A wiring board manufacturing system, which is an electric wiring forming system, utilizes a magnesium alloy as a conductive metal for wiring pattern forming, and mixes and heats the magnesium alloy chips thereof in a cylinder (feeding unit) with a built-in screw, melting same into an alloy slurry of
A wiring board manufacturing system, which is an electric wiring forming system, utilizes a magnesium alloy as a conductive metal for wiring pattern forming, and mixes and heats the magnesium alloy chips thereof in a cylinder (feeding unit) with a built-in screw, melting same into an alloy slurry of a thixotropic state. The alloy slurry thereof is discharged onto a board. The board is mounted on a work stage of a stage unit, which is driven and controlled in accordance with wiring pattern data inputted by a CAD or the like, and a wiring pattern is formed on the board with the discharged alloy. According to this system, it is possible to provide an electric wiring forming system, which does away with the effects on the environment resulting from waste liquid at manufacturing, enables manufacturing time to be shortened, and moreover, uses an inexpensive metallic material for forming a wiring pattern.
대표청구항▼
A wiring board manufacturing system, which is an electric wiring forming system, utilizes a magnesium alloy as a conductive metal for wiring pattern forming, and mixes and heats the magnesium alloy chips thereof in a cylinder (feeding unit) with a built-in screw, melting same into an alloy slurry of
A wiring board manufacturing system, which is an electric wiring forming system, utilizes a magnesium alloy as a conductive metal for wiring pattern forming, and mixes and heats the magnesium alloy chips thereof in a cylinder (feeding unit) with a built-in screw, melting same into an alloy slurry of a thixotropic state. The alloy slurry thereof is discharged onto a board. The board is mounted on a work stage of a stage unit, which is driven and controlled in accordance with wiring pattern data inputted by a CAD or the like, and a wiring pattern is formed on the board with the discharged alloy. According to this system, it is possible to provide an electric wiring forming system, which does away with the effects on the environment resulting from waste liquid at manufacturing, enables manufacturing time to be shortened, and moreover, uses an inexpensive metallic material for forming a wiring pattern. the looping discs. 6. The device according to claim 5, wherein the detaching discs are arranged in an extension of predetermined looping elements. 7. The device according to claim 2, wherein the spreading conveyor includes a set of individual belts that are arranged divergently. 8. The device according to claim 7, wherein the number of individual belts corresponds substantially to a number of blocking elements. 9. The device according to claim 8, wherein the blocking elements penetrate between the individual belts. 10. The device according to claim 7, wherein mechanical means are provided to vary longitudinal speeds of the belts such that a travelling speed at any transverse point in the web is equal for all belts. 11. The device according to claim 2, further comprising a condensing device configured to condense the fibers or filaments arranged upstream the first set of looping discs and the first set of fixed looping elements. 12. The device according to claim 11, wherein the condensing device includes a second set of looping discs carried on a second common transverse shaft and driven in continuous rotation at a second speed and between which are arranged fixed looping elements forming a second set of looping elements, the second set of looping discs and the second set of fixed looping elements having the same predetermined gauge as the first set of looping discs and the first set of fixed looping elements, the rotation speed of the second set of looping discs being greater than that of the first set of looping discs.
Sackinger Philip A. ; Essien Marcelino ; Peebles Henry C. ; Schlienger Eric M., Apparatus for jet application of molten metal droplets for manufacture of metal parts.
Hayden Terry F. (Round Rock TX) Hicks Christopher A. (Austin TX) Ledermann Peter G. (Ossining NY) Nguyne Alvin D. (Austin TX) Steinbach Stephen C. (Austin TX) Yu Stanley K. (Austin TX), Solder placement nozzle with inert cover gas and inert gas bleed.
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Dozeman, Gary J.; Luten, Henry A.; Neuman, George A.; Tonar, William L.; Guarr, Thomas F.; Kloeppner, Leroy J.; Eaton, David L., Electro-optical element including metallic films and methods for applying the same.
Luten, Henry A.; Anderson, John S.; Forgette, Jeffrey A.; Neuman, George A., Thin-film coatings, electro-optic elements and assemblies incorporating these elements.
Neuman, George A.; Kar, Kevin B.; Anderson, John S.; Tonar, William L.; Cammenga, David J.; Dozeman, Gary J., Thin-film coatings, electro-optic elements and assemblies incorporating these elements.
Neuman, George A.; Tonar, William L.; Anderson, John S.; Forgette, Jeffrey A.; Cammenga, David J.; Luten, Henry A.; Frasher, Scott D., Thin-film coatings, electro-optic elements and assemblies incorporating these elements.
Tonar, William L.; Anderson, John S.; Forgette, Jeffrey A.; Neuman, George A.; Dozeman, Gary J.; Cammenga, David J.; Luten, Henry A.; Poe, G. Bruce; Brummel, Nelson F.; Perron, Lansen M., Thin-film coatings, electro-optic elements and assemblies incorporating these elements.
Tonar, William L.; Anderson, John S.; Forgette, Jeffrey A.; Neuman, George A.; Dozeman, Gary J.; Cammenga, David J.; Luten, Henry A.; Poe, G. Bruce; Brummel, Nelson F.; Perron, Lansen M., Thin-film coatings, electro-optic elements and assemblies incorporating these elements.
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