초록 ▼

The present invention is directed to implantable hearing aid systems and provides for selective interconnection between two or more implantable components of a system. The inventive apparatus comprises a first connector interconnected to a first implantable component and a second connector interconn

The present invention is directed to implantable hearing aid systems and provides for selective interconnection between two or more implantable components of a system. The inventive apparatus comprises a first connector interconnected to a first implantable component and a second connector interconnected to a second implantable component which is separate from the first implanted component. The first and second connectors may each comprise outer housings and internal conductors, wherein the outer housings are configured to define male and female connectors for mating interconnection therebetween. In one arrangement, a female connector is defined by a support structure that also supports an interconnected implantable component (e.g., a processor unit and/or induction coil), and wherein the male connector is interconnected to another, separate component (e.g., a middle ear actuator). The support structure may be integrally defined by a molded material (e.g., a silicon-based material). One or more locking member(s) may be provided for selective insertion into the outer housing of the female connector to securably engage the male connector (e.g., the central conductor thereof). The invention facilitates in situ interconnection of plural implantable components in an implantable hearing aid system, and further allows for selective removal/repositioning of one or more of the interconnected components.

대표청구항 ▼

The present invention is directed to implantable hearing aid systems and provides for selective interconnection between two or more implantable components of a system. The inventive apparatus comprises a first connector interconnected to a first implantable component and a second connector interconn

The present invention is directed to implantable hearing aid systems and provides for selective interconnection between two or more implantable components of a system. The inventive apparatus comprises a first connector interconnected to a first implantable component and a second connector interconnected to a second implantable component which is separate from the first implanted component. The first and second connectors may each comprise outer housings and internal conductors, wherein the outer housings are configured to define male and female connectors for mating interconnection therebetween. In one arrangement, a female connector is defined by a support structure that also supports an interconnected implantable component (e.g., a processor unit and/or induction coil), and wherein the male connector is interconnected to another, separate component (e.g., a middle ear actuator). The support structure may be integrally defined by a molded material (e.g., a silicon-based material). One or more locking member(s) may be provided for selective insertion into the outer housing of the female connector to securably engage the male connector (e.g., the central conductor thereof). The invention facilitates in situ interconnection of plural implantable components in an implantable hearing aid system, and further allows for selective removal/repositioning of one or more of the interconnected components. 19840700, Tokunaga et al.; US-4523207, 19850600, Lewis et al.; US-4533640, 19850800, Shafer; US-4628000, 19861200, Talvalkar et al.; US-4687701, 19870800, Knirsch et al.; US-4698268, 19871000, Ueyama; US-4707395, 19871100, Ueyama et al.; US-4737463, 19880400, Bhattacharjee et al.; US-4777079, 19881000, Nagamoto et al.; US-4778729, 19881000, Mizobuchi; US-4812053, 19890300, Bhattacharjee, 374/102; US-4869941, 19890900, Ohki; US-4917503, 19900400, Bhattacharjee, 374/102; US-4923749, 19900500, Talvalkar; US-4931420, 19900600, Asano et al.; US-4975332, 19901200, Shini et al.; US-4983446, 19910100, Taniguchi et al.; US-4988563, 19910100, Wehr; US-5047455, 19910900, Hesse et al., 523/508; US-5057434, 19911000, Prusik et al., 116/206; US-5128308, 19920700, Talvalkar; US-5236886, 19930800, Tsuchiya et al., 428/195; US-5240781, 19930800, Obata et al.; US-5248652, 19930900, Talvalkar; US-5420000, 19950500, Patel et al.; US-5476792, 19951200, Ezrielev et al.; US-6011573, 20000100, Nagahamaya et al., 347/217 mounted in close proximity to said rod in a housing attached to said solid rod. 13. The ultrasonic thermometer system of claim 9 further comprising an automatic gain circuit mounted in said head box for keeping signal levels constant to eliminate manufacturing variations. 14. The ultrasonic thermometer system of claim 9 wherein said grain stable material is a high purity, grain stabilized polycrystalline aluminum oxide. 15. The ultrasonic thermometer system of claim 11 wherein said waveform templates are correlation waveform templates which are specific to said grooves in said rod to which said read-only memory is connected. 16. The ultrasonic thermometer system of claim 10 where in said calibration information is information identifying the material out of which said rod is manufactured. 17. A method of determining temperature using an ultrasonic thermometer system that includes a solid rod of grain stable material, said rod having one or more circumferential grooves cut through the surface of the rod and a transducer bonded to one end of said rod, said method comprising the steps of: obtaining signals generated by said transducer; amplifying, filtering and conditioning signals obtained from said transducer; correlating signals generated by said transducer and reflected by said grooves with a waveform template to determine periods in time where peak reflected energy occurs, said waveform template being a single waveform template unique to said rod; generating a temperature reading based on said periods in time where the peak reflected energy occurs. 18. A method of determining temperature using an ultrasonic thermometer system that includes a solid rod of grain stable material, said rod having one or more circumferential grooves cut through the surface of the rod and a transducer bonded to one end of said rod, said method comprising the steps of: obtaining signals generated by said transducer; amplifying, filtering and conditioning signals obtained from said transducer; correlating signals generated by said transducer and reflected by said grooves with waveform templates to determine periods in time where peak reflected energy occurs, said waveform templates being a plurality of waveform templates with one unique waveform template being assigned to each of said grooves; generating a temperature reading based on said periods in time where the peak reflected energy occurs. towards a vertical focusing baseline extending substantially horizontally and transversely to the optical axis and passing close to the focus of the lens, wherein the mirror further comprises at least one corrected vertical focusing area for concentrating the light, in the vertical direction, towards a second vertical focusing baseline separate from said vertical focusing baseline in the axial direction, in order thus to increase a width of the light reflected by said first area along said optical axis. 2. A headlamp as claimed in claim 1, wherein said at least one corrected vertical focusing area comprise two corrected focusing areas, situated on either said of an axial vertical plane. 3. A headlamp as claimed in claim 2, wherein said areas are extreme lateral areas of the mirror. 4. A headlamp as claimed in claim 1, wherein the second vertical focusing line disposed further in the axial direction than said vertical focusing baseline. 5. A headlamp as claimed in claim 1, wherein the mirror further comprises at least one vertical offsetting area for offsetting the light in at least one direction vertically upwards or downwards with respect to the vertical focusing baseline. 6. A headlamp as claimed in claim 5, comprising a vertical offsetting area located in the central region of the mirror and adapted to offset the light upwards, and two vertical offsetting areas located on either side of said central region and adapted to offset the light downwards. 7. A headlamp as claimed in claim 5, wherein the vertical offsetting area is constructed from sections of axisymmetric ellipsoids a first focus of which is situated above or below the source and a second focus of which is situated on a vertical focusing line associated with said vertical offsetting area. 8. A headlamp as claimed in claim 7, wherein the first focus of each ellipsoidal section is situated substantially in the vertical to the center of the source. 9. A headlamp as claimed in claim 8, wherein the vertical distances between the first focuses of the various ellipsoidal sections and the center of the source vary progressively from one section to the other. 10. A headlamp as claimed in claim 9, wherein, from the back of the mirror to its lateral edges, said vertical distances pass progressively from a first value corresponding to a first focal position situated below the source to a second value, of opposite sign, corresponding to a first focal position situated above the source. 11. A headlamp as claimed in claim 10, wherein, in the region of the lateral edges of the mirror, said vertical distance is essentially zero.