초록 ▼

A portable apparatus for displacing a manhole cover from a manhole where the manhole cover includes an engaging surface where the portable apparatus includes a leg having a first end and a second end and a shaft attached to the first end of the leg such that the leg and the shaft define a fulcrum po

A portable apparatus for displacing a manhole cover from a manhole where the manhole cover includes an engaging surface where the portable apparatus includes a leg having a first end and a second end and a shaft attached to the first end of the leg such that the leg and the shaft define a fulcrum point for the device. A tool is attached to the engaging portion wherein the tool engages the engaging surface of the manhole cover.

대표청구항 ▼

A portable apparatus for displacing a manhole cover from a manhole where the manhole cover includes an engaging surface where the portable apparatus includes a leg having a first end and a second end and a shaft attached to the first end of the leg such that the leg and the shaft define a fulcrum po

A portable apparatus for displacing a manhole cover from a manhole where the manhole cover includes an engaging surface where the portable apparatus includes a leg having a first end and a second end and a shaft attached to the first end of the leg such that the leg and the shaft define a fulcrum point for the device. A tool is attached to the engaging portion wherein the tool engages the engaging surface of the manhole cover. still effective, said over lap being due to manufacturing misalignment or deliberate design. 15. The valve of claim 8 wherein the amount of liquid is carefully controlled so that the liquid only blocks the flow of fluid when the diaphragms are adjacent. 16. The valve of claim 7 wherein the liquid is water or other suitable material having a high surface tension. 17. The valve of claim 9 where the size of the holes and the surface tension of the liquid between the diaphragms is carefully controlled to make the valve open and close at specific pressure. 18. The valve of claim 10 wherein the conductors comprise metal such as aluminum or gold. 19. The valve of claim 10 wherein the insulators are thin films selected from a class consisting of silicon nitride or silicon dioxide or glass or thin films of plastic or epoxy. 20. The valve of claim 6 wherein the diaphragms are made of single crystal silicon. 21. The valve of claim 6 wherein the diaphragms are made of material that has been deposited on a silicon wafer. 22. The valve of claim 6 wherein the diaphragms are made of plastic. 23. The valve of claim 7 wherein the first and second diaphragms are made of epoxy. 24. The valve of claim 6 wherein the holes in the diaphragms are photolithographically defined. 25. The valve of claim 6 wherein the separation between the diaphragms is controlled with an electrostatic force. 26. The valve of claim 6 wherein the separation between the diaphragms is controlled with a magnetic force. 27. The valve of claim 6 wherein the separation between the diaphragms is controlled with a piezoelectric force. 28. The valve of claim 6 wherein the separation between the diaphragms is controlled with force generated by thermal expansion. 29. The valve of claim 6 wherein the separation between the diaphragms is generated by a bimorph. 30. The valve of claim 29 wherein the bimorph is actuated with a piezoelectric force. 31. The valve of claim 29 wherein the bimorph is actuated with a thermally generated force. 32. The valve of claim 6 wherein the separation between the diaphragms is controlled by generating a bubble. 33. The valve of claim 32 wherein the bubble is generated thermally. 34. The valve of claim 32 wherein the bubble is generated by electrolysis. 35. The valve of claim 6 wherein the diaphragms are designed such that the fluid pressure exerted on the valve distends both diaphragm at approximately equal amounts. 36. The valve of claim 30 wherein the diaphragms are designed so that small forces can open and close the valve even though large pressures have been applied to the valve. 37. The valve of claim 6 wherein there are three or more diaphragms. 38. The valve of claim 6 wherein the diaphragms have an undulating shape. 39. The method of claim 6 wherein the diaphragms are made of a material that can change its material properties. 40. The valve of claim 39 wherein the diaphragms change their Young's modulus of elasticity to effect the opening and closing of the valve. 41. The valve of claim 39 wherein the diaphragms are made of a material that changes its dimensions when excited by an external agent. 42. The valve of claim 41 wherein the diaphragms are made of a piezoelectric material that changes its dimensions when excited with an electric field. 43. The valve of claim 41 wherein the diaphragms are made of a magnetorestrictive material that changes its dimensions when excited with a magnetic field. 44. The valve of claim 6 wherein the diaphragms are made of a Shape Memory Alloy material that changes dimensions when heated or cooled. 45. The valve of claim 6 wherein one or both of the diaphragms have several stable mechanical configurations, and can be mechanically switched between these mechanically stable configurations to effect the opening and closing of the valve. 46. The valve of claim 6 wherein two valves are used to make a pump. 47. The valve of claim 46 wherein the two valves are connected to a variable chamber. 48. The valve of claim 47 wherein the variable chamber is acted upon by a force that changes the volume of the chamber. 49. The valve of claim 48 wherein the valves open and close in such a manner to enable the pumping of the fluid. 50. The valve of claim 48 wherein the valves open and close in such a manner to enable the pressurizing of the fluid. 51. The valve of claim 48 wherein the force is electrostatic. 52. The valve of claim 48 wherein the force is magnetic. 53. The valve of claim 48 wherein the force is piezoelectric. 54. The valve of claim 48 wherein the force is thermally generated. 55. The valve of claim 48 wherein the force is generated by a Shape Memory Actuator. 56. The valve of claim 48 wherein the force is generated by boiling a liquid. 57. The valve of claim 48 wherein the force is generated by accelerations of the valve assembly. 58. The valve of claim 48 wherein the force is generated by changes in ambient pressure. 59. The valve of claim 6 wherein the diaphragms and associated holes are defined photolithographically. 60. The valve of claim 6 wherein the diaphragms are made using silicon surface micromachining. 61. The valve of claim 6 wherein the diaphragms are made using silicon bulk micromachining. 62. The valve of claim 6 wherein the diaphragms are made using plating technology. 63. The valve of claim 6 wherein the diaphragms are made using molding technology. 64. The valve of claim 6 wherein the diaphragms are made using Electro Discharge Machining. 65. The valve of claim 6 wherein the diaphragms are made by depositing layers containing a solvent that evaporates. 66. A method of controlling fluid flow comprising the steps of: providing a first diaphragm having a first conductor and a first set of holes; providing a second diaphragm having a second conductor and second set of holes that are offset relative to the first set of holes, the second diaphragm being in opposed spaced relation to the first diaphragm to form a channel; and supplying pressurized fluid to the first diaphragm; applying a voltage to the diaphragms to generate an electrostatic force which cause the diaphragms to move together in close proximity, wherein the fluid flow through the diaphragm is impeded due to the close proximity of the diaphragms; supplying pressure between the diaphragms to cause the diaphragms to retract from each other, enabling fluid flow through the diaphragms. 67. The method of claim 66 further comprising the step of inserting liquid between the first and second diaphragms. 68. A method of making a diaphragm comprising the steps of: providing a wafer having a first surface and a second surface; oxidizing the wafer and applying a layer of photoresist to the first and second surfaces; applying a mask to the first and second surfaces and etching away the photoresist from the first and second surfaces to creates a plurality of openings; diffusing resistant material into the first surface to create an etchant impermeable layer along the first surface; the first surface only being diffused where the where the photoresist is etched away; depositing a conductive layer over the layer of photoresist on the first surface; applying a second layer of photoresist on the conductive layer; etching the a central region of the wafer and the first surface with an etchant to produce a cavity that extends from the second surface to the interior of the first surface to form a diaphragm having a plurality of holes therein, the diaphragm comprising the conductive layer and the second layer of photoresist.