$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Substrate transfer shuttle 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B65G-001/33
출원번호 US-0082484 (1998-05-20)
발명자 / 주소
  • White, John M.
  • Turner, Norman L.
  • Tiner, Robin L.
  • Keller, Ernst
  • Kurita, Shinichi
  • Blonigan, Wendell T.
  • Berkstresser, David E.
출원인 / 주소
  • Applied Komatsu Technology, Inc.
대리인 / 주소
    Thomason, Moser & Patterson, L.L.P.
인용정보 피인용 횟수 : 35  인용 특허 : 55

초록

The present invention provides an apparatus and method for substrate transport. In systems according to the invention, at least a first and second chamber are provided. The first chamber may be a load lock and the second chamber a processing chamber. A substrate transfer shuttle is provided and is m

대표청구항

The present invention provides an apparatus and method for substrate transport. In systems according to the invention, at least a first and second chamber are provided. The first chamber may be a load lock and the second chamber a processing chamber. A substrate transfer shuttle is provided and is m

이 특허에 인용된 특허 (55)

  1. Chu Jack Oon ; Ismail Khalid Ezzeldin, Advance integrated chemical vapor deposition (AICVD) for semiconductor devices.
  2. White John M. (Hayward CA) Berkstresser David E. (Los Gatos CA) Petersen Carl T. (Fremont CA), Alignment of a shadow frame and large flat substrates on a heated support.
  3. White John M. (2811 Colony View Pl. Hayward CA 94541) Berkstresser David E. (19311 Bear Creek Rd. Los Gatos CA 95030) Petersen Carl T. (1185 Gilbert Ct. Fremont CA 94536), Alignment of a shadow frame and large flat substrates on a support.
  4. Prentakis Antonios E. (Cambridge MA), Apparatus and method for loading and unloading wafers.
  5. Hirasawa Shigeki (Ibaraki) Torii Takuji (Ushiku) Watanabe Tomoji (Ibaraki) Komatsu Toshihiro (Ibaraki) Honma Kazuo (Ibaraki) Sakai Akihiko (Ibaraki) Takagaki Tetsuya (Tokorozawa) Uchino Toshiyuki (To, Apparatus and method for performing heat treatment on semiconductor wafers.
  6. Stevens Craig L. (Felton CA), Apparatus for aligning substrates for loading and unloading using a robot mechanism.
  7. Ushijima Mitsuru (Tokyo JPX) Akimoto Masami (Kikuchi JPX), Apparatus for coating a photo-resist film and/or developing it after being exposed.
  8. Anderle Friedrich (Hanau DEX) Patz Ulrich (Linsengericht DEX), Apparatus for coating substrates, preferably flat, more or less plate-like substrates.
  9. Sugimoto Kenji (Kyoto JPX), Apparatus for treating the surfaces of wafers.
  10. Giammanco Rosario P. (Gloucester MA), Article delivery and transport apparatus for evacuated processing equipment.
  11. Tanaka Hirokuni (Ooiso JPX), Clean tunnel conveying structure.
  12. Tepman Avi ; Yin Gerald Zheyao ; Olgado Donald, Compartmentalized substrate processing chamber.
  13. Toriumi Kiyoshi (Tokyo) Kimura Kazumasa (Tokyo JPX), Conveying apparatus used in assembling semicondutors.
  14. Southworth Peter R. (Mission Viejo CA) Baxter Gregory R. (Orange CA), Conveyor system.
  15. Burney Roger D. (Sunnyvale CA), Distributed routing unit for fully-automated flexible manufacturing system.
  16. Asakawa Teruo (Yamanashi JPX) Ohsawa Tetsu (Kofu JPX), Handling apparatus for transferring carriers and a method of transferring carriers.
  17. Chizinsky George (143 West St. Beverly Farms MA 01915), Heated plate rapid thermal processor.
  18. Chizinsky George (143 West St. Beverly Farms MA 01915), Heated plate rapid thermal processor.
  19. Flint Alan (Los Gatos CA) Miller Ken (Mt. View CA) Shah Sushil (Sunnyvale CA), In-line disk sputtering system.
  20. Aruga Yoshiki,JPX ; Kamikura Yo,JPX, In-line film deposition system.
  21. Tietz James V. ; Bierman Benjamin, Lift pin and support pin apparatus for a processing chamber.
  22. Hasegawa Yoshiro,JPX ; Suzuki Naoyuki,JPX ; Abe Tomoaki,JPX, Magnetic transfer system, power transmission mechanism of the magnetic transfer system, and rotational driving member u.
  23. Shimoyashiro Sadao (Fujisawa JPX) Iwasaki Takemasa (Yokohama JPX) Kawaji Hiroyuki (Yokohama JPX) Hamada Toyohide (Yokohama JPX) Ikeda Minoru (Yokohama JPX) Kikuchi Hiroshi (Hiratsuka JPX) Nagatomo Hi, Method and apparatus for carrying a variety of products.
  24. Coleman John H. (Locust Valley NY), Method of forming semiconducting materials and barriers using a dual enclosure apparatus.
  25. Coleman John H. (Locust Valley NY), Method of forming semiconducting materials and barriers using a multiple chamber arrangement.
  26. Turner Norman L. (Mountain View CA) White John MacNeill (Los Gatos CA) Berkstresser David (Los Gatos CA), Method of heating and cooling large area glass substrates.
  27. Turner Norman L. (Mountain View CA) White John M. (Los Gatos CA) Berkstresser David (Los Gatos CA), Method of heating and cooling large area substrates and apparatus therefor.
  28. Yamabe Kikuo (Yokohama JPX) Okumura Katsuya (Yokohama JPX), Method of thermally processing semiconductor wafers and an apparatus therefor.
  29. Maydan Dan (Los Altos Hills CA) Somekh Sasson (Redwood City CA) Wang David N. (Cupertino CA) Cheng David (San Jose CA) Toshima Masato (San Jose CA) Harari Isaac (Mountain View CA) Hoppe Peter D. (Sun, Multi-chamber integrated process system.
  30. Namiki Minoru (Fuchu JPX) Takahashi Nobuyuki (Fuchu JPX), Multi-chamber integrated process system.
  31. Hartig Klaus (Brighton MI) Szczyrbowski Joachim (Goldbach DEX), Multichamber coating apparatus.
  32. Maydan Dan (Los Altos Hills CA) Somekh Sasson (Redwood City CA) Wang David N. (Cupertino CA) Cheng David (San Jose CA) Toshima Masato (San Jose CA) Harari Isaac (Mountain View CA) Hoppe Peter D. (Sun, Multichamber integrated process system.
  33. Kaneko Satoshi (Yokohama JPX) Fugita Taichi (Yamato JPX) Yoshida Yukimasa (Yokohama JPX) Okumura Katsuya (Yokohama JPX), Pressure-reduced chamber system having a filter means.
  34. Schmitt Jacques (La Ville Du Bois FRX), Process and means for producing films for use in electronics and/or optoelectronics using plasma.
  35. Lee Chunghsin (Lynnfield MA), Rapid thermal furnace for semiconductor processing.
  36. Ozias Albert E. (Aumsville OR), Reaction chambers for CVD systems.
  37. Grunes Howard (Santa Cruz CA) Tepman Avi (Cupertino CA) Lowrance Robert (Los Gatos CA), Robot assembly.
  38. Stevens Craig L. (Felton CA), Self-calibration system for robot mechanisms.
  39. Wu Hong-Jen,TWX ; Chen Taylor,TWX ; Lai Jack,TWX ; Chen I. I.,TWX, Single semiconductor wafer transfer method and manufacturing system.
  40. Deligi Mario (Newton NJ) Derbinsky Senia (River Edge NY), Spiral magnetic linear translating mechanism.
  41. Hughes John L. (Rodeo CA) Lawson Eric C. (Sunnyvale CA), Substrate handling and processing system.
  42. Matsumura Yoshio (Hikone JPX) Shimaji Katsumi (Hikone JPX), Substrate processing apparatus.
  43. Harada Junji (Kumamoto JPX) Harada Ichiro (Kumamoto JPX) Nakamura Koji (Kumamoto JPX), Substrate processing method and substrate processing apparatus.
  44. Ueyama Tsutomu (Kyoto JPX) Adachi Hideki (Kyoto JPX) Matsumura Yoshio (Hikone JPX) Tanaka Yasuhide (Kyoto JPX), Subtrate processing apparatus and device for and method of exchanging substrate in substrate processing apparatus.
  45. Moslehi Mehrdad M. (Palo Alto CA) Saraswat Krishna C. (Santa Clara County CA), Thermal/microwave remote plasma multiprocessing reactor and method of use.
  46. Peyraud Dominique (Bienne CHX) Voumard Martial (Bienne CHX), Transfer machine for sealing electronic or like components under vacuum.
  47. Norman Arthur E. (Northridge CA), Transport system for inline vacuum processing.
  48. Babinski John Paul (Essex Junction VT) Bertelsen Bruce Irving (Essex Junction VT) Raacke Karl Heinz (Essex Junction VT) Sirgo Valdeko Harry (Colchester VT) Townsend Clarence Jay (Essex Junction VT), Transport system for semiconductor wafer multiprocessing station system.
  49. Lowrance Robert B. (Los Gatos CA), Two-axis magnetically coupled robot.
  50. Lowrance Robert B. (Los Gatos CA), Two-axis magnetically coupled robot.
  51. Lowrance Robert B. (Los Gatos CA), Two-axis magnetically coupled robot.
  52. Katagiri Yoshitaka (Yokohama JPX), Vacuum processing apparatus and transportation system thereof.
  53. Katagiri Yoshitaka (Yokohama JPX), Vacuum processing apparatus and transportation system thereof.
  54. Turner Norman L. (Mountain View CA) White John M. (Hayward CA), Vacuum processing apparatus having improved throughput.
  55. Dorenbos Frederick William (El Cerrito CA), Workpiece handling system for vacuum processing.

이 특허를 인용한 특허 (35)

  1. Lee,Jae Chull; Berkstresser,David, Curved slit valve door with flexible coupling.
  2. Lee, Jae-Chull; Kurita, Shinichi; White, John M.; Anwar, Suhail, Decoupled chamber body.
  3. Kurita, Shinichi; Blonigan, Wendell T., Double dual slot load lock chamber.
  4. Kurita, Shinichi; Blonigan, Wendell T.; Hosokawa, Akihiro, Dual substrate loadlock process equipment.
  5. Han, Nianci; Xu, Li; Shih, Hong; Zhang, Yang; Lu, Danny; Sun, Jennifer Y., Electroplating an yttrium-containing coating on a chamber component.
  6. Fukuoka, Tetsuo; Akimoto, Masami; Kitano, Takahiro; Kimura, Yoshio; Hayashi, Shinichi; Ito, Hikaru, Heating apparatus, and coating and developing apparatus.
  7. Kok,Ronaldus Joannes Cornelis Maria; Evers,Marinus Franciscus Johannes; Dings,Franciscus Cornelius, In-line process for making thin film electronic devices.
  8. Kurita, Shinichi; Blonigan, Wendell T.; Tanase, Yoshiaki, Large area substrate transferring method for aligning with horizontal actuation of lever arm.
  9. Hofmeister, Christopher; Caveney, Robert T., Linear substrate transport apparatus.
  10. White,John M.; Blonigan,Wendell T., Linear vacuum deposition system.
  11. Kurita,Shinichi; Blonigan,Wendell T.; Tanase,Yoshiaki, Load lock chamber for large area substrate processing system.
  12. Kurita,Shinichi; Blonigan,Wendell T., Load lock chamber having two dual slot regions.
  13. Lee, Jae-Chull; Anwar, Suhail; Kurita, Shinichi, Load lock chamber with decoupled slit valve door seal compartment.
  14. Kurita,Shinichi; Blonigan,Wendell T., Method for transferring substrates in a load lock chamber.
  15. Bachrach, Robert Z., Method of achieving high productivity fault tolerant photovoltaic factory with batch array transfer robots.
  16. Bachrach,Robert Z., Method of achieving high productivity fault tolerant photovoltaic factory with batch array transfer robots.
  17. Han, Nianci; Xu, Li; Shih, Hong, Method of manufacturing a process chamber component having yttrium-aluminum coating.
  18. Kurita, Shinichi; Anwar, Suhail; Lee, Jae-Chull, Multiple slot load lock chamber and method of operation.
  19. Dannoux, Thierry Luc Alain; Fredholm, Allan Mark; Joubaud, Laurent; Peschiera, Sophie; Poissy, Stephane, Process and system for precision glass sheet bending.
  20. Han, Nianci; Xu, Li; Shih, Hong; Zhang, Yang; Lu, Danny; Sun, Jennifer Y., Process chamber component having electroplated yttrium containing coating.
  21. Han, Nianci; Xu, Li; Shih, Hong, Process chamber component having yttrium—aluminum coating.
  22. Han, Nianci; Xu, Li; Shih, Hong, Process chamber having component with yttrium-aluminum coating.
  23. Toshima, Masato; Can, Linh, Processing apparatus and processing method.
  24. Lee,Byung Il, Semiconductor manufacturing system and wafer holder for semiconductor manufacturing system.
  25. Blonigan,Wendell T.; White,John M., Substrate conveyor system.
  26. Hofmeister, Christopher; Caveney, Robert T., Substrate processing apparatus.
  27. Hofmeister, Christopher; Caveney, Robert T., Substrate processing apparatus.
  28. Hofmeister, Christopher; Caveney, Robert T., Substrate processing apparatus.
  29. Hofmeister, Christopher; Caveney, Robert T., Substrate processing apparatus.
  30. Hofmeister, Christopher; Caveney, Robert T., Substrate processing apparatus.
  31. Hofmeister, Christopher; Caveney, Robert T., Substrate processing apparatus.
  32. Hosek, Martin; Hofmeister, Christopher; Krupyshev, Alexander, Substrate processing apparatus.
  33. Klein, Martin P.; Felsenthal, David; Sferlazzo, Piero, Substrate processing pallet and related substrate processing method and machine.
  34. White, John M.; Turner, Norman L.; Tiner, Robin L.; Keller, Ernst; Kurita, Shinichi; Blonigan, Wendell T.; Berkstresser, David E., Substrate transfer shuttle.
  35. Kim, Sam Hyungsam; Lee, Jae-Chull; Sterling, William N.; Brown, Paul, Valve door with ball coupling.

관련 콘텐츠

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로