Canister with paper and plastic layers and a plastic lid for containing a particulate-type product, such as a ready-to-eat cereal
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B65D-043/16
출원번호
US-0584008
(2000-05-30)
발명자
/ 주소
Deering, Curtis J.
Meier, Gordon H.
Moberg, Sarah J.
Sumpmann, Patrick J.
출원인 / 주소
General Mills, Inc.
대리인 / 주소
O'Toole, John A.Taylor, Douglas J.Czaja, Timothy A.
인용정보
피인용 횟수 :
6인용 특허 :
27
초록▼
A canister for containing a particulate-type product such as a ready-to-eat cereal. The canister includes a side wall, a bottom closure and a plastic lid. The side wall defines at least a portion of a tubular body having an upper opening, a lower opening and an internal storage region for containing
A canister for containing a particulate-type product such as a ready-to-eat cereal. The canister includes a side wall, a bottom closure and a plastic lid. The side wall defines at least a portion of a tubular body having an upper opening, a lower opening and an internal storage region for containing the particulate-type product. In this regard, the side wall includes a first, paper-based layer and a second, plastic-based layer. The first, paper-based layer has an inner surface and an outer surface. The second, plastic-based layer is bonded to the inner surface of the first, paper-based layer. The bottom closure is connected to the side wall so as to encompass the bottom opening. The plastic lid is openably secure to the tubular body at the upper opening. In this regard, the plastic lid provides selective access to the internal storage region. With this configuration, the plastic lid facilitates rapid fabrication of the canister, as well as providing for increased canister durability.
대표청구항▼
A canister for containing a particulate-type product such as a ready-to-eat cereal. The canister includes a side wall, a bottom closure and a plastic lid. The side wall defines at least a portion of a tubular body having an upper opening, a lower opening and an internal storage region for containing
A canister for containing a particulate-type product such as a ready-to-eat cereal. The canister includes a side wall, a bottom closure and a plastic lid. The side wall defines at least a portion of a tubular body having an upper opening, a lower opening and an internal storage region for containing the particulate-type product. In this regard, the side wall includes a first, paper-based layer and a second, plastic-based layer. The first, paper-based layer has an inner surface and an outer surface. The second, plastic-based layer is bonded to the inner surface of the first, paper-based layer. The bottom closure is connected to the side wall so as to encompass the bottom opening. The plastic lid is openably secure to the tubular body at the upper opening. In this regard, the plastic lid provides selective access to the internal storage region. With this configuration, the plastic lid facilitates rapid fabrication of the canister, as well as providing for increased canister durability. s. 4. A method in accordance with claim 1 wherein step (b) of forming a layer of passivation comprises the step of forming a layer of oxide on the first surface of the patterned layer of metal conductors. 5. A method in accordance with claim 4 wherein step (b) of forming a layer of oxide on the first surface of the patterned layer of metal conductors comprises the step of patterning a layer of oxide in accordance with a predetermined passivation pattern on the first surface of the patterned layer of metal conductors. 6. A method in accordance with claim 4 wherein the step of forming the layer of oxide comprises the step of baking the patterned layer of metal conductors. 7. A method in accordance with claim 4 wherein the step of forming the layer of oxide comprises the step of exposing the patterned layer of metal conductors to relatively humid conditions. 8. A method in accordance with claim 1 wherein step (d) of selectively disposing the passivation cleaner, comprises the step of disposing the passivation cleaner on the reflowable conductive deposits. 9. A method in accordance with claim 8 wherein step (d) of disposing the passivation cleaner on the reflowable conductive deposits comprises the step of coating the reflowable conductive deposits with the passivation cleaner. 10. A method in accordance with claim 1 wherein step (d) of selectively disposing the passivation cleaner, comprises the step of disposing the passivation cleaner on the passivation layer in accordance with the pattern of interconnect locations. 11. A method in accordance with claim 10 wherein the step of disposing the passivation cleaner on the passivation layer comprises the step of printing the passivation cleaner on the passivation layer in accordance with the pattern of interconnect locations. 12. A method in accordance with claim 1 wherein a step prior to step (e) comprises the step of aligning the reflowable conductive deposits with the pattern of interconnect locations. 13. A method in accordance with claim 1 further comprising, after step (f), the step of encapsulating at least a part of the assembly to form a semiconductor package on the patterned layer of metal conductors. 14. A method in accordance with claim 1 further comprising, after step (f), the step of cleaning the assembly. 15. A method in accordance with claim 14 wherein the step of cleaning comprises the step of plasma cleaning. 16. A method in accordance with claim 14 further comprising, after the step of cleaning, a step of encapsulating at least a part of the assembly to form a semiconductor package on the patterned layer of metal conductors. 17. A method in accordance with claim 16 wherein the step of encapsulating comprises the step of molding. 18. A method in accordance with claim 16 further comprising, after the step of encapsulating, a step of singulating the semiconductor package from the patterned layer of metal conductors. 19. A method in accordance with claim 1 wherein step (a) comprises the step of providing a patterned copper leadframe. 20. A method in accordance with claim 19 wherein step (b) comprises the step of forming a layer of copper oxide on the patterned copper leadframe. 21. A method in accordance with claim 20 wherein step (c) comprises the step of providing the semiconductor die having the first surface with the pattern of pads thereon, wherein solder deposits are disposed on the pads. 22. A method in accordance with claim 21 wherein step (d) comprises the step of selectively disposing flux. 23. A method in accordance with claim 22 wherein step (e) comprises the step of placing the semiconductor die on the patterned copper leadframe to form the assembly, wherein the solder deposits abut portions of the layer of copper oxide, wherein the solder deposits are adjacent the pattern of interconnect locations, and wherein the flux adheres to the solder deposits and the portions of the layer of copper oxide. 24. A method in accordance with claim 23 wherein step (f) com
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이 특허에 인용된 특허 (27)
Sosler James L. (Florida NY) Hambleton Thomas P. (Thompson Ridge NY), Barrier carton with reclosable pour spout.
Sumpmann Patrick J. ; Deering Curtis J. ; Moberg Sarah J. ; Archibald William E., Canister with venting holes for containing a particulate-type product.
Swearingen David W. (2003 Chorro San Luis Obispo CA 93401) McCloskey Barnard (584 Via LaBarranca Arroyo Grande CA 93420), Closure for a flexible container.
Sireix Georges (9 bis rue St Marc-68400 Riedisheim FRX), Process for manufacturing a tubular package, and package obtained by the implementation of the process.
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