초록 ▼

An expandable intervertebral implant for stabilizing adjacent vertebrae includes first and second opposed and operatively connected shells. Each one of the shells has a plurality of engaging members that are interdigitated with a corresponding plurality of engaging members of another of the shells.

An expandable intervertebral implant for stabilizing adjacent vertebrae includes first and second opposed and operatively connected shells. Each one of the shells has a plurality of engaging members that are interdigitated with a corresponding plurality of engaging members of another of the shells. The implant also includes at least one extrusion opening and a cavity for containing osteogenic material. As one shell is moved relative to the other shell with a threaded actuator operatively connecting the shells, a volume of the cavity decreases and osteogenic material is extruded through the extrusion opening. A cross section of the implant at one or both ends thereof has a curvalinear shoulder for improved support of the vertebrae during bony growth and fusion of the vertebrae.

대표청구항 ▼

An expandable intervertebral implant for stabilizing adjacent vertebrae includes first and second opposed and operatively connected shells. Each one of the shells has a plurality of engaging members that are interdigitated with a corresponding plurality of engaging members of another of the shells.

An expandable intervertebral implant for stabilizing adjacent vertebrae includes first and second opposed and operatively connected shells. Each one of the shells has a plurality of engaging members that are interdigitated with a corresponding plurality of engaging members of another of the shells. The implant also includes at least one extrusion opening and a cavity for containing osteogenic material. As one shell is moved relative to the other shell with a threaded actuator operatively connecting the shells, a volume of the cavity decreases and osteogenic material is extruded through the extrusion opening. A cross section of the implant at one or both ends thereof has a curvalinear shoulder for improved support of the vertebrae during bony growth and fusion of the vertebrae. contact structures in substantially the same plane, the plane being substantially parallel to a surface of the electronic component. 2. The method of claim 1, further comprising disposing the tip components of each of the two microelectronic contact structures a first distance in a direction substantially parallel to the electronic component away from one another, and disposing the post components of each of the two microelectronic contact structures a second distance in the same direction away from one another, wherein the first distance is less than the second distance. 3. The method according to claim 1, wherein the fabricating a beam component step further comprises: depositing a layer of masking material on a substrate; forming an opening in the layer of masking material; and depositing at least one layer of a metallic material in the opening, thereby defining a beam component in the opening. 4. The method of claim 1, wherein the providing a post component step further comprises the steps of: fabricating the post component on a sacrificial substrate; joining the post component to the electronic component; and removing the sacrificial substrate. 5. The method of claim 1, wherein the fabricating a beam component step further comprises the steps of: fabricating the beam component on a sacrificial substrate prior to the step of joining the beam component to the post component; and removing the sacrificial substrate from the beam component after the step of joining the beam component to the post component. 6. The method of claim 1, wherein the fabricating a tip component step further comprises the steps of: fabricating the tip component on a sacrificial substrate prior to the step of joining the tip component to the beam component, the tip component comprising at least one pointed tip feature and a standoff base attached to the pointed tip feature; and removing the sacrificial substrate from the tip component after the step of joining the tip component to the beam component. 7. The method of claim 6, wherein the disposing the tip components step further comprises disposing the pointed tip features of each of the two microelectronic contact structures in the substantially the same plane. 8. In combination with an electronic component, a first contact structure and a second contact structure, each of the contact structures comprising: a post component substantially perpendicular to the electronic component; a beam component joined to the post component; and a tip component joined to the beam component; wherein a portion of the beam component of one of the contact structures is disposed over the beam component of the other contact structure, wherein the tip component of the first contact structure is positioned a first distance in a direction substantially parallel to the electronic component away from the tip component of the second contact structure, the post component of the first contact structure is positioned a second distance in the same direction away from the post component of the second contact structure, and the first distance is not equal to the second distance. 9. The first and second contact structures of claim 8, wherein the beam component of each of the contact structures further comprises a metallic material deposited by a method selected from electroplating, electroless plating, sputtering, physical vapor deposition, and chemical vapor deposition. 10. The first and second contact structures of claim 8, wherein the beam component of the first contact structure is disposed at a substantially different height from a surface of the electronic component than the beam component of the second, contact structure, and the tip components of each of the first and the second contact structures are disposed in substantially the same plane, the plane being substantially parallel to a surface of the electronic component. 11. The first and second contact structures of claim 8, wherein the fi rst distance is substantially less than the second distance. 12. The contact structures according to claim 8, wherein the post component is joined to the electronic component. 13. The contact structures according to claim 8, wherein the electronic component further comprises a first terminal and a second terminal, and wherein the post component of the first contact structure is joined to the first terminal and the post component of the second contact structure is joined to the second terminal. 14. The contact structures according to claim 8, wherein the post component of the first contact structure and the post component of the second contact structure are built up upon the electronic component. 15. The contact structures according to claim 8, wherein the tip component comprises at least one pointed tip feature and a standoff base interposed between the at least one pointed tip feature and the beam component. nward in predetermined increments to allow alternate closing and opening of the vent ports, 2.) a camming sleeve and Bellville spring washers which provide the surge reduction tool with a more predictable release pressure than has heretofore been available, 3.) a dart directing sleeve which has a smaller, smoother bore than the drill string and provides the important function of aligning the dart before it lands in the seat so that the dart resistance when passing through the seat is minimized, and 4.) chevron seals arranged in the housing above and below the vent port which reduces the potential for hydraulic lock and provides a seal mechanism that is more reliable while running in downhole conditions.