the intermediate substrate by at least one conductive line extending from the second semiconductor die through the passage and to the first surface of the intermediate substrate. ace being disposed parallel to said first substantially parallel surface to form a gap between said first substantially planar surface and said second substantially planar surface; a skirt of lossy material conforming to said first perimeter and said second substantially planar surface to form an enclosed cavity. 10. The shield of claim 9 wherein said skirt has an inner surface on the inside of said enclosed cavity and said inner surface has a protrusion on said inner surface that engages said heat sink to hold said skirt conformed against said first substantially planar surface. 11. The shield of claim 9 wherein said skirt is held against said first substantially planar surface with an adhesive. 12. The shield of claim 9 wherein there is an integrated circuit disposed inside said enclosed cavity.