초록

A method and composition is provided for sealing a subterranean zone penetrated by a well bore and restoring lost circulation, wherein the composition basically comprises a mixture of latex, melamine-formaldehyde resin, and a catalyst.

대표청구항 ▼

A method and composition is provided for sealing a subterranean zone penetrated by a well bore and restoring lost circulation, wherein the composition basically comprises a mixture of latex, melamine-formaldehyde resin, and a catalyst. f the Stressed State of a Sintered Quartz Monoblock", by Y. Lisi

A method and composition is provided for sealing a subterranean zone penetrated by a well bore and restoring lost circulation, wherein the composition basically comprises a mixture of latex, melamine-formaldehyde resin, and a catalyst. f the Stressed State of a Sintered Quartz Monoblock", by Y. Lisitsyn et al., Plenum Publishing Corporation, (1986), pp. 643-645. "Direct Bonding in Patent Literature", by J. Haisma, Philips J. Res., (1995), pp. 165-170. "Special Issue on Direct Bonding", by J. Haisma et al., Philips Journal of Research, vol. 49, No. 1/2, (1995), pp. 1-182. "Diversity and Feasibility of Direct Bonding: A Survey of a Dedicated Optical Technology", by J. Haisma et al., Applied Optics, vol. 33, No. 7, (Mar. 1994), pp. 1154-1169. "Structure and Morphology of the Reaction Fronts During the Formation of MgA12O4Thin Films by Solid State Reaction Between R-cut Sapphire Substrates and MgO Films", by D. Hesse et al., Interface Science, (1994) pp. 221-237. "Development of a High Temperature Capacitive Pressure Transducer", by R.L. Egger, NASA CR-135282 (Oct. 1977), pp. 1-114. "High Temperature Pressure Transducer", Techlink Industry, Techlink No 2359, (1978), 2 pages. "Quartz Capsule Pressure Transducer for the Automotive Industry", by D.Y. Lee et al., SAE Technical Paper Series Society of Automotive Engineers, Inc., (Feb. 1981), 6 pages. "Low-Cost High-Sensitivity Integrated Pressure and Temperature Sensor", by P. Pons et al., Sensors and Actuators, (1994), pp. 398-401. "A New Type of High Performance Device for VSLI Digital System", by X. Xiao-Li et al., Solid State Devices, (1988), pp. 579-582. "Wafer Bonding For SOI", by W. P. Maszara et al., Mat. Res. Soc. Symp. Proc. vol. 107, (1988), 2 pages. "Silicon Fusion Bonding For Pressure Sensors", by K. Petersen et al., IEEE, (1988), pp. 146-147. "Silicon-To-Silicon Direct Bonding Method", by M. Shimbo et al., Journal of Applied Physics, vol. 60, No. 8, (Oct. 1986), pp. 2987-2989. "A Model for the Silicon Wafer Bonding Process", by Stengl et al., Japanese Journal of Applied Physics, vol. 28, No. 10, (Oct. 1989), pp. 1735 & 1741. "A