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Equipment rack with integral HVAC and power distribution features

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • A47F-007/00
출원번호 US-0893517 (2001-06-29)
발명자 / 주소
  • Broome, John P.
출원인 / 주소
  • ServerVault Corp.
대리인 / 주소
    Nixon & Vanderhye P.C.
인용정보 피인용 횟수 : 29  인용 특허 : 24

초록

A rack element for mounting electronic equipment thereon, including: a front portion, a rear portion, and a pair of side portions defining an interior of the rack element therebetween. The interior of the rack element is partitioned into a front section and rear section, wherein the front section de

대표청구항

A rack element for mounting electronic equipment thereon, including: a front portion, a rear portion, and a pair of side portions defining an interior of the rack element therebetween. The interior of the rack element is partitioned into a front section and rear section, wherein the front section de

이 특허에 인용된 특허 (24)

  1. Speraw Floyd G. (Lexington SC), Air cooling assembly in an electronic system enclosure.
  2. Gates Frank Vernon, Apparatus for heat removal from a PC card array.
  3. Nishikawa Masaharu,JPX, Battery frame structure for electric motorcar.
  4. Flores Michael A. (Plano TX) Massacesi Peter A. (Plano TX) Low Andrew G. (McKinney TX), Built-in cooling system for an enclosure.
  5. Kociecki John, Card cage mounted power supply with heat dissipating architecture.
  6. Kametani Masatsugu (Ibaraki JPX) Umekita Kazuhiro (Ibaraki JPX), Circuit board, electronic circuit chip-mounted circuit board and circuit board apparatus.
  7. Martin Jacob (Wellesley MA), Combination conductive and convective heatsink.
  8. Atarashi Takayuki,JPX ; Tanaka Tetsuya,JPX ; Daikoku Takahiro,JPX, Cooling apparatus for electronic device.
  9. Leyssens Francois J. C. (Mortsel BEX) Rombouts Hendrikus M. J. (Zoersel BEX), Cooling system.
  10. Reimer William A. (Wheaton IL), Electrical apparatus frame.
  11. Paulsen ; Donald E., Electrical/electronic rack and plug-in modules therefor.
  12. Schwehr Gregory D. (Milwaukee WI) Zibolski Richard E. (Menomonee Falls WI), Electronic circuit module with improved cooling.
  13. Sugiyama Akira,JPX ; Hoshino Tsutomu,JPX ; Yoshida Shinichi,JPX ; Joeng Tan Tjang,JPX, Electronic equipment.
  14. Schkrohowsky Guenter (Boise ID) Dowdy James L. (Eagle ID) Poulter Darrel W. (Middleton ID), Enclosure with redundant air moving system.
  15. Chu Richard C. ; Chrysler Gregory M., Evaporator for use in an extended air cooling system for electronic components.
  16. Ou Chan C. (12 F. ; 275 Yuan-Hua Rd. Chungli City ; Taoyuan Hsien TWX), Household drying center.
  17. Barrett, Howard W.; Fledderjohann, Paul F., Indirect cooling of electronic circuits.
  18. Bartilson Bradley W., Large area, multi-device heat pipe for stacked MCM-based systems.
  19. Nakajima Tadakatsu (Ibaraki JPX) Ohashi Shigeo (Tsuchiura JPX) Kuwahara Heikichi (Ibaraki JPX) Ashiwake Noriyuki (Tsuchiura JPX) Sato Motohiro (Ibaraki JPX) Hatsuda Toshio (Ibaraki JPX) Daikoku Takah, Liquid impingement cooling module for semiconductor devices.
  20. Sorensen Bradford T. (201 S. Lake Ave. ; Suite 405 Pasadena CA 91101) Rogers Bruce (3960 Laurel Canyon Blvd. ; Suite 374 Studio City CA 91604) Leonard Steven S. (14744 Hepsy St. Sherman Oaks CA 91403, Modular stackable interlocking storage cabinet for electronic components.
  21. Brown David W. (Bellingham MA), Plenum for air-impingement cooling of electronic components.
  22. Diggelmann Hans (Neuenegg CHX) Ulrich Bohdan (Kehrsatz CHX), Process and apparatus for dissipating the heat loss of at least one assembly of electrical elements.
  23. Skroupa James D. (Ellicott City MD), Replaceable air seal for force cooled removable electronic units.
  24. Stalley Anthony Donald (Ascot GBX), Stackable electronic equipment assembly with improved circuit board cooling arrangement.

이 특허를 인용한 특허 (29)

  1. VanGilder, James W.; Germagian, Mark H., Cold aisle isolation.
  2. VanGilder, James W.; Germagian, Mark H., Cold aisle isolation.
  3. VanGilder, James W.; Germagian, Mark H., Cold aisle isolation.
  4. Day, Tony, Data center cooling.
  5. Day, Tony, Data center cooling.
  6. Day, Tony, Data center cooling.
  7. Day, Tony, Data center cooling.
  8. Day, Tony, Data center cooling.
  9. Fink, James R.; Bean, John H.; Held, Stephen F.; Johnson, Richard J.; Johnson, Rollie R., Data center cooling.
  10. Fink, James R.; Bean, Jr., John H.; Held, Stephen F.; Johnson, Richard J.; Johnson, Rollie R., Data center cooling.
  11. Fink, James R.; Bean, Jr., John H.; Held, Stephen F.; Johnson, Richard J.; Johnson, Rollie R., Data center cooling.
  12. Fink,James R.; Bean, Jr.,John H.; Held,Stephen F.; Johnson,Richard J.; Johnson,Rollie R., Data center cooling.
  13. Fink, James, Data center cooling system.
  14. Gravina, Matteo B., Data center cooling system having electrical power generation.
  15. Gravina, Matteo B., Data center cooling system having electrical power generation.
  16. Champion, David F.; Dittus, Karl K.; Gundlach, John G.; Miller, Michael S., Data communications and power distribution in a computer equipment rack.
  17. Huyett, David A.; Gessner, Bryan M., Device rack incorporating multiple mounting planes.
  18. Mok, Lawrence S., Method of constructing a multicomputer system.
  19. Guo, Yulong; Weng, Jiangang; Wan, Jun; Liu, Fan, Modular data center.
  20. Rathbone, Jason; Rotelli, Michael; Tolmie, David, Modular rack system.
  21. Adducci, Samuel J; Doorhy, Brendan F; Walker, Jonathan D; Johnson, Rhonda; Calder, Andrew R, Network cabinet with thermal air flow management.
  22. Adducci, Samuel J.; Doorhy, Brendan F.; Walker, Jonathan D.; Johnson, Rhonda L.; Calder, Andrew R., Network cabinet with thermal air flow management system.
  23. Adducci, Samuel J.; Doorhy, Brendan F.; Walker, Jonathan D.; Johnson, Rhonda L.; Calder, Andrew R., Network cabinet with thermal airflow management system.
  24. Schloss,Rheid J., Raceway system.
  25. Germagian,Mark; VanGilder,James; Dudek,Jason, Rack height cooling.
  26. Germagian,Mark; VanGilder,James; Dudek,Jason, Rack height cooling.
  27. Murakami,Vance; Belady,Christian L., Rack-mount equipment bay cooling heat exchanger.
  28. Fleming, James N.; Goldsberry, Timothy; Shurhay, Mark; Hibner, Max W., Thermal ducting system.
  29. Gravina, Matteo B., Thermal energy accumulator for power generation and high performance computing center.
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