초록 ▼

The apparatus of this invention is utilized for mounting a wind turbine on the upper end of a wind turbine tower. The invention also relates to the method of erecting the same. The tower is provided with a pair of guide rails positioned on opposite sides thereof which extend from the lower end to th

The apparatus of this invention is utilized for mounting a wind turbine on the upper end of a wind turbine tower. The invention also relates to the method of erecting the same. The tower is provided with a pair of guide rails positioned on opposite sides thereof which extend from the lower end to the upper end of the tower. A sled is movably mounted on the guide rails and has a platform mounted thereon which is adapted to support the wind turbine thereon. In one form of the invention, the sled is self-contained in that it has an engine and a winch mounted thereon. In another form of the invention, the winch and engine are mounted on a self-propelled vehicle which is designed to transport the sled from one tower location to another. In another form of the invention, the winch is detachable from the self-propelled vehicle so that the winch may be anchored to the ground. When the wind turbine has been positioned at the upper end of the tower, a horizontally slidable platform moves the wind turbine from the sled to the upper end of the tower so that the wind turbine may be secured to the upper end of the tower.

대표청구항 ▼

The apparatus of this invention is utilized for mounting a wind turbine on the upper end of a wind turbine tower. The invention also relates to the method of erecting the same. The tower is provided with a pair of guide rails positioned on opposite sides thereof which extend from the lower end to th

The apparatus of this invention is utilized for mounting a wind turbine on the upper end of a wind turbine tower. The invention also relates to the method of erecting the same. The tower is provided with a pair of guide rails positioned on opposite sides thereof which extend from the lower end to the upper end of the tower. A sled is movably mounted on the guide rails and has a platform mounted thereon which is adapted to support the wind turbine thereon. In one form of the invention, the sled is self-contained in that it has an engine and a winch mounted thereon. In another form of the invention, the winch and engine are mounted on a self-propelled vehicle which is designed to transport the sled from one tower location to another. In another form of the invention, the winch is detachable from the self-propelled vehicle so that the winch may be anchored to the ground. When the wind turbine has been positioned at the upper end of the tower, a horizontally slidable platform moves the wind turbine from the sled to the upper end of the tower so that the wind turbine may be secured to the upper end of the tower. semiconductor package of claim 4, wherein the solder ball contact pad comprises a concave surface for accommodating the solder ball. 6. The ball grid array semiconductor package of claim 1, wherein the at least one first circuit trace and the at least one second circuit trace are contained within a portion of a tape disposed on the at least one of the first and the second surfaces of the substrate. 7. The ball grid array semiconductor package of claim 1, wherein the semiconductor device is attached to the first surface of the substrate and the at least one substrate bond pad and the at least one intermediately positioned connective element are located on the second surface of the substrate. 8. The ball grid array semiconductor package of claim 1, wherein the semiconductor device and the at least one intermediately positioned connective element is attached to the first surface and the at least one substrate bond pad is located on the second surface. 9. The ball grid array semiconductor package of claim 8, wherein at least one of the at least one first circuit trace and the at least one second circuit trace extends through the substrate. 10. The ball grid array semiconductor package of claim 8, wherein at least one of the at least one first circuit trace and the at least one second circuit trace is laminated within the substrate. 11. The ball grid array semiconductor package of claim 1, wherein the at least one test pad comprises a plurality of test pads arranged in a preselected pattern adapted for being contacted by test probes arranged in a pattern complementary to the preselected pattern of the plurality of test pads, the at least one intermediately positioned connective element comprises a plurality of connective elements arranged in a preselected grid array, and the at least one first circuit trace and the at least one second circuit trace comprise a plurality of such circuit traces correspondingly electrically connecting respective substrate bond pads, connective elements and test pads. 12. The ball grid array semiconductor package of claim 11, wherein the preselected pattern of the plurality of test pads comprises a thin small outline package pin-out pattern. 13. The ball grid array semiconductor package of claim 12, wherein each of the plurality of connective elements are spaced from each other at a preselected pitch and comprise solder balls and solder ball accommodating contact pads. 14. The ball grid array semiconductor package of claim 1, further comprising an encapsulant disposed over the aperture of the substrate and encapsulating the at least one bond pad of the plurality of bond pads of the semiconductor device, the at least one substrate bond pad, and the at least one bond wire. 15. The ball grid array semiconductor package of claim 1, wherein the at least one intermediately positioned connective element comprises a plurality of connective elements located on both the first surface and the second surface of the substrate and wherein at least one of the plurality of connective elements located on the at least one of the first surface and the second surface being adapted to accommodate a connective element of another ball grid array semiconductor package in a stacked arrangement. 16. A stackable reduced profile ball grid array semiconductor package comprising: a substrate of a preselected cross-sectional thickness having a first surface, a second surface, and an aperture extending from the first surface through the substrate to the second surface, a plurality of substrate bond pads located on the first surface proximate to the aperture; a plurality of connective elements located on the second surface of the substrate, each of the plurality of connective elements extending an approximate preselected distance from the second surface and being arranged in a preselected grid array pattern having at least one preselected pitch dimension between adjacent connective elements; a semiconductor device having an activ