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Apparatus and method for semiconductor wafer test yield enhancement

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
  • G06F-019/00
출원번호 US-0124125 (2002-04-17)
발명자 / 주소
  • Castrucci, Paul
대리인 / 주소
    AKC Patents
인용정보 피인용 횟수 : 42  인용 특허 : 3

초록

An improved semiconductor wafer processing system includes defect detection equipment and defect eradication equipment. The defect eradication equipment is a supercritical fluid cleaning apparatus. The defect detection equipment creates a record for each wafer indicating defect identification and ch

대표청구항

An improved semiconductor wafer processing system includes defect detection equipment and defect eradication equipment. The defect eradication equipment is a supercritical fluid cleaning apparatus. The defect detection equipment creates a record for each wafer indicating defect identification and ch

이 특허에 인용된 특허 (3)

  1. Rose Peter H. ; Sferlazzo Piero ; van der Heide Robert G., Aerosol surface processing.
  2. Douglas Monte A. ; Templeton Allen C., Method of removing inorganic contamination by chemical alteration and extraction in a supercritical fluid media.
  3. Mullee William H. ; de Leeuwe Marc ; Roberson ; Jr. Glenn A., Removal of CMP residue from semiconductors using supercritical carbon dioxide process.

이 특허를 인용한 특허 (42)

  1. Castrucci, Paul P., Apparatus and method for semiconductor wafer cleaning.
  2. Yokomizo,Kenji, Apparatus and method of securing a workpiece during high-pressure processing.
  3. Bhaskar,Kris; Liang,Ardis; Van Riet,Michael J., Apparatus and methods for analyzing defects on a sample.
  4. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of a workpiece.
  5. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.
  6. Clark, Shan C.; Ramachandrarao, Vijayakumar S.; Turkot, Jr., Robert B., Cleaning residues from semiconductor structures.
  7. Korzenski,Michael B.; Xu,Chongying; Baum,Thomas H.; Minsek,David; Ghenciu,Eliodor G., Compositions and methods for high-efficiency cleaning/polishing of semiconductor wafers.
  8. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
  9. Colburn, Matthew E.; Shneyder, Dmitriy; Siddiqui, Shahab, Development or removal of block copolymer or PMMA-b-S-based resist using polar supercritical solvent.
  10. Colburn,Matthew E.; Shneyder,Dmitriy; Siddiqui,Shahab, Development or removal of block copolymer or PMMA-b-S-based resist using polar supercritical solvent.
  11. Sheydayi,Alexei; Sutton,Thomas, Gate valve for plus-atmospheric pressure semiconductor process vessels.
  12. Sutton, Thomas R.; Biberger, Maximilan A., High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism.
  13. Jones, William D., High pressure fourier transform infrared cell.
  14. Biberger, Maximilian A.; Layman, Frederick Paul; Sutton, Thomas Robert, High pressure processing chamber for semiconductor substrate.
  15. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.
  16. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  17. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  18. Sheydayi,Alexei, Method and apparatus for clamping a substrate in a high pressure processing system.
  19. Goshi,Gentaro, Method and apparatus for cooling motor bearings of a high pressure pump.
  20. Bode,Christopher A.; Pasadyn,Alexander J.; Toprac,Anthony J.; Hewett,Joyce S. Oey; Peterson,Anastasia Oshelski; Sonderman,Thomas J.; Miller,Michael L., Method and apparatus for initializing tool controllers based on tool event data.
  21. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.
  22. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
  23. Parent,Wayne M., Method and system for determining flow conditions in a high pressure processing system.
  24. Parent, Wayne M.; Geshell, Dan R., Method and system for passivating a processing chamber.
  25. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
  26. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
  27. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.
  28. Elliott, David J.; Millman, Jr., Ronald P.; Tardif, Murray; Aiello, Krista, Method for surface cleaning.
  29. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
  30. Sheydayi,Alexei, Non-contact shuttle valve for flow diversion in high pressure systems.
  31. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.
  32. Wuester,Christopher D., Process flow thermocouple.
  33. Korzenski, Michael B.; Baum, Thomas H.; Xu, Chongying; Ghenciu, Eliodor G., Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations.
  34. Korzenski,Michael B.; Baum,Thomas H.; Xu,Chongying; Ghenciu,Eliodor G., Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations.
  35. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  36. Toth, Gabor D.; Bakker, David R., Single tool defect classification solution.
  37. Ramachandrarao,Vijayakumar S., Supercritical carbon dioxide-based cleaning of metal lines.
  38. Roeder,Jeffrey F.; Baum,Thomas H.; Healy,Matthew; Xu,Chongying, Supercritical fluid-based cleaning compositions and methods.
  39. Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.
  40. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
  41. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.
  42. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.
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