초록 ▼

Disclosed is a polyimide coated shape memory material suitable for thermomechanical treatment to shape-set the material into the desired configuration and activate shape memory properties. The polyimide coating is subjected to a curing regime that imparts higher heat resistance in the polyimide coat

Disclosed is a polyimide coated shape memory material suitable for thermomechanical treatment to shape-set the material into the desired configuration and activate shape memory properties. The polyimide coating is subjected to a curing regime that imparts higher heat resistance in the polyimide coating to withstand the elevated temperatures required during the shape-setting treatment.

대표청구항 ▼

Disclosed is a polyimide coated shape memory material suitable for thermomechanical treatment to shape-set the material into the desired configuration and activate shape memory properties. The polyimide coating is subjected to a curing regime that imparts higher heat resistance in the polyimide coat

Disclosed is a polyimide coated shape memory material suitable for thermomechanical treatment to shape-set the material into the desired configuration and activate shape memory properties. The polyimide coating is subjected to a curing regime that imparts higher heat resistance in the polyimide coating to withstand the elevated temperatures required during the shape-setting treatment. 0, Valentini et al.; US-5011678, 19910400, Wang et al.; US-5017372, 19910500, Hastings; US-5026566, 19910600, Roser; US-5027806, 19910700, Zoltan et al.; US-5033463, 19910700, Cocozza; US-5035237, 19910700, Newell et al.; US-5048514, 19910900, Ramella; US-5049388, 19910900, Knight et al.; US-5081228, 19920100, Dower et al.; US-5093316, 19920300, Lezdey et al.; US-5098893, 19920300, Franks et al.; US-5099833, 19920300, Michaels; US-5113855, 19920500, Newhouse; US-5124162, 19920600, Boskovic et al.; US-5149543, 19920900, Cohen et al.; US-5149653, 19920900, Roser; US-5161524, 19921100, Evans; US-5180812, 19930100, Dower et al.; US-5186164, 19930200, Raghuprasad; US-5192528, 19930300, Radhakrishnan et al.; US-5200399, 19930400, Wettlaufer et al.; US-5204108, 19930400, Illum; US-5206200, 19930400, Bush et al.; US-5230884, 19930700, Evans et al.; US-5253468, 19931000, Raymond; US-5254330, 19931000, Ganderton et al.; US-5290765, 19940300, Wettlaufer et al.; US-5295479, 19940300, Lankinen; US-5302581, 19940400, Sarin et al.; US-5309900, 19940500, Knoch et al.; US-5320094, 19940600, Laube et al.; US-5320714, 19940600, Brendel; US-5331953, 19940700, Andersson et al.; US-5354562, 19941000, Platz et al.; US-5364838, 19941100, Rubsamen; US-5376359, 19941200, Johnson; US-5376386, 19941200, Ganderton et al.; US-5466701, 19951100, Hlasta; US-5488062, 19960100, Dunlap et al.; US