IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
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출원번호 |
US-0571540
(2000-05-16)
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우선권정보 |
EP-0660111 (1999-06-18) |
발명자
/ 주소 |
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출원인 / 주소 |
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대리인 / 주소 |
Andrus, Sceales, Starke & Sawall, LLP
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인용정보 |
피인용 횟수 :
1 인용 특허 :
6 |
초록
▼
The invention relates to an arrangement in an apparatus for analyzing, on the basis of radiation absorption properties, one or more gas component included in a gaseous medium from an origin, like exhaled air from a person. The apparatus comprises a radiation source (10); a measuring chamber (8) prov
The invention relates to an arrangement in an apparatus for analyzing, on the basis of radiation absorption properties, one or more gas component included in a gaseous medium from an origin, like exhaled air from a person. The apparatus comprises a radiation source (10); a measuring chamber (8) provided with radiation transmissive windows (7a, 7b) for receiving a gas mixture (6) from at least the gaseous medium (G1); a first detector (1), which receives the radiation passed through the gas mixture; and between the radiation source and the detector a first optical interference filter (3), which has a first radiation transmission wavelength band and which is tiltable (P) relative to the passing radiation (R) beam. The arrangement further comprises a second detector (2) directed towards a radiation input surface (5b) of the first interference filter, said second detector receiving momentarily a portion of said radiation (R) as reflected from said radiation input surface (5b) of the first interference filter (3) during the tilt (P) movement.
대표청구항
▼
The invention relates to an arrangement in an apparatus for analyzing, on the basis of radiation absorption properties, one or more gas component included in a gaseous medium from an origin, like exhaled air from a person. The apparatus comprises a radiation source (10); a measuring chamber (8) prov
The invention relates to an arrangement in an apparatus for analyzing, on the basis of radiation absorption properties, one or more gas component included in a gaseous medium from an origin, like exhaled air from a person. The apparatus comprises a radiation source (10); a measuring chamber (8) provided with radiation transmissive windows (7a, 7b) for receiving a gas mixture (6) from at least the gaseous medium (G1); a first detector (1), which receives the radiation passed through the gas mixture; and between the radiation source and the detector a first optical interference filter (3), which has a first radiation transmission wavelength band and which is tiltable (P) relative to the passing radiation (R) beam. The arrangement further comprises a second detector (2) directed towards a radiation input surface (5b) of the first interference filter, said second detector receiving momentarily a portion of said radiation (R) as reflected from said radiation input surface (5b) of the first interference filter (3) during the tilt (P) movement. in surface of said first insulating member; a semiconductor chip provided on an opposite side to said main surface of said first insulating member on which said external terminals are provided; a conductive member for electrically connecting said semiconductor chip and said external terminals, said conductive member being covered with an insulating portion comprised of said first insulating member; and a sealing member provided on the opposite side to said main surface of said first insulating member on which said external terminals are provided, wherein a second insulating member is interposed between said semiconductor chip and said first insulating member, wherein an outer edge of said second insulating member extends out to a location corresponding to an outer edge of said external terminal that is located outside an outer edge of said semiconductor chip and nearest to said semiconductor chip side, and wherein the sealing member covers said outer edge of the second insulating member. 6. A semiconductor device according to claim 5, wherein said second insulating member is flexible and has a thickness substantially the same as that of said first insulating member. 7. A semiconductor device comprising: an insulating tape having a plurality of bonding pads and lands and a conductive wiring for electrically connecting said bonding pads and said lands; a semiconductor chip; a conductive member for electrically connecting said semiconductor chip and said bonding pads, said conductive member being covered with an insulating portion comprised of said insulating tape; an adhesive member that is adhered to said semiconductor chip and provided on a semiconductor chip mounting side of said insulating tape except at least on a bonded area of said bonding pads with said conductive member; a sealing member for sealing surroundings of said semiconductor chip and said conductive member and covering an outer edge of said adhesive member; and external terminals bonded to said lands. 8. A semiconductor device according to claim 7, wherein said adhesive member has a thickness from 50 μm to 80 μm. 9. A semiconductor device according to claim 7, wherein in said insulating tape, said external terminals are positioned at an outer peripheral side of said bonding pads. 10. A semiconductor device according to claim 7, wherein said adhesive member is formed of low-elasticity material and has a thickness substantially the same as that of said insulating tape. 11. A semiconductor device comprising: an insulating tape having a plurality of bonding pads and lands and a conductive wiring for electrically connecting said bonding pads and said lands; a semiconductor chip; a conductive member for electrically connecting said semiconductor chip and said bonding pads, said conductive member being covered with an insulating portion comprised of said insulating tape; an adhesive member for gluing said semiconductor chip to a semiconductor chip mounting side of said insulating tape; a sealing member for sealing surroundings of said semiconductor chip and said conductive member and covering an outer edge of said adhesive member; and external terminals bonded to said lands that are located both outside and inside of an edge of said semiconductor chip, wherein said adhesive member is provided to cover a region including at least said lands located outside an edge of said semiconductor chip. 12. A semiconductor device according to claim 11, wherein said adhesive member is formed of low-elasticity material and has a thickness substantially the same as that of said insulating tape. 13. A semiconductor device comprising: an insulating tape having a plurality of bonding pads and lands and a conductive wiring for electrically connecting said bonding pads and said lands; a semiconductor chip; a conductive member for electrically connecting said semiconductor chip and said bonding pads, said conductive member being covered with an insulating portion comprised of said insulating tape; an adhesive member for gluing said semiconductor chip to a semiconductor chip mounting side of said insulating tape; a sealing member for sealing surroundings of said semiconductor chip and said conductive member and covering an outer edge of said adhesive member; and external terminals bonded to said lands that are located outside of an edge of said semiconductor chip, wherein said adhesive member is provided to cover a region including at least said lands located outside the edge of said semiconductor chip. 14. A semiconductor device according to claim 13, wherein said adhesive member is formed of low-elasticity material and has a thickness substantially the same as that of said insulating tape. 15. A ball grid array semiconductor device comprising: an insulating tape having a plurality of bonding pads and lands and a conductive wiring for electrically connecting said bonding pads and said lands; a semiconductor chip; a conductive member for electrically connecting said semiconductor chip and said insulating tape, said conductive member being covered with an insulating portion comprised of said insulating tape; an adhesive member for gluing said semiconductor chip to a semiconductor chip mounting side of said insulating tape; a sealing member for sealing surroundings of said semiconductor chip and said conductive member and covering an outer edge of said adhesive member; and external terminals bonded to said lands, wherein said adhesive member is provided to cover a region including said lands that are located outside an edge of said semiconductor chip. 16. A semiconductor device according to claim 15, wherein said adhesive member is formed of low-elasticity material and has a thickness substantially the same as that of said insulating tape. 17. A ball grid array semiconductor device comprising: an insulating tape having a plurality of bonding pads and lands and a conductive wiring for electrically connecting said bonding pads and said lands; a semiconductor chip; a conductive member for electrically connecting said semiconductor chip and said bonding pads, said conductive member being covered with an insulating portion comprised of said insulating tape; an adhesive member for gluing said semiconductor chip to a semiconductor chip mounting side of said insulating tape; a sealing member for sealing surroundings of said semiconductor chip and said conductive member; and external terminals bonded to said lands that are located both outside and inside of an edge of said semiconductor chip, wherein a member is provided on a semiconductor chip mounting side of said insulating tape and which covers said lands located outside an edge of said semiconductor chip, and wherein the sealing member covers an outer edge of said adhesive member. 18. A semiconductor device according to claim 17, wherein said adhesive member is formed of low-elasticity material and has a thickness substantially the same as that of said insulating tape. contact thereon for sliding engagement with said contact surface of said at least one electrical contact upon movement of said operation shaft between said closed end and said open end; a resilient member in said electrically insulating tubular case for urging said operation shaft from said closed end towards said open end; and a cover closing said open end of said electrically insulating tubular case, said cover having an opening receiving said operation shaft. 2. The push-switch according to claim 1, wherein said electrically insulating tubular case comprises an insulating resin tubular case, and wherein said open end corresponds to a top of said insulating resin tubular case and said closed end corresponds to a bottom of said insulating resin tubular case, such that said operation shaft is accommodated in said insulating resin tubular case for linear movement between said top and said bottom of said insulating resin tubular case. 3. The push-switch according to claim 2, wherein said at least one electrical contact comprises two electrical contacts fixed to said bottom of said insulating resin tubular case and projecting therefrom towards said top of said insulating resin tubular case, and wherein said at least one arm having an electrical contact thereon comprises plural arms each having an electrical contact thereon and said contact piece comprises a thin elastic metal plate, such that said plural arms are deflected when said electrical contacts on said plural arms are in sliding contact with said two electrical contacts upon linear movement of said operation shaft between said top and said bottom of said insulating resin tubular case. 4. The push-switch according to claim 3, wherein said resilient member comprises a slightly compressed coil spring for urging said operation shaft away from said bottom of said insulating resin tubular case, and wherein said opening in said cover comprise a central opening of said cover. 5. The push-switch according to claim 4, wherein said grooves comprise U-shaped grooves and said recess is centrally located between said U-shaped grooves, and wherein said fixing part includes tongues extending from opposite ends thereof, respectively, and said fixing part is positioned within said grooves by having said tongues positioned within said U-shaped grooves, respectively. 6. The push-switch according to claim 5, wherein said recess is defined by an open upper end and a lower surface, and wherein said protrusion is positioned within said recess such that said protrusion engages said lower surface. 7. The push-switch according to claim 6, further comprising two ribs projecting away from a lower side of said cover, with an inner side of each of said two ribs being flush with said contact surface of each of said two electrical contacts, respectively, such that said plural arms are deflected when said electrical contacts on said plural arms are in contact with said inner side of each of said two ribs, respectively. 8. The push-switch according to claim 7, wherein a lower surface of each of said two ribs abuts a respective upper surface of each of said two electrical contacts. 9. The push-switch according to claim 6, wherein said protrusion comprises a tongue such that a lower end of said tongue elastically engages said lower surface of said recess. 10. The push-switch according to claim 1, further comprising at least one rib projecting away from a lower side of said cover, with an inner side of said at least one rib being flush with said contact surface of said at least one electrical contact such that said electrical contact on said at least one arm is arranged for sliding engagement with said inner side of said at least one rib. 11. The push-switch according to claim 10, wherein a lower surface of said at least one rib abuts an upper surface of said at least one electrical contact. 12. The push-switch according to claim 1, wherein said rec ess is defined by an open upper end and a lower surface, and wherein said protrusion comprises a tongue such that a lower end of said tongue elastically engages said lower surface of said recess. 13. A method of manufacturing a push-switch, comprising: in an electrically insulating tubular case having an open end and a closed end with at least one electrical contact projecting from said closed end towards said open end, accommodating an operation shaft for movement between said open end and said closed end; attaching a contact piece to said operation shaft by positioning a fixing part of said contact piece into grooves provided at opposite ends of a holding part provided on a side of said operation shaft, and by positioning a protrusion of said contact piece directed toward said operation shaft into a recess of said holding part located between said grooves, such that upon movement of said operation shaft between said closed end and said open end an electrical contact on at least one arm of said contact piece slidably engages with a contact surface of said at least one electrical contact; positioning a resilient member in said electrically insulating tubular case for urging said operation shaft from said closed end towards said open end; and closing said open end of said electrically insulating tubular case with a cover having an opening such that said operation shaft is received within said opening. 14. The method according to claim 13, wherein accommodating an operation shaft in an electrically insulating tubular case comprises accommodating said operation shaft in an insulating resin tubular case, and wherein said open end corresponds to a top of said insulating resin tubular case and said closed end corresponds to a bottom of said insulating resin tubular case, such that accommodating said operation shaft in said insulating resin tubular case comprises accommodating said operation shaft in said insulating resin tubular case for linear movement between said top and said bottom of said insulating resin tubular case. 15. The method according to claim 14, wherein said at least one electrical contact comprises two electrical contacts fixed to said bottom of said insulating resin tubular case and projecting therefrom towards said top of said insulating resin tubular case, such that accommodating said operation shaft in said insulating resin tubular case for linear movement between said top and said bottom of said insulating resin tubular case comprises accommodating said operation shaft in said insulating resin tubular case for linear movement between said top and said bottom with said two electrical contacts fixed to said bottom, and wherein said at least one arm having an electrical contact thereon comprises plural arms each having an electrical contact thereon and said contact piece comprises a thin elastic metal plate, such that attaching said contact piece to said operation shaft by positioning a fixing part of said contact piece into grooves provided at opposite ends of a holding part provided on a side of said operation shaft and by positioning a protrusion of said contact piece into a recess of said holding part located between said grooves allows for said plural arms to be deflected when said electrical contacts on said plural arms are in sliding contact with said two electrical contacts upon linear movement of said operation shaft between said top and said bottom of said insulating resin tubular case. 16. The method according to claim 15, wherein said resilient member comprises a slightly compressed coil spring, such that positioning a resilient member in said electrically insulating tubular case comprises positioning said slightly compressed coil spring in said insulating resin tubular case for urging said operation shaft away from said bottom of said insulating resin tubular case, and wherein said opening in said cover comprises a central opening of said cover, such that closing said open e
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