초록 ▼

A heterojunction bipolar transistor includes an emitter or collector region of doped silicon, a base region including silicon-germanium, and a spacer. The emitter or collector region form a heterojunction with the base region. The spacer is positioned to electrically insulate the emitter or collecto

A heterojunction bipolar transistor includes an emitter or collector region of doped silicon, a base region including silicon-germanium, and a spacer. The emitter or collector region form a heterojunction with the base region. The spacer is positioned to electrically insulate the emitter or collector region from an external region. The spacer includes a silicon dioxide layer physically interposed between the emitter or collector region and the remainder of the spacer.

대표청구항 ▼

1. A process for fabricating a semiconductor device, comprising: forming one or more layers on a semiconductor substrate; forming a window in the one or more layers to expose a portion of the substrate through the window; forming a silicon-germanium base region on the exposed portion of the sub

1. A process for fabricating a semiconductor device, comprising: forming one or more layers on a semiconductor substrate; forming a window in the one or more layers to expose a portion of the substrate through the window; forming a silicon-germanium base region on the exposed portion of the substrate; forming an emitter or collector region to cover the silicon-germanium base region; and forming an oxide layer that covers the emitter or collector region; forming a dielectric layer on the oxide layer to produce a structure having a composition capable of self-aligning an anisotropic etch; and forming a contact area on the emitter or collector region by removing a portion of the oxide layer. 2. The process of claim 1, further comprising: forming the other of an emitter or collector region in said substrate prior to the forming a silicon-germanium base region. 3. The process of claim 2, wherein the base region has a higher dopant concentration than either the emitter region or the collector region. 4. The process of claim 2, wherein the base region contacts a dielectric outside a contact region; and wherein the contact region includes a region of physical contact between the collector region and base region and between the emitter region and the base region, and the contact region extends outward from the region of physical contact to a distance of at least twice the thickness of the base region. 5. The process of claim 1, wherein the emitter or collector region and the base region are formed by epitaxial growth. 6. The process of claim 1, wherein the another dielectric layer is a nitride layer. 7. The process of claim 1, wherein the oxide layer is formed by thermal oxidation. 8. The process of claim 1, wherein the forming an oxide layer does not oxidize material of the silicon-germanium base region. 9. A bipolar transistor, comprising: an emitter or collector region of doped silicon; a base region including silicon-germanium and forming a heterojunction with the emitter or collector region; a spacer being positioned to electrically insulate the emitter or collector region from an external region, the spacer having a silicon dioxide layer physically interposed between the emitter or collector region and a second dielectric forming the remainder of the spacer and wherein the base region does not contact the remainder of the spacer. 10. The transistor of claim 9, further comprising: the remaining of an emitter or collector region, a portion of the base region being located between the emitter region and the collector region. 11. The transistor of claim 10, wherein a portion of the emitter or collector region is interposed between the base region and the spacer. 12. The transistor of claim 10, wherein the base region has a dopant concentration that is higher than the dopant concentration in the emitter region. 13. The transistor of claim 10, wherein the emitter or collector region forms a structure aligned on the base region. 14. The transistor of claim 13, wherein the self-aligned structure comprises: a nitride layer located adjacent the silicon dioxide layer. 15. The transistor of claim 10, wherein the base region has a dopant concentration that is higher than the dopant concentration of the emitter or collector regions. 16. The transistor of claim 10, wherein the silicon dioxide layer is a thermally grown silicon dioxide. 17. The transistor of claim 10, wherein the base, emitter, and collector regions are P-type, N-type, and N-type regions, respectively. 18. The transistor of claim 9, wherein the second dielectric includes a nitride.