초록 ▼

An polishing apparatus consists of a piston which is fixed to the rotation axis, a ceramic plate which is oppositely arranged against the piston via a silicone gel, and a cylinder which houses these components. The wafer is attached on the bottom surface of a backing pad, and will be pressed and rot

An polishing apparatus consists of a piston which is fixed to the rotation axis, a ceramic plate which is oppositely arranged against the piston via a silicone gel, and a cylinder which houses these components. The wafer is attached on the bottom surface of a backing pad, and will be pressed and rotated by the piston in order to polish the surface thereof.

대표청구항 ▼

1. An apparatus for polishing a semi-conductor wafer, comprising: a housing member which maintains a fluid in a sealed condition; a shaft; a pressing member fixedly connected to said shaft which presses the fluid while maintaining the sealed condition of the housing member by application forces

1. An apparatus for polishing a semi-conductor wafer, comprising: a housing member which maintains a fluid in a sealed condition; a shaft; a pressing member fixedly connected to said shaft which presses the fluid while maintaining the sealed condition of the housing member by application forces to the shaft, said pressing member capable of movement related to said housing member; an engaging means for engaging the pressing member with the housing member; a supporting member on a lower end of said housing member which faces the pressing member so as to sandwich the fluid, and which receives on an entire surface of one side thereof pressure from the fluid thereby causing said housing member and supporting member to move downwardly and press the semiconductor wafer located on the opposite side thereof; and a polishing member which faces the supporting member so as to sandwich the semiconductor wafer, and which polishes a surface of the semiconductor wafer. 2. An apparatus for polishing a semiconductor wafer as claimed in claim 1, wherein the housing member has an inner diameter which is larger than a diameter of the semiconductor wafer. 3. An apparatus for polishing a semiconductor wafer as claimed in claim 1, further comprising driving means for rotating relatively the semiconductor wafer held on the polishing member. 4. An apparatus for polishing a semiconductor wafer as claimed in claim 3, wherein the driving means supplies a rotation force to the pressing member to rotate the pressing member about its own axis. 5. An apparatus for polishing a semiconductor wafer as claimed in claim 1, wherein the fluid is a silicone oil. 6. An apparatus for polishing a semiconductor wafer as claimed in claim 5, wherein the silicone oil has a viscosity of 10-1,000 cst. 7. An apparatus for polishing a semiconductor wafer as claimed in claim 1, wherein the fluid is a liquid silicone rubber. 8. An apparatus for polishing a semiconductor wafer as claimed in claim 7, wherein the liquid silicone rubber has a viscosity of 1,000-8,000 poise. 9. An apparatus for polishing a semiconductor wafer, comprising: a housing member which houses an elastic member; a shaft; a pressing member fixedly secured to said shaft which presses the elastic member in the housing member by the application of a force to said shaft; a supporting member which faces the pressing member so as to sandwich the elastic member, and which receives on an entire surface of one side thereof a elastic force of the elastic member and presses the semiconductor wafer located on the side of the other one side thereof; and a polishing member which faces the supporting member so as to sandwich the semiconductor wafer, and which polishes a surface of the semiconductor wafer. 10. An apparatus for polishing a semiconductor wafer as claimed in claim 9, wherein the housing member has an inner diameter which is larger than a diameter of the semiconductor wafer. 11. An apparatus for polishing a semiconductor wafer as claimed in claim 9, further comprising driving means for rotating relatively the semiconductor wafer held on the wafer holding member and the polishing member. 12. An apparatus for polishing a semiconductor wafer as claimed in claim 11, further comprising an engagement means for engaging the pressing member engages with the housing member, wherein the driving means supplies a rotation force to the pressing member to rotate the pressing member about its own axis. 13. An apparatus for polishing a semiconductor wafer as claimed in claim 9, wherein the elastic member is a silicone rubber. 14. An apparatus for polishing a semiconductor wafer as claimed in claim 13, wherein the silicone rubber has a hardness of Hs 40-60.