$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Pressure sensor capsule with improved isolation 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01L-007/00
출원번호 US-0477689 (2000-01-06)
발명자 / 주소
  • Sittler, Fred C.
출원인 / 주소
  • Rosemount Inc.
대리인 / 주소
    Westman, Champlin & Kelly, P.A.
인용정보 피인용 횟수 : 25  인용 특허 : 154

초록

A pressure sensor capsule with a beam shaped sensor body, made of direct bonded layers of single crystal sapphire, surrounding a hollow central channel. A first beam end receives pressure and a second beam end has electrical contact pads and there is a mounting surface between the ends. The central

대표청구항

A pressure sensor capsule with a beam shaped sensor body, made of direct bonded layers of single crystal sapphire, surrounding a hollow central channel. A first beam end receives pressure and a second beam end has electrical contact pads and there is a mounting surface between the ends. The central

이 특허에 인용된 특허 (154)

  1. Kuisma Heikki (Helsinki FIX), Absolute pressure transducer.
  2. Walter Hilger A. (Stade DEX) Honen Herwart (Uebach-Palenberg DEX) Gallus Heinz E. (Aachen DEX), Adaptor for monitoring a pressure sensor to a gas turbine housing.
  3. Bower Robert W. (Davis CA) Ismail Mohd S. (West Sacramento CA), Aligned wafer bonding.
  4. Bernot Anthony J. (Gilbert AZ), Aluminosilicate glass pressure transducer.
  5. d\Aragona Frank S. (Scottsdale AZ) Wells Raymond C. (Scottsdale AZ) Helsel Sherry L. F. (Apache Junction AZ), Automated method for joining wafers.
  6. Peters Arthur J. (Norco CA) Marks Eugene A. (Riverside CA), Batch-process silicon capacitive pressure sensor.
  7. Rud ; Jr. Stanley E. (Eden Prairie MN), Capacitance pressure sensor.
  8. Pandorf Robert C. (Newton Highlands MA), Capacitance pressure transducer.
  9. Ko Wen H. (Cleveland Hts. OH), Capacitive absolute pressure sensor.
  10. Kuisma Heikki T. (Helsinki FIX), Capacitive detector for absolute pressure.
  11. Thomas Isabelle (Valence FRX) LeFort Pierre O. (Valence FRX) Legoux Christophe (Valence FRX), Capacitive micro-sensor with a low stray capacity and manufacturing method.
  12. Lee ; Shih-Ying ; Briefer ; Dennis K., Capacitive pressure sensing device.
  13. Kimura Shigeo (Kanagawa JPX) Ishikura Yoshiyuki (Kanagawa JPX) Masuda Takashi (Kanagawa JPX) Kuroiwa Takaaki (Kanagawa JPX) Kihara Takashi (Kanagawa JPX), Capacitive pressure sensor.
  14. Shimada Satoshi (Hitachi JPX) Yamada Kazuji (Hitachi JPX) Suzuki Seikou (Hitachiota JPX) Nishihara Motohisa (Katsuta JPX), Capacitive pressure sensor.
  15. Shimada Satoshi (Ibaraki JPX) Kawakami Kanji (Ibaraki JPX) Nishihara Motohisa (Ibaraki JPX), Capacitive pressure sensor.
  16. Hegner Frank (Maulburg DEX) Frank Manfred (Maulburg DEX), Capacitive pressure sensor and method of manufacturing same.
  17. Frick Roger L. (Hackensack MN) Louwagie Bennett L. (Plymouth MN) Toy Adrian C. (Eden Prairie MN), Capacitive pressure sensor for a pressure transmitted where electric field emanates substantially from back sides of pla.
  18. Frick Roger L. (Hackensack MN), Capacitive pressure sensor having circuitry for eliminating stray capacitance.
  19. Kimura Shigeo (Kanagawa JPX) Ishikura Yoshiyuki (Kanagawa JPX) Kihara Takashi (Kanagawa JPX) Masuda Takashi (Kanagawa JPX), Capacitive pressure sensor isolating electrodes from external environment.
  20. Bell Robert L. (Chatsworth CA) Willing Robert (Anaheim CA) Kavli Fred (Woodland Hills CA), Capacitive pressure transducer.
  21. Bell Robert L. (Chatsworth CA) Willing Robert (Anaheim CA) Kavli Fred (Woodland Hills CA), Capacitive pressure transducer and method of making same.
  22. Male Barry (Windsor Locks CT), Capacitive pressure transducer signal conditioning circuit.
  23. Bell Robert L. (Chatsworth CA), Capacitive pressure transducer with improved electrode.
  24. Bullis Robert H. (Avon CT) Swindal James L. (East Hampton CT) Wiegand ; Jr. Walter J. (Glastonbury CT) Brahm Charles B. (Ellington CT) Meyer Harold D. (South Windsor CT), Capacitive sensor with minimized dielectric drift.
  25. Mastrangelo Carlos H. (Ann Arbor MI), Capacitive surface micromachined differential pressure sensor.
  26. Runyon Larry K. (Temecula CA), Closed apparatus system for improving irrigation and method for its use.
  27. Lips Donald C. (San Pedro CA), Compensated pressure transducer.
  28. Robyn Pierre (Nivelles BEX) Deschepper Pierre (Charleroi BEX), Composite refractory articles and method of manufacturing them.
  29. Sahagen Armen N. (16757 Bolero La. Huntington Beach CA 92649), Compositions for piezoresistive and superconductive application.
  30. Deak Frederick R. (Kernersville NC) Rowlette ; Sr. John R. (Clemmons NC), Conductive gel area array connector.
  31. Cretzler Donald J. (San Diego CA), Cylindrical capacitive quartz transducer.
  32. Kondo Kazuo (Aichi JPX) Hattori Masateru (Aichi JPX) Kurachi Tatsunori (Aichi JPX), Device for mounting semiconductors.
  33. Kurtz Anthony D. (Englewood NJ) Nunn Timothy A. (Ridgewood NJ) Mallon Joseph R. (Franklin Lakes NJ), Dielectrically isolated transducer employing single crystal strain gages.
  34. Kazahaya Masahiro (Southampton PA), Differential pressure transducer.
  35. Bower Robert W. (Davis CA) Ismail Mohd S. (West Sacramento CA), Digital pressure switch and method of fabrication.
  36. Malikowski Willi (Aschaffenburg DEX) Weise Wolfgang (Frankfurt am Main DEX), Direct bonding of ceramic parts by a silver alloy solder.
  37. Cusano Dominic A. (Schenectady NY) Loughran James A. (Scotia NY) Sun Yen Sheng Edmund (Auburn NY), Direct bonding of metals to ceramics and metals.
  38. Brown Clem H. (Scottsdale AZ) Wallace Daniel J. (Phoenix AZ), Dual absolute pressure sensor and method thereof.
  39. Sikorra Charles F. (Seattle WA), Dual capacitance type bonded pressure transducer.
  40. Yoshizawa Tetsuo (Yokohama) Tarayama Yoshimi (Odawara) Kondo Hiroshi (Yokohama) Sakaki Takashi (Tokyo) Haga Shunichi (Yokohama) Ichida Yasuteru (Machida) Konishi Masaki (Ebina JPX), Electric circuit device having an electric connecting member and electric circuit components.
  41. Stecher Gnther (Ludwigsburg DEX) Zimmermann Herbert (Freiberg DEX), Electrical thick-film, free-standing, self-supporting structure, and method of its manufacture, particularly for sensors.
  42. Kiendl, Harro, Electronically controlled mixing valve.
  43. Lodge Arthur S. (210 DuRose Ter. Madison WI 53705), Extended range pressure transducers.
  44. Baumberger John G. (Johnson City NY) Petrozello James R. (Endicott NY), Fluid pressure actuated connector.
  45. Czarnocki Walter (Hoffman Estates IL) Rathke William (Arlington Heights IL), Gain-adjusting circuitry for combining two sensors to form a media isolated differential pressure sensor.
  46. Kurtz Anthony D. (Teaneck NJ) Mallon Joseph R. (Franklin Lakes NJ) Nunn Timothy A. (Ridgewood NJ), Glass header structure for a semiconductor pressure transducer.
  47. Demark Anthony M. (Plymouth Meeting PA) Erhardt William K. (Richboro PA), High pressure electrical feedthru.
  48. Kurtz Anthony D. (Englewood NJ) Mallon Joseph R. (Franklin Lakes NJ), Housing and interconnection assembly for a pressure transducer.
  49. Kurtz Anthony D. (Englewood NJ) Mallon Joseph R. (Alpine NJ), Housing and lead arrangements for electromechanical transducers.
  50. Barr Rodney E. (Cary NC) Kochanek George E. (Glen Ellyn IL), Housing for capacitive pressure sensor.
  51. Alexander Elizabeth M. L. (Eindhoven NLX) Haisma Jan (Eindhoven NLX) Michielsen Theodorus (Eindhoven NLX) Van Der Velden Johannes (Eindhoven NLX) Verhoeven Johannes F. C. M. (Eindhoven NLX), Improved method of manufacturing a semiconductor device of the “semiconductor on insulator”type.
  52. Adolfsson Morgan (Vsteras SEX) Gransson Sture (Vsteras SEX) Hk Bertil (Vsteras SEX), Integrated capacitive transducer.
  53. Sliwa ; Jr. John W. (Cupertino CA), Interfacial blister bonding for microinterconnections.
  54. Smith Rosemary L. (3311 Oyster Bay Ave. Davis CA 95616) Collins Scott D. (3311 Oyster Bay Ave. Davis CA 95616), Interferometric pressure sensor capable of high temperature operation and method of fabrication.
  55. Carusillo, Steven J., Linearized capacitive pressure transducer.
  56. Kurtz Anthony D. (Englewood NJ) Mallon Joseph R. (Franklin Lakes NJ), Media compatible pressure transducer.
  57. Bell ; Herbert A. ; McCoy ; Micheal E. ; Woolston ; Francis J., Metallurgical method for die attaching silicon on sapphire devices to obtain heat resistant bond.
  58. Petersen Kurt E. (San Jose CA), Method and apparatus for forming hermetically sealed electrical feedthrough conductors.
  59. Goesele Ulrich M. (Durham NC) Stengl Reinhard J. (Durham NC), Method for bubble-free bonding of silicon wafers.
  60. O\Connor James M. (Ellicott City MD) McKitterick John B. (Columbia MD), Method for fabricating a silicon pressure sensor incorporating silicon-on-insulator structures.
  61. Tsang Robert W. K. (Bedford MA) Core Theresa A. (North Andover MA), Method for fabricating monolithic chip containing integrated circuitry and suspended microstructure.
  62. Lee Stuart M. (Palo Alto CA) Stafford Jerrett D. (Sunnyvale CA), Method for forming a bond between sapphire and glass.
  63. Singh Gurnam (Willow Grove PA), Method for low temperature bonding of silicon and silicon on sapphire and spinel to nickel and nickel steel and apparatu.
  64. Rosen Carol Z. (Teaneck NJ) Wittke Ernest C. (West Caldwell NJ), Method for making piezoelectric sensing elements with gold-germanium bonding layers.
  65. Mastrangelo Carlos H. (Ann Arbor MI), Method for producing a silicon-on-insulator capacitive surface micromachined absolute pressure sensor.
  66. Blanchard Richard A. (Los Altos CA), Method of bonding semiconductor wafers.
  67. Haisma Jan (Eindhoven NLX) Adema Cornelis L. (Eindhoven NLX) Alting Cornelis L. (Eindhoven NLX) Brehm Rudolf (Eindhoven NLX), Method of bonding two parts together.
  68. Satoh Yuki (Neyagawa JPX) Hashimoto Koji (Kobe JPX) Ishizaki Toshio (Kobe JPX), Method of direct bonding of crystals and crystal devices.
  69. Mallon Joseph R. (Franklin Lakes NJ) Kurtz Anthony D. (Englewood NJ), Method of fabricating transducer structure employing vertically walled diaphragms with quasi rectangular active areas.
  70. Matsukawa Naohiro (Yokohama JPX), Method of forming dielectric isolation of device regions.
  71. Chen Frank (Swindon GB2) Rogers Tony W. (Stoke Poges CT GB2) Blackaby David E. (West Suffield CT), Method of making capacitive pressure sensors.
  72. Mikkor Mati (Ann Arbor MI), Method of making silicon capacitive pressure sensor with glass layer between silicon wafers.
  73. Haisma Jan (Eindhoven NLX) Alting Cornelis L. (Eindhoven NLX) Michielsen Theodorus M. (Eindhoven NLX), Method of manufacturing a semiconductor device.
  74. Haisma Jan (Eindhoven NLX) Adema Cornelis L. (Eindhoven NLX) De Bruin Johan G. (Eindhoven NLX) Michielsen Theodorus M. (Eindhoven NLX) Spierings Gijsbertus A. C. M. (Eindhoven NLX), Method of manufacturing a silicon on insulator semiconductor.
  75. Hatakeyama Akihito (Kadoma JPX) Sogo Hiroshi (Nishinomiya JPX) Kojima Tamao (Osaka JPX) Horio Yasuhiko (Osaka JPX) Tsukamoto Masahide (Nara JPX) Fukumura Yasushi (Kyoto JPX), Method of manufacturing organic substrate used for printed circuits.
  76. Haisma Jan (Eindhoven NLX) Michielsen Theodorus M. (Eindhoven NLX) Pals Jan A. (Eindhoven NLX), Method of manufacturing semiconductor devices.
  77. Kurtin ; Stephen L., Method of producing an electrical resistance device.
  78. Chen Frank (Swindon GB2) Rogers Tony W. (Stoke Pages CT GB2) Blackaby David E. (West Suffield CT), Method of sealing an electrical feedthrough in a semiconductor device.
  79. Herring Carl Richard (Allentown PA) Schneider Fred John (Allentown PA), Methods of and apparatus for aligning and bonding workpieces.
  80. Kurtz Anthony D. (Englewood NJ) Mallon Joseph R. (Franklin Lakes NJ), Methods of fabricating transducers employing flat bondable surfaces with buried contact areas.
  81. Fendley Richard L. (Indianapolis IN) Hoenig Gerhard E. (Indianapolis IN) Poehlmann George (Indianapolis IN) Prendergast ; Jr. John M. (Indianapolis IN), Methods of solid-phase bonding mating members through an interposed pre-shaped compliant medium.
  82. Broden David A. (Chanhassen MN), Modular transmitter with flame arresting header.
  83. Mizutani Daisuke (Kawasaki JPX) Yokouchi Kishio (Kawasaki JPX), Multilayer circuit board and a method for fabricating the same.
  84. Smolley Robert (Porteuguese Bend CA), Packaging construction for semiconductor wafers.
  85. Grabow ; Ronald D., Packaging of pressure sensor cells.
  86. Sahagen Armen N. (16757 Bolero La. Huntington Beach CA 92649), Piezoresistive pressure transducer.
  87. Fassberg Maxine (Beaverton OR) Bost Melton C. (Hillsboro OR) Murali Krishnamurthy (Portland OR) Charvat Peter K. (Portland OR) Price Lynn A. (Portland OR) Lindstedt Robert C. (Portland OR), Polyimide process for protecting integrated circuits.
  88. Sahagen Armen N. (16757 Bolero La. Huntington Beach CA 92649), Pressure sensing transducer employing piezoresistive elements on sapphire.
  89. Ishikura Yoshiyuki,JPX, Pressure sensor.
  90. Kojima Takao (Aichi JPX) Yasuda Toshikatsu (Aichi JPX) Mizumoto Katsuyoshi (Aichi JPX) Kitsukawa Kanehisa (Aichi JPX), Pressure sensor.
  91. Kojima Takao (Aichi) Kitsukawa Kanehisa (Aichi) Yasuda Toshikatsu (Aichi) Mizumoto Katsuyoshi (Aichi JPX), Pressure sensor.
  92. Mizumoto Katsuyoshi (Aichi) Kitsukawa Kanehisa (Aichi) Yasuda Toshikatsu (Aichi) Kojima Takao (Aichi JPX), Pressure sensor.
  93. Tominaga Tamotsu (Yokohama JPX) Mihara Teruyoshi (Yokohama JPX) Oguro Takeshi (Yokosuka JPX) Takeuchi Masami (Kokubunji JPX), Pressure sensor.
  94. Tominaga Tamotsu (Yokohama JPX) Mihara Teruyoshi (Yokohama JPX) Oguro Takeshi (Yokosuka JPX) Takeuchi Masami (Kokubunji JPX), Pressure sensor.
  95. Hegner Frank (Maulburg DEX) Dittrich Gerhard (Lrrach DEX) Klhn Thomas (Steinen DEX), Pressure sensor and method for the manufacture thereof.
  96. Hegner Frank (Lrrach DEX) Frank Manfred (Maulburg DEX) Klhn Thomas (Freiburg/Br. DEX), Pressure sensor and method of manufacturing same.
  97. Mrozack ; Jr. James (Highland Park IL) Greenstein Bernard (Glenview IL), Pressure sensor assembly.
  98. Delatorre Leroy C. (Sugar Land TX), Pressure sensor system.
  99. Petitjean Luc (Vincennes FRX) Valdois Michel (Cachan FRX), Pressure sensor useable in oil wells.
  100. Kooiman Robert R. (Eden Prairie MN), Pressure sensor with a substantially flat overpressure stop for the measuring diaphragm.
  101. Broden David A. (Chanhassen MN) Bischoff Brian J. (Eagan MN) Louwagie Bennett L. (Plymouth MN), Pressure sensor with high modules support.
  102. Charboneau Thomas J. (Plainville MA) Kawate Keith W. (Attleboro Falls MA), Pressure sensor with improved capacitive pressure transducer.
  103. Carter Roy E. (83 Cherry Garden Lane Newport ; Essex ; CBII 3QB GB2) Baker Francis S. (23 Rochford Road Bishops Stortford ; Hertfordshire CM23 5ET GB2), Pressure transducer.
  104. Ohnesorge David H. (South Bend IN) Antonazzi Frank J. (South Bend IN), Pressure transducer.
  105. Yoshida Takeshi (Tokyo JPX), Pressure transducer.
  106. Southworth Robert (Pawtucket RI) Tomlinson James L. (North Smithfield RI) McAndrews James P. (Attleboro MA), Pressure transducer apparatus.
  107. Southworth Robert (Pawtucket RI) Tomlinson James L. (North Smithfield RI) McAndrews James P. (Attleboro MA), Pressure transducer apparatus and method for making same.
  108. Bartig Ingo (Berlin DEX) Burkel Rainer (Asperg DEX) Mamisch Hansjoachim (Berlin DEX) Moser Winfried (Ludwigsburg DEX), Pressure transducer for determining the pressure in the combustion chamber of an internal combustion engine.
  109. Antonazzi Frank J. (South Bend IN) Ohnesorge David H. (South Bend IN), Pressure transducer with an invariable reference capacitor.
  110. Knecht Thomas A. (Eden Prairie MN) Ruf James (Maple Grove MN) Schulte John P. (Eden Prairie MN), Pressure transducer with stress isolation for hard mounting.
  111. Lane ; III Charles E. (Meadowbrook PA) Wilda Douglas W. (Ambler PA), Pressure transmitter assembly having sensor isolation mounting.
  112. Dean Michael J. (St. Paul MN) Mattison Lee A. (Minneapolis MN) Krouth Terrance F. (Green Bay WI), Pressure transmitter with stress isolation depression.
  113. Paquin Maurice J. (8330 Stansbury St. Panorama City CA 91402) Radleigh James J. (2759 Harmony Pl. La Crescenta CA 91214), Pressure-sensing transducer.
  114. EerNisse Errol P. ; Perry Lon J. ; Ward Roger W. ; Wiggins Robert B., Pressure/temperature transducer with improved thermal coupling and enhanced transient response.
  115. Tobita Tomoyuki (Katsuta JPX) Yamamoto Yoshimi (Ibaraki-ken JPX) Fukunaga Masao (Tokyo JPX) Kobayahsi Teruo (Katsuta JPX) Nagasu Akira (Ibaraki-ken JPX), Process detection apparatus.
  116. Pinker Ronald D. (Peekskill NY) Arnold Emil (Chappaqua NY) Baumgart Helmut (Mahopac NY), Process for making strain-compensated bonded silicon-on-insulator material free of dislocations.
  117. Aoshima Hiroaki (4-34-14 Yayoicho Nakano ku ; Tokyo JPX), Process for producing integrated structures of synthetic corundum single-crystals.
  118. Aoshima Hiroaki (4-34-14 Yayoicho Nakano ku ; Tokyo JPX), Process for producing structures from synthetic single-crystal pieces.
  119. Schreiber-Prillwitz Wolfgang (Villingen-Schwenningen DEX) Plankenhorn Horst (Villingen-Schwenningen DEX), Process for sealing apertures in glass-silicon-glass micromechanical acceleration sensors.
  120. Neidig Arno (Plankstadt DEX) Bunk Klaus (Worms DEX) Thiele Karl-Heinz (Worms DEX) Wahl Georg (Eppelheim DEX) Gobrecht Jens (Gebenstorf DEX), Process for the direct bonding of metal to ceramics.
  121. Sagiv, Jacob, Process for the production of built-up films by the stepwise adsorption of individual monolayers.
  122. Scott Curtis E. ; Kaliszewski Mary Sue, Process of preparing monolithic seal for sapphire CMH lamp.
  123. Murakami Gen (Machida JPX) Tsubosaki Kunihiro (Hino JPX) Ichitani Masahiro (Kodaira JPX) Nishi Kunihiko (Kokubunji JPX) Anjo Ichiro (Koganei JPX) Nishimura Asao (Ushiku JPX) Kitano Makoto (Shimoinayo, Semiconductor device.
  124. Peterson Kurt E. (San Jose CA) Christel Lee A. (Menlo Park CA), Semiconductor sensor with piezoresistors and improved electrostatic structures.
  125. Kurtz Anthony D. (Englewood NJ) Mallon Joseph R. (Franklin Lakes NJ), Semiconductor transducers employing flat bondable surfaces with buried contact areas.
  126. Kurtz Anthony D. (Englewood NJ) Mallon Joseph R. (Franklin Lakes NJ) Nunn Timothy A. (Ridgewood NJ), Semiconductor transducers employing flexure frames.
  127. Voss Gnter (Much DEX), Sensor for a capacitance pressure gauge.
  128. Albarda Scato (Gross Schenkenberg DEX) Thoren Werner (Lbeck DEX) Lagois Johannes (Lbeck DEX) Otten Johann (Bad Schwartau DEX), Sensor for capacitively measuring pressure in a gas.
  129. Zabler Erich (Stutensee DEX), Sensor for scanning physical processes in internal combustion engines.
  130. Kroninger ; Jr. Paul M. (Harleysville Furlong PA) Freud Paul J. (Furlong PA) Updike Dean P. (Bethlehem PA), Silicon diaphragm capacitive pressure transducer.
  131. Xiang-Zheng Tu (Department of Electrical Engineering ; University of Pennsylvania ; 200 S. 33rd St. Philadelphia PA 19104-6390) Yun-Yan Li (14 Beihehutong Congcheuggu Beijing CNX), Silicon diaphragm piezoresistive pressure sensor and fabrication method of the same.
  132. Lur Water (Taipei TWX), Silicon-on-insulator technique with buried gap.
  133. Loeppert Peter V. (Rolling Meadows IL) Graber Warren S. (Rolling Meadows IL), Silicon-on-silicon differential input sensors.
  134. House ; J. Hardy, Solid state force transducer.
  135. Tuckey Charles H. (Cass City MI), Solid state pressure sensor.
  136. Sanders Gary G. (Lakewood OH), Stop for integrated circuit diaphragm.
  137. Kondo Kazuo (Aichi JPX) Sukegawa Tsuneyuki (Aichi JPX), Substrate for an integrated circuit.
  138. Frick Roger L. (Hackensack MN), Suspended diaphragm pressure sensor.
  139. Vogel Ronald F. (DeKalb IL), Temperature compensated capacitance pressure transducer.
  140. Shkedi Zvi (Los Angeles CA), Temperature compensated pressure transducer.
  141. Taniuchi Tetsuo (Katano JPX), Temperature detector.
  142. Curtis Daniel L. (Manhattan Beach CA), Temperature stable optical bonding method and apparatus.
  143. Curtis Daniel L. (Manhattan Beach CA), Temperature stable optical bonding method and apparatus obtained thereby.
  144. Estes Howard S. (Houston TX), Thermally reactive lead assembly and method for making same.
  145. Ramsey Jeffery E. (Newark CA) Bryzek Janusz (Fremont CA) Mallon ; Jr. Joseph R. (Fremont CA), Three part low cost sensor housing.
  146. Anderson Richard S. (Chatsworth CA), Transducer circuit.
  147. Mallon Joseph R. (Franklin Lakes NJ) Kurtz Anthony D. (Englewood NJ), Transducer structure employing vertically walled diaphragms with quasi rectangular active areas.
  148. Sittler Fred C., Transmitter with isolation assembly for pressure sensor.
  149. Haisma, Jan; Adema, Cornelis L.; Pasmans, Johannes M. M.; Walters, Jurren H., Tunable Fabry-Perot interferometer and X-ray display device having such an interferometer.
  150. Kawakita Kouji (Joyo JPX) Tsukamoto Masahide (Nara JPX) Horio Yasuhiko (Osaka JPX) Nakatani Seiichi (Hirakata JPX) Hatakeyama Akihito (Kadoma JPX), Two-sided printed circuit board a multi-layered printed circuit board.
  151. Corl Paul D. ; Obara Robert Z. ; Ortiz John E., Ultra miniature pressure sensor and guide wire using the same and method.
  152. Wise Kensall D. (Ann Arbor MI) Chau Hin-Leung (Ann Arbor MI), Ultraminiature pressure sensor with addressable read-out circuit.
  153. Frische Richard H. (Phoenix AZ) Dankwort Rudolf C. (Phoenix AZ) Klem Charles D. (Phoenix AZ), Vibrating quartz diaphragm pressure sensor.
  154. Sato Mitsuya (Yokohama JPX) Ukaji Takao (Yokohama JPX) Yamaguchi Nobuhito (Yokohama JPX) Ohmori Taro (Yokohama JPX) Murakami Eiichi (Yokohama JPX), Wafer prober.

이 특허를 인용한 특허 (25)

  1. Barron, Leo E.; Czazasty, John A.; Galler, Francis A., Capacitive pressure sensor.
  2. Barron, Leo E.; Czazasty, John A., Capacitive pressure sensor with intrinsic temperature compensation.
  3. Anderson,William Thomas; Wells,Christopher Ashley, Diagnostic system for detecting rupture or thinning of diaphragms.
  4. Liu,James Z.; Cook,James D.; Dierauer,Peter P., Disposable pressure diaphragm and wireless sensor systems and methods.
  5. Eriksen, Christopher L.; Gravel, James L.; Olson, Randall C.; Strei, David, Electrical connector for a pressure sensor stem.
  6. Haywood, Nicholas John, Electrical interconnect for pressure sensor in a process variable transmitter.
  7. Hedtke, Robert C.; Sittler, Fred C., High integrity process fluid pressure probe.
  8. Hedtke, Robert C.; Sittler, Fred C., High integrity process fluid pressure probe.
  9. Wright, III,Philemon Kennard, Instrumentation and method for monitoring change in electric potential to detect crack growth.
  10. Guziak,Robert; Tory,David, Lead embedded pressure sensor.
  11. Strei, David Matthew, Multivariable process fluid transmitter for high pressure applications.
  12. Sittler, Fred C.; Nord, Christina A.; Romo, Mark G., Pressure sensor assembly.
  13. Strei, David; Broden, David; Breen, Ivar, Pressure sensor module for sub-sea applications.
  14. Speldrich, Jamie W., Pressure sensor stress isolation pedestal.
  15. Schumacher, Mark Stephen; Broden, David Andrew, Pressure sensor with mineral insulated cable.
  16. Barron,Leo, Pressure transducer.
  17. Eriksen, Christopher Lee; Xu, Lihong, Pressure transmitter having an isolation assembly with a two-piece isolator plug.
  18. Haywood, Nicholas John, Process fluid pressure sensing assembly for pressure transmitters subjected to high working pressure.
  19. Hedtke, Robert C., Process variable transmitter with process variable sensor carried by process gasket.
  20. Hedtke, Robert C., Process variable transmitter with process variable sensor carried by process gasket.
  21. Breen, Ivar; Miller, Brent W.; Scheldorf, Jay; Aydar, Gokhan; Broden, David, Remote seal pressure measurement system for subsea use.
  22. Yang, Haining; Chen, Xiangdong, Structure and method for creation of a transistor.
  23. Hedtke, Robert C., Thermal diagnostic for single-crystal process fluid pressure sensor.
  24. Hedtke, Robert C., Transmitter output with scalable rangeability.
  25. Smith, Joseph Alan; Cota, Jeffrey Alan; Junk, Brian Scott; Rogers, Steven Bruce, Wafer style insertable magnetic flowmeter with collapsible petals.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로