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An apparatus for controlling performance of a fluid machinery by controlling rotational speed of the fluid machinery. A performance regulating device for the fluid machinery includes a frequency converter, a casing for housing the frequency converter so as to ensure being airtight against an atmosph

An apparatus for controlling performance of a fluid machinery by controlling rotational speed of the fluid machinery. A performance regulating device for the fluid machinery includes a frequency converter, a casing for housing the frequency converter so as to ensure being airtight against an atmosphere, an input, and an output connected to the casing so as to ensure being airtight against the atmosphere.

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An apparatus for controlling performance of a fluid machinery by controlling rotational speed of the fluid machinery. A performance regulating device for the fluid machinery includes a frequency converter, a casing for housing the frequency converter so as to ensure being airtight against an atmosph

An apparatus for controlling performance of a fluid machinery by controlling rotational speed of the fluid machinery. A performance regulating device for the fluid machinery includes a frequency converter, a casing for housing the frequency converter so as to ensure being airtight against an atmosphere, an input, and an output connected to the casing so as to ensure being airtight against the atmosphere. ing tool for manipulating a semiconductor wafer as recited in claim 11, wherein said aligner comprises a chuck capable of supporting a first semiconductor wafer and a buffer paddle capable of supporting a second semiconductor wafer while said chuck supports said first semiconductor wafer. 13. A processing tool for manipulating a semiconductor wafer, comprising: an environment comprising a modular section having two, side-by-side load port assemblies, the environment being capable of expanding to comprise two modular sections having three, side-by-side load port assemblies; and a single wafer handling robot capable of transferring the semiconductor wafer between any load port assembly of said environment regardless of whether the number of modular sections of said environment is one or two. 14. A processing tool for manipulating a semiconductor wafer, comprising: a first environment formed of a first modular section including at least two, side-by-side load port assemblies; a second environment formed of a second modular section including at least two, side-by-side load port assemblies; a connector for connecting said first and second environments; and a wafer handling robot capable of transferring a semiconductor wafer between any load port assembly of said first and second environments when connected by said connector. 15. A processing tool for manipulating a semiconductor wafer as recited in claim 14, wherein said wafer handling robot comprises a first wafer handling robot in said first environment capable of transferring the semiconductor wafer between said at least two load port assemblies in said first environment and at least one of said at least two load port assemblies in said second environment when said second environment is connected to said first environment. 16. A processing tool for manipulating a semiconductor wafer as recited in claim 15, farther comprising a second wafer handling robot in said second environment capable of transferring the semiconductor wafer between said at least two load port assemblies in said second environment and at least one of said at least two load port assemblies in said first environment. 17. A processing tool for manipulating a semiconductor wafer as recited in claim 16, further comprising a first controller for controlling components in said first environment. 18. A processing tool for manipulating a semiconductor wafer as recited in claim 17, further comprising a second controller for controlling components is said second environment. 19. A processing tool for manipulating a semiconductor wafer as recited in claim 18, further comprising a first graphical user interface associated with said first controller for allowing information to be transferred to and from said first controller. 20. A processing tool for manipulating a semiconductor wafer as recited in claim 19, further comprising a second graphical user interface associated with said second controller for allowing information to be transferred to and from said second controller. 21. A processing tool for manipulating a semiconductor wafer as recited in claim 16, further comprising a controller for controlling components in said first and second environments. 22. A processing tool for manipulating a semiconductor wafer as recited in claim 14, further comprising a first aligner in said first environment. 23. A processing tool for manipulating a semiconductor wafer as recited in claim 22, further comprising a second aligner in said second environment. 24. A stand alone processing tool for manipulating semiconductor wafers, comprising: an environment having a volume and being defined by one or more one modular sections each having at least one load port assembly capable of presenting a semiconductor wafer to the environment, the volume of said environment depending on the number of modular sections defining the environment; and at least one wafer handling tool within said environment capable of transferring a s