Thermal management device and method of making such a device
IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0719478
(2001-03-05)
|
우선권정보 |
GB-19980014835 (1998-07-08); GB-19980025376 (1998-11-19); GB-19990000924 (1999-01-15) |
국제출원번호 |
PCT/GB99/02180
(1999-07-08)
|
국제공개번호 |
WO00/03567
(2000-01-20)
|
발명자
/ 주소 |
- Gandi, Angelo
- De Oliveira, Rui
- Carter, Anthony Arthur
|
출원인 / 주소 |
- Queen Mary and Westfield College, University of London
|
대리인 / 주소 |
Dicke, Billig & Czaja, P.A.
|
인용정보 |
피인용 횟수 :
9 인용 특허 :
9 |
초록
A thermal management device includes an isotropic carbon encapsulated in an encapsulating material that improves the strength of the carbon. The encapsulating material may be e.g. polyimide, epoxy resin, acrylic, polyurethane, polyester, or any other suitable polymer.
대표청구항
▼
A thermal management device includes an isotropic carbon encapsulated in an encapsulating material that improves the strength of the carbon. The encapsulating material may be e.g. polyimide, epoxy resin, acrylic, polyurethane, polyester, or any other suitable polymer. US-6197230, 20010300, Pierre e
A thermal management device includes an isotropic carbon encapsulated in an encapsulating material that improves the strength of the carbon. The encapsulating material may be e.g. polyimide, epoxy resin, acrylic, polyurethane, polyester, or any other suitable polymer. US-6197230, 20010300, Pierre et al.; US-6210801, 20010400, Luo et al.; US-6221487, 20010400, Luo et al.; US-6235392, 20010500, Luo et al.; US-6306334, 20011000, Luo et al. l., 210/321.8; US-4982793, 19910100, Holtmyer et al., 166/305.1; US-5067565, 19911100, Holtmyer et al., 166/305.1; US-5122529, 19920600, Holotmyer et al., 523/130; US-5770712, 19980600, Roy et al., 536/020; US-6068619, 20000500, Hamajima et al., 604/378
이 특허에 인용된 특허 (9)
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Grapes Thomas F. (Columbia MD) Fertig Timothy M. (Pasadena MD) Schroeder Mark S. (Severna Park MD), Composite heat transfer means.
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Ali M. Akbar ; Peterson Carl W. ; McNab Kevin M., Electronic structure having an embedded pyrolytic graphite heat sink material.
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Kibler John J. (Lansdale PA) Cassin Thomas G. (Prospectville PA), High conductivity hydrid material for thermal management.
-
Bristowe William W. (Wilmington DE) Kim Hong C. (Wilmington DE), Metal or plastic-clad polyvinyl resin laminates.
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Hecht Daniel H. ; Schulz David A., Method for the preparation of high modulus carbon and graphite articles.
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Oldenettel Jayne L. (Kent WA), Printed wire circuit board and its method of manufacture.
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Jensen Warren M. (Kirkland WA), Printed wiring board substrates for ceramic chip carriers.
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Olla Michael A. (Austin TX) Dolbear Thomas P. (Austin TX) Hashemi Seyed H. (Austin TX), Thermally conductive screen mesh for encapsulated integrated circuit packages.
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Samejima, Souhei; Sato, Sadao; Osuga, Hiroyuki; Utsumi, Shigeru; Kumada, Teruhiko, Printed circuit board and method of manufacturing the same.
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Gandi, Angelo; De Oliveira, Rui; Carter, Anthony Arthur, Thermal management device and method of making such a device.
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